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1

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A novel double layer NCF for highly reliable micro-bump interconnection

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.12 MB

english, 2014

2

Factors associated with stigma and depressive symptoms in family members of patients with epilepsy

Lee, Sang-Ahm, Han, Su-Hyun, Cho, Yang-Je, Kim, Keun Tae, Kim, Ji-Eun, Shin, Dong Jin, Seo, Jong-Geun, Kim, Young-Soo, Ryu, Han Uk, Lee, Seo-Young, Kim, Jung Bin, Kang, Kyung-Wook, Kim, Shinhye, Kwon,

Journal:

Epilepsy & Behavior

Year:

2020

File:

PDF, 318 KB

2020

3

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Effects of thermo-compression bonding parameters on joint formation of micro-bumps in non-conductive film (NCF)

Shin, Ji-Won, Kim, Young Soon, Lee, Hyoung Gi, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2015

Language:

english

File:

PDF, 1.18 MB

english, 2015

4

A VLSI array processor for 16-point FFT

Lee, Moon-Key, Shin, Kyung-Wook, Lee, Jang-Kyu

Journal:

IEEE Journal of Solid-State Circuits

Year:

1991

Language:

english

File:

PDF, 762 KB

english, 1991

5

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - 3D-TSV vertical interconnection method using Cu/SnAg double bumps

Paik, Kyung-Wook, Choi, Yongwon, Shin, Jiwon

Year:

2012

Language:

english

File:

PDF, 517 KB

english, 2012

6

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effect of Pd addition on ultra-fine pitch Au wire/Al pad interface

Shin, Ji-Won, Song, Min-Suk, Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Cho, Jong-Soo, Yoo, Kyung-Ah, Byun, Kwan-Yoo, Joh, Cheol-Ho, Do, Eun-Hye, Paik, Kyung-Wook

Year:

2010

Language:

english

File:

PDF, 2.28 MB

english, 2010

7

Solid-State Synthesis and Thermoelectric Properties of Cr-doped MnSi1.75−δ

Shin, Dong-Kil, Ur, Soon-Chul, Jang, Kyung-Wook, Kim, Il-Ho

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 694 KB

english, 2014

8

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A novel fine pitch TSV interconnection method using NCF with Zn nano-particles

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.65 MB

english, 2014

9

Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40μm pitch Cu-pillar/Sn–Ag bump interconnection

Shin, Ji-Won, Kim, Il, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Paik, Kyung-Wook

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.42 MB

english, 2015

10

Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films

Choi, Yongwon, Shin, Jiwon, Suk, Kyung-lim, Kim, Young Soon, Kim, Il, Paik, Kyung-Wook

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.69 MB

english, 2014

11

SPIE Proceedings [SPIE SPIE Medical Imaging - Lake Buena Vista, Florida (Saturday 12 February 2011)] Medical Imaging 2011: Physics of Medical Imaging - Integration of an amorphous silicon passive pixel sensor array with a lateral amorphous selenium detector for large area indirect conversion x-ray imaging applications

Wang, Kai, Pelc, Norbert J., Samei, Ehsan, Yazdandoost, Mohammad Y., Keshavarzi, Rasoul, Nishikawa, Robert M., Shin, Kyung-Wook, Hristovski, Christos, Abbaszadeh, Shiva, Chen, Feng, Majid, Shaikh Hasi

Year:

2011

Language:

english

File:

PDF, 21.32 MB

english, 2011

12

Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye, Lee, Tae-Ik, Shin, Ji-Won, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 2.65 MB

english, 2016

13

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection

Hyeong-Gi Lee,, Yong-Won Choi,, Ji-Won Shin,, Kyung-Wook Paik,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 2.40 MB

english, 2015

14

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Kim, Youngsoon, Lee, Seyong, Shin, Ji-won, Paik, Kyung-Wook

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 2.35 MB

english, 2016

15

Acute Spinal Injury After Centrifuge Training in Asymptomatic Fighter Pilots

Kang, Kyung-Wook, Shin, Young Ho, Kang, Seungcheol

Journal:

Aerospace Medicine and Human Performance

Year:

2015

Language:

english

File:

PDF, 601 KB

english, 2015

16

Synthesis and Thermoelectric Properties of Ce1−zPrzFe4−xCoxSb12Skutterudites

Song, Kwon-Min, Shin, Dong-Kil, Jang, Kyung-Wook, Choi, Soon-Mok, Lee, Soonil, Seo, Won-Seon, Kim, Il-Ho

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 1.74 MB

english, 2017

17

Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films

Lee, Hyeong Gi, Shin, Ji-Won, Choi, Yong-Won, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 1.63 MB

english, 2017

18

Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, SeYong, Lee, HanMin, Shin, Ji-Won, Kim, Woojeong, Choi, Taejin, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 2.82 MB

english, 2017

19

Does the new Korean term for epilepsy reduce the stigma for Korean adults with epilepsy?

Lee, Sang-Ahm, Han, Su-Hyun, Cho, Yang-Je, Kim, Keun Tae, Kim, Ji-Eun, Shin, Dong Jin, Seo, Jong-Geun, Kim, Young-Soo, Ryu, Han Uk, Lee, Seo-Young, Kim, Jung Bin, Kang, Kyung-Wook, Kim, Shinhye, Kwon,

Journal:

Epilepsy & Behavior

Year:

2020

File:

PDF, 329 KB

2020

20

Low-Temperature Bonding of PZT (PbZrTiO 3 ) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

Park, Jae-Hyeong, Park, Jong Cheol, Shin, SangMyung, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

File:

PDF, 2.32 MB

2019

21

Proteome analysis of hairy root from Panax ginseng C. A. Meyer using peptide fingerprinting, internal sequencing and expressed sequence tag data

Seung Il Kim, Jin Young Kim, Eun A. Kim, Kyung-Hoon Kwon, Kyung-Wook Kim, Kun Cho, Jeong Hwa Lee, Myung Hee Nam, Deok-Chun Yang, Jong Shin Yoo, Young Mok Park

Journal:

Year:

2003

Language:

english

File:

PDF, 186 KB

english, 2003

22

A 200-MHz complex number multiplier using redundant binary arithmetic

Kyung-Wook Shin, Bang-Sup Song, Bacrania, K.

Journal:

IEEE Journal of Solid-State Circuits

Year:

1998

Language:

english

File:

PDF, 187 KB

english, 1998

23

SPIE Proceedings [SPIE SPIE Medical Imaging - San Diego, California, USA (Saturday 13 February 2010)] Medical Imaging 2010: Physics of Medical Imaging - Cadmium zinc telluride detector for low photon energy applications

Shin, Kyung-Wook, Samei, Ehsan, Pelc, Norbert J., Wang, Kai, Reznic, Alla, Karim, Karim S.

Year:

2010

Language:

english

File:

PDF, 5.51 MB

english, 2010

24

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - 3D-TSV vertical interconnection method using Cu/SnAg double bumps and B-stage non-conductive adhesives (NCAs)

Choi, Yongwon, Shin, Jiwon, Paik, Kyung-Wook

Year:

2012

Language:

english

File:

PDF, 637 KB

english, 2012

25

Thermoelectric Properties of Higher Manganese Silicides Prepared by Mechanical Alloying and Hot Pressing

Dong-Kil Shin, Kyung-Wook Jang, Soon-Chul Ur, Il-Ho Kim

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 967 KB

english, 2013

26

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Effect of NCFs with Zn-nanoparticles on the interfacial reactions of 40 um pitch Cu pillar/Sn-Ag bump for TSV interconnection

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Paik, Kyung-Wook

Year:

2013

Language:

english

File:

PDF, 1.05 MB

english, 2013

27

High-speed complex-number multiplications based on redundant binary representation of partial products

Shin, Kyung-Wook, Jeon, Heung-Woo

Journal:

International Journal of Electronics

Year:

2000

Language:

english

File:

PDF, 880 KB

english, 2000

28

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Development of anhydride-based NCFs for Cu/Sn-Ag eutectic bonding and process optimization for fine pitch TSV chip stacking

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Hwang, Ji Hwan, Paik, Kyung-Wook

Year:

2012

Language:

english

File:

PDF, 1.96 MB

english, 2012

29

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Reliability improvement methods of solder anisotropic conductive film (ACF) joints using morphology control of solder ACF joints

Kim, Yoo-Sun, Kim, Seung-Ho, Shin, Jiwon, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.13 MB

english, 2014

30

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A study on the fine pitch chip interconnection using Cu/SnAg bumps and B-stage non-conductive films (NCFs) for 3D-TSV vertical interconnection

Choi, Yongwon, Shin, Jiwon, Kim, Young Soon, Suk, Kyung-lim, Kim, Il, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.12 MB

english, 2014

31

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage

Shin, Ji-Won, Song, Min-Suk, Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Cho, Jong-Soo, Yoo, Kyung-Ah, Byun, Kwan-Yoo, Joh, Cheol-Ho, Do, Eun-Hye, Paik, Kyung-Wook

Year:

2009

Language:

english

File:

PDF, 6.30 MB

english, 2009

32

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs)

Choi, Yongwon, Shin, Jiwon, Paik, Kyung-Wook

Year:

2011

Language:

english

File:

PDF, 1.36 MB

english, 2011

33

Hydrogenated Nanocrystalline Silicon Thin Film Transistor Array for X-ray Detector Application

Shin, Kyung-Wook, Esmaeili-Rad, Mohammad R., Sazonov, Andrei, Nathan, Arokia

Journal:

MRS Proceedings

Year:

2008

Language:

english

File:

PDF, 518 KB

english, 2008

34

Insomnia in Diabetic Hemodialysis Patients

Han, Sang-Youb, Yoon, Jong-Woo, Jo, Sang-Kyung, Shin, Jin-Ho, Shin, Chol, Lee, Jung-Bok, Cha, Dae-Ryong, Cho, Won-Yong, Pyo, Heui-Jung, Kim, Hyoung-Kyu, Lee, Kyu-Bec, Kim, Hyang, Kim, Kyung-Wook, Kim,

Journal:

Year:

2002

Language:

english

File:

PDF, 56 KB

english, 2002

35

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effects of pad surface finish on interfacial reliabilities of Cu-pillar/Sn-Ag bumps of 2.5D TSV-enterposer on PCB applications

Kim, Youngsoon, Shin, Ji-won, won Choi, Young, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 949 KB

english, 2014

36

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - A study on the intermetallic growth of fine-pitch Cu pillar/SnAg solder bump for 3D-TSV interconnection

Park, Yong-Sung, Shin, Ji-Won, Choi, Yong-Won, Paik, Kyung-Wook

Year:

2012

Language:

english

File:

PDF, 796 KB

english, 2012

37

[IEEE IEEE International Symposium on Circuits and Systems - ISCAS '94 - London, UK (30 May-2 June 1994)] Proceedings of IEEE International Symposium on Circuits and Systems - ISCAS '94 - An efficient VLSI implementation of vector-radix 2-D DCT using mesh-connected 2-D array

Kyung-Wook Shin,, Heung-Woo Jeon,, Yong-Seum Kang,

Year:

1994

Language:

english

File:

PDF, 315 KB

english, 1994

38

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Ultra-thin chip-in-flex (CIF) technology using anisotropic conductive films (ACFs) for wearable electronics applications

Kim, Ji-Hye, Lee, Tae-Ik, Shin, Ji-Won, Kim, Taek-Soo, Paik, Kyung-Wook

Year:

2015

Language:

english

File:

PDF, 1.63 MB

english, 2015

39

[IEEE 1997 IEEE International Symposium on Circuits and Systems. Circuits and Systems in the Information Age ISCAS '97 - Hong Kong (9-12 June 1997)] Proceedings of 1997 IEEE International Symposium on Circuits and Systems. Circuits and Systems in the Information Age ISCAS '97 - A complex multiplier architecture based on redundant binary arithmetic

Kyung-Wook Shin,, Bang-Sup Song,

Year:

1997

Language:

english

File:

PDF, 320 KB

english, 1997

40

SPIE Proceedings [SPIE SPIE Medical Imaging - San Diego, California, USA (Saturday 13 February 2010)] Medical Imaging 2010: Physics of Medical Imaging - Lateral amorphous selenium metal-semiconductor-metal photodetector for large-area high-speed indirect-conversion medical imaging applications

Wang, Kai, Samei, Ehsan, Pelc, Norbert J., Chen, Feng, Shin, Kyung-Wook, Allec, Nicholas, Karim, Karim S.

Year:

2010

Language:

english

File:

PDF, 1.14 MB

english, 2010

41

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Reliability improvement of solder anisotropic conductive film (ACF) joints by controlling ACF polymer resin properties

Kim, Yoo-Sun, Kim, Seung-Ho, Shin, Jiwon, Paik, Kyung-Wook

Year:

2015

Language:

english

File:

PDF, 1.34 MB

english, 2015

42

SPIE Proceedings [SPIE SPIE Medical Imaging - Lake Buena Vista (Orlando Area), Florida, USA (Saturday 9 February 2013)] Medical Imaging 2013: Physics of Medical Imaging - Fabrication and characterization of a novel x-ray silicon detector

Shin, Kyung-Wook, Nishikawa, Robert M., Whiting, Bruce R., Karim, Karim S.

Year:

2013

Language:

english

File:

PDF, 1019 KB

english, 2013

43

Charge transport and thermoelectric properties of double-filled Nd1–zYbzFe4–xCoxSb12skutterudites

Shin, Dong-Kil, Kim, Il-Ho, Jang, Kyung-Wook, Choi, Soon-Mok, Lee, Soonil, Seo, Won-Seon

Journal:

Journal of the Korean Physical Society

Year:

2016

Language:

english

File:

PDF, 1.45 MB

english, 2016

44

SPIE Proceedings [SPIE SPIE Medical Imaging - San Diego, California, USA (Saturday 4 February 2012)] Medical Imaging 2012: Physics of Medical Imaging - Performance of a prototype 32×32 pixel indirect x-ray imager based on a lateral selenium passive pixel sensor

Keshavarzi, Rasoul, Wang, Kai, Yazdandoost, Mohammad Y., Shin, Kyung-Wook, Chen, Feng, Majid, Shaikh Hasibul, Abbaszadeh, Shiva, Karim, Karim S., Pelc, Norbert J., Nishikawa, Robert M., Whiting, Bruce

Year:

2012

Language:

english

File:

PDF, 1.14 MB

english, 2012

45

SPIE Proceedings [SPIE SPIE Medical Imaging - San Diego, California, USA (Saturday 4 February 2012)] Medical Imaging 2012: Physics of Medical Imaging - Novel silicon x-ray detector with TFT readout

Shin, Kyung-Wook, Wang, Kai, Allec, Nicholas, Fang, Yuan, Karim, Karim S., Pelc, Norbert J., Nishikawa, Robert M., Whiting, Bruce R.

Year:

2012

Language:

english

File:

PDF, 546 KB

english, 2012

46

Incidence, characteristics, and treatment outcomes of mycobacterial diseases in transplant recipients

Yoo, Jung-Wan, Jo, Kyung-Wook, Kim, Sung-Han, Lee, Sang-Oh, Kim, Jae Joong, Park, Su-Kil, Lee, Je-Hwan, Han, Duck Jong, Hwang, Shin, Lee, SeungGyu, Shim, Tae Sun

Journal:

Transplant International

Year:

2016

Language:

english

File:

PDF, 123 KB

english, 2016

47

[IEEE 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC) - San Diego, CA, USA (2015.10.31-2015.11.7)] 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC) - Optimizing floating guard ring designs for FASPAX N-in-P silicon sensors

Shin, Kyung-Wook, Bradford, Robert, Lipton, Ronald, Deptuch, Gregory, Fahim, Farah, Madden, Tim, Zimmerman, Tom

Year:

2015

Language:

english

File:

PDF, 634 KB

english, 2015

48

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection

Lee, SeYong, Shin, Ji-Won, Lee, Hyeong Gi, Kim, Young Soon, Paik, Kyung-Wook

Year:

2016

Language:

english

File:

PDF, 1.03 MB

english, 2016

49

a-Si:H TFT-Silicon Hybrid Low-Energy X-Ray Detector

Shin, Kyung-Wook, Karim, Karim S.

Journal:

IEEE Transactions on Electron Devices

Year:

2017

Language:

english

File:

PDF, 1.15 MB

english, 2017

50

Midterm and Long-term Results of Medial Versus Lateral Meniscal Allograft Transplantation: A Meta-analysis

Bin, Seong-Il, Nha, Kyung-Wook, Cheong, Ji-Young, Shin, Young-Soo

Journal:

American Journal of Sports Medicine

Year:

2017

Language:

english

File:

PDF, 2.43 MB

english, 2017

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