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51

The early stage dissolution of Ni and the nucleation of NiâSn intermetallic compound at the interface during the soldering of Snâ3.5Ag on a Ni substrate

Lin, Yu-Wei, Lin, Kwang-Lung

Journal:

Journal of Applied Physics

Year:

2010

Language:

english

File:

PDF, 2.18 MB

english, 2010

52

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - The growth and segregation of intermetallic compounds in the bulk of flip chip Sn2.4Ag solder joint under electrical current stressing

Wang, Wei-Chieh, Lin, Kwang-Lung, Chiu, Ying-Ta, Lai, Yi-Shao

Year:

2013

Language:

english

File:

PDF, 2.94 MB

english, 2013

53

The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions

Liang, Chien-Lung, Lin, Kwang-Lung, Cheng, Po-Jen

Journal:

Journal of Materials Science

Year:

2017

Language:

english

File:

PDF, 3.00 MB

english, 2017

54

The interfacial bilayer Cu6Sn5 formed in a Sn–Ag–Cu flip-chip solder joint incorporating Au/Pd metallization during solid-state aging

Liang, Chien-Lung, Lin, Kwang-Lung, Cheng, Po-Jen

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2018

Language:

english

File:

PDF, 2.57 MB

english, 2018

55

A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property

Liao, Yi-Han, Chen, Chang-Hsien, Liang, Chien-Lung, Lin, Kwang-Lung, Wu, Albert T.

Journal:

Acta Materialia

Year:

2020

File:

PDF, 4.18 MB

2020

56

Characterization and metastability of alkoxy-derived tetragonal zirconia powder

Huey-Chang Wang, Kwang-Lung Lin

Journal:

Journal of Materials Science

Year:

1991

Language:

english

File:

PDF, 1.13 MB

english, 1991

57

Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint

Wei-Yu Chen, Tsung-Chieh Chiu, Kwang-Lung Lin, Yi-Shao Lai

Journal:

Year:

2012

Language:

english

File:

PDF, 724 KB

english, 2012

58

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - The Electromigration Investigation on the Newly Developed Pb-free Sn-Zn-Ag-Al-Ga Solder Ball Interconnect

Lin, Kwang-Lung, Lin, Ger-Pin

Year:

2007

Language:

english

File:

PDF, 2.83 MB

english, 2007

59

The deposition behavior of electroless nickel on alumina substrate

Lin Kwang-Lung, Long Charng-Shyang

Journal:

Materials Chemistry and Physics

Year:

1993

Language:

english

File:

PDF, 604 KB

english, 1993

60

Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer

Huang, Chia-Wei, Lin, Kwang-Lung

Journal:

MATERIALS TRANSACTIONS

Year:

2004

Language:

english

File:

PDF, 601 KB

english, 2004

61

Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study

Mittal, Jagjiwan, Lin, Kwang-Lung

Journal:

Soldering & Surface Mount Technology

Year:

2018

Language:

english

File:

PDF, 290 KB

english, 2018

62

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate

Chang, Che-Wei, Lin, Kwang-Lung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2019

Language:

english

File:

PDF, 2.52 MB

english, 2019

63

Effects of aging treatment on mechanical properties and microstructure of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga Solder

Teng-Chun Hsuan, Kwang-Lung Lin

Journal:

Materials Science and Engineering: A

Year:

2007

Language:

english

File:

PDF, 1.51 MB

english, 2007

64

Dissolution behavior of Cu and Ag substrates in molten solders

Po-Yi Yeh, Jenn-Ming Song, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 1.05 MB

english, 2006

65

Foreword

Srinivas Chada, Laura J. Turbini, Sung K. Kang, Kwang-Lung Lin, Michael R. Notis, Jin Yu

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 22 KB

english, 2004

66

Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate

Chiang-Ming Chuang, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 198 KB

english, 2003

67

The deposition and wear properties of cathodic arc plasma deposition TiAIN deposits

Kwang-Lung Lin, Ming-Yeong Hwang, Cheng-Dau Wu

Journal:

Materials Chemistry and Physics

Year:

1996

Language:

english

File:

PDF, 650 KB

english, 1996

68

The structures of compositionally modulated AlZr multilayer films

Jin-Kuo Ho, Kwang-Lung Lin

Journal:

Scripta Metallurgica et Materialia

Year:

1995

Language:

english

File:

PDF, 460 KB

english, 1995

69

[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - Shearing strength and materials interaction during reflow of Al/Cu/electroless nickel/solder bump

Kwang-Lung Lin,, Yi-Cheng Liu,

Year:

1999

Language:

english

File:

PDF, 941 KB

english, 1999

70

The metastable Al-Zr alloy thin films prepared by alternate sputtering deposition

Ho, Jin-Kuo, Lin, Kwang-Lung

Journal:

Journal of Applied Physics

Year:

1994

Language:

english

File:

PDF, 1.10 MB

english, 1994

71

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating

Kuo, Yao-Ling, Lin, Kwang-Lung

Year:

2011

Language:

english

File:

PDF, 444 KB

english, 2011

72

Microstructure evolution during electromigration between Sn–9Zn solder and Cu

Kuo, Shih-Ming, Lin, Kwang-Lung

Journal:

Journal of Materials Research

Year:

2007

Language:

english

File:

PDF, 463 KB

english, 2007

73

The atomic behavior during heating in the amorphous diffusion nanolayer between Cu and solder

Pan, Chien-Cheng, Lin, Yu-Wei, Lin, Chien-I, Mittal, Jagjiwan, Lin, Kwang-Lung

Journal:

Journal of Non-Crystalline Solids

Year:

2015

Language:

english

File:

PDF, 2.25 MB

english, 2015

74

Microstructures and mechanical properties of Sn–8.55Zn–0.45Al–XAg solders

Huang, Chia-Wei, Lin, Kwang-Lung

Journal:

Journal of Materials Research

Year:

2003

Language:

english

File:

PDF, 523 KB

english, 2003

75

Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys

Cheng, Shou-Chang, Lin, Kwang-Lung

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 489 KB

english, 2005

76

Current induced rapid phase transformation in Au/Sn reaction couple

Chiu, Tsung-Chieh, Lin, Kwang-Lung

Journal:

Journal of Alloys and Compounds

Year:

2017

Language:

english

File:

PDF, 4.66 MB

english, 2017

77

The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

Kwang-Lung Lin, Jieh-Ting Chang

Journal:

Journal of Materials Science

Year:

1995

Language:

english

File:

PDF, 1.94 MB

english, 1995

78

The reactions between electroless Ni-Cu-P Deposit and 63Sn-37Pb flip chip solder bumps during reflow

Chun-Jen Chen, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2000

Language:

english

File:

PDF, 2.65 MB

english, 2000

79

Wetting behavior between solder and electroless nickel deposits

Lin Kwang-Lung, Jang Jien-Ming

Journal:

Materials Chemistry and Physics

Year:

1994

Language:

english

File:

PDF, 1.16 MB

english, 1994

80

The effect of alloying element gallium on the polarization characteristics of Pb-free Sn–Zn–Ag–Al–XGa solders in NaCl solution

Udit S. Mohanty, Kwang-Lung Lin

Journal:

Corrosion Science

Year:

2006

Language:

english

File:

PDF, 550 KB

english, 2006

81

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Improvement in the properties of Sn-Zn Eutectic based Pb-free solder

Kwang-Lung Lin,, Kang-I Chen,, Hui-Min Hsu,, Chia-Ling Shi,

Year:

2003

Language:

english

File:

PDF, 602 KB

english, 2003

82

Deposition and properties of Mo–N films

Lin, Kwang-Lung

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1995

Language:

english

File:

PDF, 706 KB

english, 1995

83

[IEEE 2005 Proceedings. 55th Electronic Components and Technology Conference - Lake Buena Vista, FL (2005.05.31-2005.06.3)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - The Bonding of Sn-Zn-Ag-Al-Ga Lead-Free Solder Balls on Cu/Ni-P/Au BGA Substrate

Kwang-Lung Lin,, Ying-Ta Chiu,

Year:

2005

Language:

english

File:

PDF, 1.18 MB

english, 2005

84

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate

Chang, Che-Wei, Lin, Kwang-Lung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2019

File:

PDF, 2.52 MB

2019

85

Wetting interaction between Sn-Zn-Ag solders and Cu

Kwang-Lung Lin, Chia-Ling Shih

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 792 KB

english, 2003

86

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Intermetallic compound growth mechanism and failure modes of flip chip solder bump with different UBM structure during electromigration

Zou, Yong-Sheng, Hsiao, Yu-Hsiang, Lin, Kwang-Lung

Year:

2014

Language:

english

File:

PDF, 356 KB

english, 2014

87

Early stage soldering reaction and interfacial microstructure formed between molten Sn–Zn–Ag solder and Cu substrate

Yu, Chang-Ho, Lin, Kwang-Lung

Journal:

Journal of Materials Research

Year:

2005

Language:

english

File:

PDF, 1.96 MB

english, 2005

88

Wetting and IMC Growth Behavior Between Cu Substrate and Zn-25Sn-xCu-yTi High-Temperature Solder Alloys

Sarwono, Darwin, Lin, Kwang-Lung

Journal:

Journal of Electronic Materials

Year:

2018

Language:

english

File:

PDF, 3.58 MB

english, 2018

89

The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing

Tsung-Chieh Chiu, Kwang-Lung Lin

Journal:

Year:

2012

Language:

english

File:

PDF, 2.42 MB

english, 2012

90

Microstructural evolution of ɛ-AgZn3 and η-Zn phases in Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga solder during aging treatment

Teng-Chun Hsuan, Kwang-Lung Lin

Journal:

Journal of Alloys and Compounds

Year:

2009

Language:

english

File:

PDF, 2.19 MB

english, 2009

91

The interdiffusion and interphases formed between electroless nickel deposit and steel substrate

Lin, Kwang-Lung, Chen, Wei-Cheng

Journal:

Scripta Metallurgica et Materialia

Year:

1993

Language:

english

File:

PDF, 348 KB

english, 1993

92

[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Interfacial reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge lead-free solders and metallic substrates

Chiang-Ming Chuang,, Po-Cheng Shi,, Kwang-Lung Lin,

Year:

2002

Language:

english

File:

PDF, 532 KB

english, 2002

93

The interdiffusion and the feasibility of Al/Mo/Ni/(PbSn) as a solder bump system

Kwang-Lung Lin, Shin-Kuo Chen

Journal:

Thin Solid Films

Year:

1997

Language:

english

File:

PDF, 458 KB

english, 1997

94

Mechanical strength of Sn-3.5Ag-based solders and related bondings

Chiang-Ming Chuang, Po-Cheng Shih, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.62 MB

english, 2004

95

The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint

Tsung-Chieh Chiu, Kwang-Lung Lin

Journal:

Scripta Materialia

Year:

2009

Language:

english

File:

PDF, 267 KB

english, 2009

96

Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow

Yu-Wei Lin, Kwang-Lung Lin

Journal:

Year:

2013

Language:

english

File:

PDF, 1.83 MB

english, 2013

97

Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C

Huang, Chia-Wei, Lin, Kwang-Lung

Journal:

Journal of Materials Research

Year:

2004

Language:

english

File:

PDF, 2.94 MB

english, 2004

98

Double peritectic behavior of Ag–Zn intermetallics in Sn–Zn–Ag solder alloys

Song, Jenn-Ming, Lin, Kwang-Lung

Journal:

Journal of Materials Research

Year:

2004

Language:

english

File:

PDF, 1.87 MB

english, 2004

99

Characteristics and comparison of metastability of alkoxy-derived tetragonal ZrO2 powders, gels and films

Huey-Chang Wang, Kwang-Lung Lin

Journal:

Materials Science and Engineering: A

Year:

1991

Language:

english

File:

PDF, 1.09 MB

english, 1991

100

The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates

Chiang-Ming Chuang, Hui-Tzu Hung, Pei-Chi Liu, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 686 KB

english, 2004

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