Volume 39; Issue 4

Microelectronics Reliability

Volume 39; Issue 4

1

Development of test vehicles for evaluating plastic-encapsulant reliability and improving thermal conductivity of encapsulant materials

Leonard R Enlow, Dale W Swanson, Christine M Naito

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 312 KB

english, 1999

2

Process characterisation of hot-carrier-induced β degradation in bipolar transistors for BiCMOS

A. Arshak, D. McDonagh, K.I. Arshak, D. Doyle, I. Harrow

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 159 KB

english, 1999

3

Threshold voltage model for deep-submicron fully depleted SOI MOSFETs with back gate substrate induced surface potential effects

Mohamed A Imam, Mohamed A Osman, Ashraf A Osman

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 206 KB

english, 1999

4

Additional microstructural analysis on the samples examined in the paper ‘Are high resolution resistometric methods really useful for the early detection of electromigration damage?’

R. Balboni, I. de Munari, M. Impronta, A. Scorzoni

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 154 KB

english, 1999

5

Book review

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 78 KB

english, 1999

6

Single transistor technique for interface trap density measurement in irradiated MOS devices

V.S Pershenkov, S.V Cherepko, R.E Ivanov, A.V Shalnov, V.V Abramov

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 200 KB

english, 1999

7

Physical structure of light-emitting porous polycrystalline silicon thin films

P.G Han, H Wong, M.C Poon

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 168 KB

english, 1999

8

Slow-trap profiling of NO and N2O nitrided oxides grown on Si and SiC substrates

Sima Dimitrijev, Philip Tanner, H.Barry Harrison

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 268 KB

english, 1999

9

Voltage transients in electromigration noise measurement data

L.M Head, C Fahrenkrug

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 173 KB

english, 1999

10

A simulation-based semiconductor chip yield model incorporating a new defect cluster index

Chi-Hyuck Jun, Yushin Hong, Soo Young Kim, Kwang-Su Park, Hangyeob Park

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 164 KB

english, 1999

11

Erratum

Journal:

Microelectronics Reliability

Year:

1999

File:

PDF, 85 KB

1999

12

Stress-induced voiding in stacked tungsten via structure

Shinichi Domae, Ryuji Eto, Keiji Okuma

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 194 KB

english, 1999

13

Chip Scale Package (CSP) solder joint reliability and modeling

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 371 KB

english, 1999

14

A model of 1/f noise spectrum generation in granular structures

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 100 KB

english, 1999

15

Book review

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 73 KB

english, 1999

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