Volume 85; Issue 9

Microelectronic Engineering

Volume 85; Issue 9

1

Performance characterization of III–V power devices

A. Stopel, M. Leibovitch, Yoram Shapira

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 677 KB

english, 2008

2

Microstructuring of SU-8 photoresist by UV-assisted thermal imprinting with non-transparent mold

Sung-Won Youn, Akihisa Ueno, Masaharu Takahashi, Ryutaro Maeda

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 2.26 MB

english, 2008

3

Recovery of negative bias temperature instability induced degradation of p-MOSFETs with SiON gate dielectric

Y.D. Kim, S.U. Han, H.S. Kang, B.K. Kang

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 280 KB

english, 2008

4

Study on the frequency dependence of electrical and dielectric characteristics of Au/SnO2/n-Si (MIS) structures

A. Tataroğlu, Ş. Altındal

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 216 KB

english, 2008

5

Finite element analysis of low temperature thermal nanoimprint lithography using a viscoelastic model

Nam Woong Kim, Kug Weon Kim, Hyo-Chol Sin

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 814 KB

english, 2008

6

In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding

A. Shah, M. Mayer, Y. Zhou, S.J. Hong, J.T. Moon

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 959 KB

english, 2008

7

Microlenses fabricated by discontinuous dewetting and soft lithography

Xinhong Yu, Zhe Wang, Yanchun Han

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 801 KB

english, 2008

8

The effect of blocking layer of Al2O3 on thermal stability and electrical properties of HfO2 dielectric films deposited on SiGe layer

Xinhong Cheng, Dawei He, Zhaorui Song, Yuehui Yu, DaShen Shen

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 409 KB

english, 2008

9

Frequency and gate voltage effects on the dielectric properties of Au/SiO2/n-Si structures

İlbilge Dökme, Şemsettin Altındal, Muharrem Gökçen

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 295 KB

english, 2008

10

Effect of strain-temperature stress on MOS structure with ultra-thin gate oxide

Chia-Nan Lin, Yi-Lin Yang, Wei-Ting Chen, Shang-Chih Lin, Kai-Chieh Chuang, Jenn-Gwo Hwu

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 872 KB

english, 2008

11

The influence of stamp deformation on residual layer homogeneity in thermal nanoimprint lithography

S. Merino, A. Retolaza, A. Juarros, H. Schift

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 1.83 MB

english, 2008

12

Parallel angle resolved XPS investigations on 12 in. wafers for the study of W and WSix oxidation in air

B. Pelissier, A. Beaurain, J.P. Barnes, R. Gassilloud, F. Martin, O. Joubert

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 420 KB

english, 2008

13

Effect of titanium dioxide (TiO2) seed layer on the phase composition of 0.7Pb (Mg1/3Nb2/3)O3–0.3PbTiO3 film prepared by pulsed laser deposition

J.M. Wang, W.L. Li, C.Q. Liu, W.D. Fei

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 673 KB

english, 2008

14

The use of high glass temperature polymers in the production of transparent, structured surfaces using nanoimprint lithography

Christopher A. Mills, Javier G. Fernandez, Abdelhamid Errachid, Josep Samitier

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 942 KB

english, 2008

15

A method to determine the sweep resistance of wire bonds for microelectronic packaging

Huang-Kuang Kung, Yun-Ping Sun, Jeng-Nan Lee, Hung-Shyong Chen

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 507 KB

english, 2008

16

Inside Front Cover - Editorial Board

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 58 KB

english, 2008