Fundraising September 15, 2024 – October 1, 2024 About fundraising

Volume 812

MRS Proceedings

Volume 812

1

MEMS Metallization

Lohmann, Christian, Gottfried, Knut, Bertz, Andreas, Reuter, Danny, Hiller, Karla, Kuhn, Michael, Gessner, Thomas

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 897 KB

english, 2004

2

Optical Interconnect Components for Wafer Level Heterogeneous Hyper-Integration

Persans, P. D., Ojha, M., Gutmann, R. J., Lu, J.-Q., Filin, A., Plawsky, J.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 468 KB

english, 2004

3

Anisotropic Elastic Properties of Low-k Dielectric Materials

Maznev, A.A., Mazurenko, A., Alper, G., Moore, C.J.L., Gostein, M., Schulberg, Michelle T., Humayun, Raashina, Sengupta, Archita, Sun, Jia-Ning

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 226 KB

english, 2004

4

Thermal Conductivity of Carbon Nanotube Composite Films

Ngo, Quoc, Cruden, Brett A., Cassell, Alan M., Walker, Megan D., Ye, Qi, Koehne, Jessica E., Meyyappan, M., Li, Jun, Yang, Cary Y.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 1.24 MB

english, 2004

5

Ruthenium Sputter Deposition on Organosilicate Glass and on Paralyne: an XPS Study of Interfacial Chemistry, Nucleation and Growth

Zhao, X., Magtoto, N.P., Kelber, J. A.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 166 KB

english, 2004

6

Effect of Surface Chemistry on the diffusion of Copper in nanoporous dielectrics

Rodriguez, Oscar, Cho, Woojin, Saxena, Ravi, Achanta, Ravi, Gill, William N., Plawsky, Oel L

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 59 KB

english, 2004

7

Atomic Layer Deposition of Tantalum Nitride on Organosilicate and Organic Polymerbased Low Dielectric Constant Materials

Straten, Oscar van der, Zhu, Yu, Rullan, Jonathan, Topol, Katarzyna, Dunn, Kathleen, Kaloyeros, Alain

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 289 KB

english, 2004

8

Electrical Behavior of Nano-Scaled Interconnects

Engelhardt, M., Schindler, G., Steinhögl, W., Steinlesberger, G., Traving, M.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 302 KB

english, 2004

9

Reliability of Dielectric Barrier Films in Copper Damascene Applications

Lee, Albert S., Lakshmanan, Annamalai, Rajagopalan, Nagarajan, Cui, Zhenjiang, Le, Maggie, Xia, Li Qun, Kim, Bok Heon, M'Saad, Hichem

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 258 KB

english, 2004

10

Nucleation and Growth Dependence of ALD WNC on Substrate Surface Condition

Abell, Thomas, Schuhmacher, Jörg, Travaly, Youssef, Maex, Karen

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 79 KB

english, 2004

11

Pulsed MOCVD of Cu Seed Layer using a (Hfac)Cu(3,3-Dimethyl-1-Butene) Source Plus H2 Reactant

Park, Jaebum, Yang, Heejung, Lee, Jaegab

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 620 KB

english, 2004

12

Structural and functional characterization of W-Si-N sputtered thin films for copper metallizations

Vomiero, Alberto, Frabboni, Stefano, Marchi, Enrico Boscolo, Quaranta, Alberto, Mea, Gianantonio Della, Mariotto, Gino, Felisari, Laura

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 578 KB

english, 2004

13

Cross-Section Nano-Indentation for Rapid Adhesion Evaluation

Brongersma, S. H., Degryse, Dominiek, Souiller, Jerome, Vandevelde, Bart, Maex, K.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 433 KB

english, 2004

14

The Influence of Temperature and Concentration on Copper Deposition Kinetics in Supercritical Carbon Dioxide

Zong, Yinfeng, Watkins, James J.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 147 KB

english, 2004

15

Dry Etch and Wet Clean Process Characterization of Ultra Low-k (ULK) Material Nanoglass®E

Murthy, B. Ramana, Chang, C.K., Ahilakrishnamoorthy,, Chen, Y.W., Naman, Ananth

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 793 KB

english, 2004

16

Free-standing line patterns of nanocrystalline electrodeposits

Pantleon, Karen, Jensen, Henrik Myhre, Somers, Marcel A.J.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 95 KB

english, 2004

17

Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy

Wimplinger, M., Lu, J.-Q., Yu, J., Kwon, Y., Matthias, T., Cale, T.S., Gutmann, R.J.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 432 KB

english, 2004

18

Stressmigration studies on dual damascene Cu/oxide and Cu/low k interconnects

Baek, Won-Chong, Ho, Paul. S., Lee, Jeong Gun, Hwang, Sung Bo, Choi, Kyeong-Keun, Maeng, Jong Sun

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 427 KB

english, 2004

19

New hybrid low-k dielectric materials prepared by vinylsilane polymerization

Kang, Jung-Won, Kim, Byung Ro, Kang, Gwi-Gwon, Moon, Myung-Sun, Choi, Bum-Gyu, Ko, Min-Jin

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 97 KB

english, 2004

20

Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation

Zschech, Ehrenfried, Meyer, Moritz A., Langer, Eckhard

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 298 KB

english, 2004

21

Self-Assembled Monolayers as Model Substrates for Atomic Layer Deposition

Whelan, Caroline M., Demas, Anne-Cécile, Schuhmacher, Jörg, Carbonell, Laureen, Maex, Karen

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 100 KB

english, 2004

22

Novel Epoxy Siloxane Polymer as Low-K Dielectric

Wang, Pei-I, Juneja, Jasbir S., Murarka, Shyam, Lu, Toh –Ming, Ghoshal, Ram, Ghoshal, Rajat

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 183 KB

english, 2004

23

3-dimensional evaluation of nm-pores in porous low-k films using TEM stereoscopic / electron tomographic observation method

Shimanuki, J., Inoue, Y., Shimada, M., Ogawa, S.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 254 KB

english, 2004

24

Processing damage and electrical performance of porous dielectrics in narrow spaced interconnects

Iacopi, F., Travaly, Y., Stucchi, M., Struyf, H., Peeters, S., Jonckheere, R., Leunissen, L.H.A., Tökei, Zs., Sutcliffe, V., Richard, O., Hove, M.Van, Maex, K.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 442 KB

english, 2004

25

Repair of Porous Methylsilsesquioxane Films using Supercritical Carbon Dioxide

Xie, Bo, Muscat, Anthony J.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 112 KB

english, 2004

26

Thermal Stability and Electrical Properties of Ag(Al) Metallization

Kim, Hyunchul C., Theodore, N. David, Mayer, James W., Alford, Terry L.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 148 KB

english, 2004

27

Effect of Mode-Mixity and Porosity on Interfacial Fracture of Low-k Dielectrics

Merrill, Caroline C., Ho, Paul S.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 441 KB

english, 2004

28

Supercritical CO2 Treatments for Semiconductor Applications

Gangopadhyay, S., Lubguban, J.A., Lahlouh, B., Sivaraman, G., Biswas, K., Rajagopalan, T., Biswas, N., Kim, H. -C., Volksen, W., Miller, R. D.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 209 KB

english, 2004

29

Effect of Annealing on the Structural, Mechanical and Tribological Properties of Electroplated Cu Thin Films

Shukla, P., Sikder, A. K., Zantye, P.B., Kumar, Ashok, Sanganaria, M.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 537 KB

english, 2004

30

Optimization of Dielectric Cap Adhesion to Ultra-Low-k Dielectrics

Spencer, Greg, Soyemi, Alfred, Junker, Kurt, Vires, Jason, Turner, Michael, Kirksey, Stuart, Sieloff, David, Ramani, Narayanan

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 75 KB

english, 2004

31

Preparation and Characterization of Copper Film on Plastic Substrate by ECR-MOCVD Coupled with a DC Bias

Jeon, Bup Ju, Lee, Joong Kee

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 567 KB

english, 2004

32

Scanning Near-Field Microwave Probe for In-line Metrology of Low-K Dielectrics

Talanov, Vladimir V., Moreland, Robert L., Scherz, André, Schwartz, Andrew R., Liu, Youfan

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 920 KB

english, 2004

33

Statistical Analysis of Electromigration Lifetimes and Void Evolution for Cu Interconnects

Hauschildt, M., Gall, M., Thrasher, S., Justison, P., Michaelson, L., Hernandez, R., Kawasaki, H., Ho, P. S.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 520 KB

english, 2004

34

Ultra Low-dielectric-constant Materials for 65nm Technology Node and Beyond

Cui, Hao, Moore, Darren, Carter, Richard, Eda, Masaichi, Burke, Peter, Gidley, David, Peng, Huagen

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 785 KB

english, 2004

35

Morphology of Ti37Al63 Thin-Films Deposited by Magnetron Sputtering

Theodore, N. David, Kim, Hyunchul C., Gadre, Kaustubh S., Mayer, James W., Alford, Terry L.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 173 KB

english, 2004

36

Evaluation of PECVD deposited Boron Nitride as Copper Diffusion Barrier on Porous Low-k Materials

Liu, J., Wang, W. D., Wang, L., Chi, D. Z., Loh, K. P.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 117 KB

english, 2004

37

Chemical Routes to Improved Mechanical Properties of PECVD Low K Thin Films

Bilodeau, S.M., Borovik, A.S., Ebbing, A.A., Vestyck, D.J, Xu, C., Roeder, J.F., Baum, T.H.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 228 KB

english, 2004

38

Process-Oriented Stress Modeling and Stress Evolution During Cu/Low-K BEOL Processing

Zhai, Charlie Jun, Besser, Paul R., Feustel, Frank

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 203 KB

english, 2004

39

Coupling Between Precipitation and Plastic Deformation During Electromigration in a Passivated Al (0.5wt%Cu) Interconnect

Barabash, R.I., Ice, G.E., Tamura, N., Valek, B.C., Spolenak, R., Bravman, J.C., Patel, J.R.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 307 KB

english, 2004

40

Textural Evolution of Cu Damascene Interconnects after Annealing

Cho, Jae-Young, Lee, Hyo-Jong, Kim, Hyoungbae, Szpunar, Jerzy A.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 441 KB

english, 2004

41

Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects

Choi, Z. -S., Gan, C. L., Wei, F., Thompson, C. V., Lee, J. H., Pey, K. L., Choi, W. K.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 230 KB

english, 2004

42

Silver Metallization with Reactively Sputtered TiN Diffusion Barrier Films

Gao, L., Gstöttner, J., Emling, R., Linsmeier, Ch., Balden, M., Wiltner, A., Hansch, W., Schmitt-Landsiedel, D.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 2.42 MB

english, 2004

43

Comparative Studies of Ultra Low-κ Porous Silica Films with 2-D Hexagonal and Disordered Pore Structures

Fujii, Nobutoshi, Yamada, Kazuhiro, Oku, Yoshiaki, Hata, Nobuhiro, Seino, Yutaka, Negoro, Chie, Kikkawa, Takamaro

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 685 KB

english, 2004

44

A Novel Organosiloxane Vapor Annealing Process for Improving Elastic Modulus of Porous Low-k Films

Kohmura, Kazuo, Oike, Shunsuke, Murakami, Masami, Tanaka, Hirofumi, Takada, Syozo, Seino, Yutaka, Kikkawa, Takamaro

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 77 KB

english, 2004

45

Modification of Nanoporous Silica Structures by Fluorocarbon Plasma Treatment

Cho, Woojin, Saxena, Ravi, Rodriguez, Oscar, Achanta, Ravi, Ojha, Manas, Plawsky, Joel L., Gill, William. N., Baklanov, Mikhail R.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 1.26 MB

english, 2004

46

Adhesion Strength Evaluation of Low-k Interconnect Structures Using a Nanoscratch Method

Ye, Jiping, Ueoka, Kenichi, Kojima, Nobuo, Shimanuki, Junichi, Shimada, Miyoko, Ogawa, Shinichi

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 567 KB

english, 2004

47

Barrier Layer Morphological Stability and Adhesion to Porous Low-κ Dielectrics

Saxena, R., Cho, W., Rodriguez, O., Gill, W. N., Plawsky, J. L.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 1.02 MB

english, 2004

48

Three Dimensional Interconnect Stress Modeling for Back End Process

Xu, Xiaopeng, Moroz, Victor

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 115 KB

english, 2004

49

Thermomechanical Stresses in Copper Interconnect/Low-κ Dielectric Systems

Shen, Y.-L., Ege, E. S.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 176 KB

english, 2004

50

Evaluation of Thin Dielectric-Glue Wafer-Bonding for Three Dimensional Integrated Circuit-Applications

Kwon, Y., Yu, J., McMahon, J.J., Lu, J.-Q., Cale, T.S., Gutmann, R.J.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 473 KB

english, 2004

51

Effect of Aqueous Solution Chemistry on the Accelerated Cracking of Lithographically Patterned Arrays of Copper and Nanoporous Thin-Films

Guyer, E. P., Dauskardt, R. H.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 1.09 MB

english, 2004

52

“Chlorine-based Reactive Ion Etching Process to Pattern Platinum for MEMS Applications”

Choi, Sung H., Osborn, Jon V., Morgan, Brent A.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 887 KB

english, 2004

53

Ellipsometric Porosimetry of Porous Low-k Films with Quazi-Closed Cavities

Baklanov, Mikhail R., Mogilnikov, Konstantin P., Yim, Jin-Heong

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 751 KB

english, 2004

54

Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segment

Chang, C.W., Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K., Hwang, N.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 165 KB

english, 2004

55

Probing Effects of Etching Plasmas on the Properties of Porous Low-k Dielectrics

Wang, L., Liu, J., Wang, W.D., Chi, D.Z., Gidley, D. W., Yee, A. F.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 1.84 MB

english, 2004

56

Silver Patterning by Reactive Ion Beam Etching for Microelectronics Application

Gao, L., Gstoettner, J., Emling, R., Wang, P., Hansch, W., Schmitt-Landsiedel, D.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 918 KB

english, 2004

57

Unexpected Mode of Plastic Deformation in Cu Damascene Lines Undergoing Electromigration

Budiman, Arief S., Tamura, N., Valek, B. C., Gadre, K., Maiz, J., Spolenak, R., Caldwell, W. A., Nix, W. D., Patel, J. R.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 205 KB

english, 2004

58

In-situ XPS Study of ALD Ta(N) Barrier Formation on Organosilicate Dielectric Surface

Liu, Junjun, Bao, Junjing, Scharnberg, Michael, Ho, Paul S.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 299 KB

english, 2004

59

Deposition and Integration of a Novel Ultra-Low k (2.2) Material

Schulberg, Michelle T., Humayun, Raashina, Sengupta, Archita, Sun, Jia-Ning

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 912 KB

english, 2004