Volume 18; Issue 2

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IEEE Transactions on Semiconductor Manufacturing
Volume 18; Issue 2

IEEE Transactions on Semiconductor Manufacturing

Volume 18; Issue 2

1

Novel RF process monitoring test structure for silicon devices

Choon Beng Sia, Beng Hwee Ong, Kok Meng Lim, Kiat Seng Yeo, Manh Anh Do, Jian-Guo Ma, Alam, T.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 1.94 MB

english, 2005

2

ESD Implantations for On-Chip ESD Protection With Layout Consideration in 0.18-<tex>$muhbox m$</tex>Salicided CMOS Technology

Ker, M.-D., Chuang, C.-H., Lo, W.-Y.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 915 KB

english, 2005

3

Effect of Nanotopography in Direct Wafer Bonding: Modeling and Measurements

Turner, K.T., Spearing, S.M., Baylies, W.A., Robinson, M., Smythe, R.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 950 KB

english, 2005

4

Test Chip for the Development and Evaluation of Sensors for Measuring Stress in Metal Interconnects

Terry, J.G., Smith, S., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M., Horsfall, A.B., Wang, K., dosSantos, J.M.M., Soare, S.M., Wright, N.G., O'Neill, A.G., Bull, S.J.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 2.31 MB

english, 2005

5

New Device Structure Using Array Transistors and Flexible U-Grooves Suitable for 18-V, High-Performance SOI Complementary Bipolar LSIs

Tamaki, Y., Tsuji, K., Otani, O., Nonami, H., Tomatsuri, T., Yoshida, E., Hamamoto, M., Nakazato, N.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 1.55 MB

english, 2005

6

On-Mask CD and Overlay Test Structures for Alternating Aperture Phase Shift Lithography

Smith, S., McCallum, M., Walton, A.J., Stevenson, J.T.M., Harris, P.D., Ross, A.W.S., Hourd, A.C., Jiang, L.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 1.08 MB

english, 2005

7

Guest Editorial Special Section on the International Conference on Microelectronic Test Structures

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 127 KB

english, 2005

8

Dishing-Radius Model of Copper CMP Dishing Effects

Chang, R., Spanos, C.J.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 1.45 MB

english, 2005

9

Implementing Laser-Based Failure Analysis Methodologies Using Test Vehicles

Lewis, D., Pouget, V., Beaudoin, F., Haller, G., Perdu, P., Fouillat, P.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 2.29 MB

english, 2005

10

Interconnect Characterization of X Architecture Diagonal Lines for VLSI Design

Arora, N.D., Song, L., Shah, S.M., Joshi, K., Thumaty, K., Fujimura, A., Yeh, L.C., Yang, P.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 2.46 MB

english, 2005

11

Optimal Lot-Sizing Policy With Incentives for Yield Improvement

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 191 KB

english, 2005

12

SCR Device Fabricated With Dummy-Gate Structure to Improve Turn-On Speed for Effective ESD Protection in CMOS Technology

Ker, M.-D., Hsu, K.-C.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2005

Language:

english

File:

PDF, 593 KB

english, 2005

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