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1

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Metal Contamination Evaluation of Via-Last Cu TSV Process Using Notchless Si Etching and Wet Cleaning of the First Metal Layer

Watanabe, Naoya, Kikuchi, Hidekazu, Yanagisawa, Azusa, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro, Nakamura, Akio

Year:

2017

Language:

english

File:

PDF, 1.82 MB

english, 2017

2

A CAD system for building structures in ‘BUILDING RC/SRC/S’

Masahiro Horii, Tsukasa Aoyagi, Akira Wada, Fukuzo Suto

Journal:

Computer-Aided Design

Year:

1976

Language:

english

File:

PDF, 520 KB

english, 1976

3

Fabrication and stress analysis of annular-trench-isolated TSV

Feng, Wei, Bui, Tung Thanh, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.94 MB

english, 2016

4

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Wet cleaning process for high-yield via-last TSV formation

Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro, Kikuchi, Hidekazu, Yanagisawa, Azusa, Nakamura, Akio

Year:

2016

Language:

english

File:

PDF, 1.41 MB

english, 2016

5

Stress investigation of annular-trench-isolated TSV by polarized Raman spectroscopy measurement and finite element simulation

Feng, Wei, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.68 MB

english, 2019

6

Impact of joint materials on the reliability of double-side packaged SiC power devices during high temperature aging

Fengqun Lang, Hiroshi Nakagawa, Masahiro Aoyagi, Hiromichi Ohashi, Hiroshi Yamaguchi

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2010

Language:

english

File:

PDF, 1.10 MB

english, 2010

7

Social Capital Formation and Credit Access: Evidence from Sri Lanka

Masahiro Shoji, Keitaro Aoyagi, Ryuji Kasahara, Yasuyuki Sawada, Mika Ueyama

Journal:

World Development

Year:

2012

Language:

english

File:

PDF, 269 KB

english, 2012

8

Structure and Bioactivity of Thiosulfinates Resulting from Suppression of Lachrymatory Factor Synthase in Onion

Aoyagi, Morihiro, Kamoi, Takahiro, Kato, Masahiro, Sasako, Hiroshi, Tsuge, Nobuaki, Imai, Shinsuke

Journal:

Journal of Agricultural and Food Chemistry

Year:

2011

Language:

english

File:

PDF, 1.35 MB

english, 2011

9

Simple and highly efficient chiral dopant molecules possessing both rod- and arch-like units

Kishikawa, Keiki, Aoyagi, Shota, Kohri, Michinari, Taniguchi, Tatsuo, Takahashi, Masahiro, Kohmoto, Shigeo

Journal:

Year:

2014

Language:

english

File:

PDF, 2.29 MB

english, 2014

10

[IEEE 2014 International Conference on Microelectronic Test Structures (ICMTS) - Udine, Italy (2014.3.24-2014.3.27)] 2014 International Conference on Microelectronic Test Structures (ICMTS) - 3D IC testing using a chip prober and a transparent membrane probe card

Watanabe, Naoya, Aoyagi, Masahiro, Eto, Michiyuki, Kawano, Kenji

Year:

2014

Language:

english

File:

PDF, 5.18 MB

english, 2014

11

[IEEE 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taipei, Taiwan (2012.12.9-2012.12.11)] 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Investigation of optimized high-density flip-chip interconnect design including micro Au bumps and underfill for ultrabroadband (DC-40GHz) applications

Yasu, Yotaro, Kato, Fumiki, Kikuchi, Katsuya, Nemoto, Shunsuke, Nakagawa, Hiroshi, Koshiji, Kohji, Aoyagi, Masahiro

Year:

2012

Language:

english

File:

PDF, 1.23 MB

english, 2012

12

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Development of Cu-less TSV reveal process using Si/Cu grinding, electroless Ni plating, and alkaline etching of Si

Watanabe, Naoya, Aoyagi, Masahiro, Katagawa, Daisuke, Yoshikawa, Kazuhiro, Bandoh, Tsubasa, Yamamoto, Eiichi

Year:

2013

Language:

english

File:

PDF, 1.45 MB

english, 2013

13

Damage Evaluation of Wet-Chemical Si-Wafer Thinning/Backside Via Exposure Process

Watanabe, Naoya, Miyazaki, Takumi, Yoshikawa, Kazuhiro, Aoyagi, Masahiro

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 4.23 MB

english, 2014

14

Vortex phases and energy dissipation in narrow Nb strips: Reduction of collective pinning

Ando, Yoichi, Kubota, Hiroshi, Tanaka, Shoji, Aoyagi, Masahiro, Akoh, Hiroshi, Takada, Susumu

Journal:

Physical Review B

Year:

1993

Language:

english

File:

PDF, 178 KB

english, 1993

15

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Investigation of low-temperature deposition high-uniformity coverage Parylene-HT as a dielectric layer for 3D interconnection

Tung, Bui Thanh, Cheng, Xiaojin, Watanabe, Naoya, Kato, Fumiki, Kikuchi, Katsuya, Aoyagi, Masahiro

Year:

2014

Language:

english

File:

PDF, 3.20 MB

english, 2014

16

Novel through silicon via exposure process comprising Si/Cu grinding, electroless Ni–B plating, and wet etching of Si

Watanabe, Naoya, Aoyagi, Masahiro, Katagawa, Daisuke, Bandoh, Tsubasa, Yamamoto, Eiichi

Journal:

Japanese Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 1.39 MB

english, 2014

17

15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

Tung, Bui Thanh, Kato, Fumiki, Watanabe, Naoya, Nemoto, Shunsuke, Kikuchi, Katsuya, Aoyagi, Masahiro

Journal:

Japanese Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 118 KB

english, 2014

18

Fabrication of a membrane probe card using transparent film for three-dimensional integrated circuit testing

Watanabe, Naoya, Suzuki, Motohiro, Kawano, Kenji, Eto, Michiyuki, Aoyagi, Masahiro

Journal:

Japanese Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 2.00 MB

english, 2014

19

[IEEE 2014 International 3D Systems Integration Conference (3DIC) - Kinsdale, Ireland (2014.12.1-2014.12.3)] 2014 International 3D Systems Integration Conference (3DIC) - Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration

Bui Thanh Tung,, Xiaojin Cheng,, Watanabe, Naoya, Kato, Fumiki, Kikuchi, Katsuya, Aoyagi, Masahiro

Year:

2014

Language:

english

File:

PDF, 3.01 MB

english, 2014

20

Microbiological and molecular epidemiological analyses of community-associated methicillin-resistant Staphylococcus aureus at a tertiary care hospital in Japan

Inomata, Shinya, Yano, Hisakazu, Tokuda, Koichi, Kanamori, Hajime, Endo, Shiro, Ishizawa, Chiyuki, Ogawa, Miho, Ichimura, Sadahiro, Shimojima, Masahiro, Kakuta, Risako, Ozawa, Daiki, Aoyagi, Tetsuji,

Journal:

Journal of Infection and Chemotherapy

Year:

2015

Language:

english

File:

PDF, 670 KB

english, 2015

21

[IEEE 2014 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan (2014.11.4-2014.11.6)] IEEE CPMT Symposium Japan 2014 - Fabrication and electrical characterization of Parylene-HT liner bottom-up copper filled through silicon via (TSV)

Tung, Bui Thanh, Cheng, Xiaojin, Watanabe, Naoya, Kato, Fumiki, Kikuchi, Katsuya, Aoyagi, Masahiro

Year:

2014

Language:

english

File:

PDF, 1.52 MB

english, 2014

22

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Methods to reduce thermal stress for TSV Scaling ∼TSV with novel structure: Annular-Trench-Isolated TSV

Feng, Wei, Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro

Year:

2015

Language:

english

File:

PDF, 1.02 MB

english, 2015

23

Validation of TSV thermo-mechanical simulation by stress measurement

Feng, Wei, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 2.02 MB

english, 2016

24

Copper-Filled Through-Silicon Vias With Parylene-HT Liner

Bui, Tung Thanh, Watanabe, Naoya, Cheng, Xiaojin, Kato, Fumiki, Kikuchi, Katsuya, Aoyagi, Masahiro

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 2.40 MB

english, 2016

25

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging

Kikuchi, Katsuya, Kato, Fumiki, Nemoto, Shunsuke, Nakagawa, Hiroshi, Aoyagi, Masahiro, Yasu, Youtaro, Koshiji, Kohji

Year:

2013

Language:

english

File:

PDF, 478 KB

english, 2013

26

[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Twice-etched silicon approach for via-last through-silicon-via with a Parylene-HT liner

Bui, Tung T., Watanabe, Naoya, Aoyagi, Masahiro, Kikuchi, Katsuya

Year:

2015

File:

PDF, 1.37 MB

2015

27

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration

Bui, Tung Thanh, Cheng, Xiaojin, Watanabe, Naoya, Kato, Fumiki, Kikuchi, Katsuya, Aoyagi, Masahiro

Year:

2016

Language:

english

File:

PDF, 741 KB

english, 2016

28

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Low Residual Stress in Si Substrate of Annular-Trench-Isolated TSV

Feng, Wei, Bui, Tung Thanh, Watanabe, Naoya, Aoyagi, Masahiro, Kikuchi, Katsuya

Year:

2016

Language:

english

File:

PDF, 501 KB

english, 2016

29

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Integration of a microfluidic chip with multiplexed optical fluorescence detector through anisotropic etching of Si using Tetramethylammonium hydroxide (TMAH)

Robbins, Hannah, Changqing Liu,, Sijung Hu,, Tung Bui,, Aoyagi, Masahiro

Year:

2016

Language:

english

File:

PDF, 17.84 MB

english, 2016

30

30-GHz High-Frequency Application of Screen Printed Interconnects on an Organic Substrate

Lim, Ying Ying, Goh, Yee Mey, Yoshida, Manabu, Bui, Tung Thanh, Aoyagi, Masahiro, Liu, Changqing

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 2.40 MB

english, 2017

31

HMGB1-induced inflammatory response promotes bone healing in murine tooth extraction socket

Aoyagi, Hiroaki, Yamashiro, Keisuke, Hirata-Yoshihara, Chiaki, Ideguchi, Hidetaka, Yamasaki, Mutsuyo, Kawamura, Mari, Yamamoto, Tadashi, Kochi, Shinsuke, Wake, Hidenori, Nishibori, Masahiro, Takashiba

Journal:

Journal of Cellular Biochemistry

Year:

2018

Language:

english

File:

PDF, 430 KB

english, 2018

32

Production and characterization of silver powder created using high-pressure water atomization

OGIHARA, Takashi, KUBO, Toshihiko, ARITA, Shigehiro, AOYAGI, Nobuyoshi, UEYAMA, Ryosuke, HARADA, Masahiro, HARADA, Akio

Journal:

Journal of the Ceramic Society of Japan

Year:

2017

Language:

english

File:

PDF, 772 KB

english, 2017

33

SAE Technical Paper Series [SAE International SAE 2006 World Congress & Exhibition - (APR. 03, 2006)] SAE Technical Paper Series - Advanced Diesel Combustion Using of Wide Range, High Boosted and Cooled EGR System by Single Cylinder Engine

Aoyagi, Yuzo, Osada, Hideaki, Misawa, Masahiro, Goto, Yuichi, Ishii, Hajime

Year:

2006

Language:

english

File:

PDF, 1.44 MB

english, 2006

34

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Process evaluation of pyramidal and cone-shaped nanoparticle deposition (NPD) bumps using a thermally resistant resist

Lim, Ying Ying, Hashino, Masara, Nakagawa, Hiroshi, Aoyagi, Masahiro, Kikuchi, Katsuya

Year:

2018

Language:

english

File:

PDF, 3.38 MB

english, 2018

35

Therapeutic dilemma in twin reversed arterial perfusion sequence

Aoyagi, Yoko, Kai, Kentaro, Sumie, Masahiro, Fujiyoshi, Naoki, Furukawa, Yuichi, Narahara, Hisashi

Journal:

SAGE Open Medical Case Reports

Year:

2019

Language:

english

File:

PDF, 241 KB

english, 2019

36

Stress investigation of annular-trench-isolated TSV by polarized Raman spectroscopy measurement and finite element simulation

Feng, Wei, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 2.68 MB

2019

37

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core

Feng, Wei, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

Year:

2019

File:

PDF, 685 KB

2019

38

Processing of a Strong Biodegradable Poly[(R)-3-hydroxybutyrate] Fiber and a New Fiber Structure Revealed by Micro-Beam X-Ray Diffraction with Synchrotron Radiation

Tadahisa Iwata, Yoshihiro Aoyagi, Masahiro Fujita, Hideki Yamane, Yoshiharu Doi, Yoshio Suzuki, Akihisa Takeuchi, Kentaro Uesugi

Journal:

Macromolecular Rapid Communications

Year:

2004

Language:

english

File:

PDF, 174 KB

english, 2004

39

Cover Picture: Macromol. Rapid Commun. 11/2004

Tadahisa Iwata, Yoshihiro Aoyagi, Masahiro Fujita, Hideki Yamane, Yoshiharu Doi, Yoshio Suzuki, Akihisa Takeuchi, Kentaro Uesugi

Journal:

Macromolecular Rapid Communications

Year:

2004

File:

PDF, 29 KB

2004

40

TOF-SIMS imaging of protein adsorption on dialysis membrane

Satoka Aoyagi, Msayo Hayama, Urara Hasegawa, Kiyotaka Sakai, Takahiro Hoshi, Masahiro Kudo

Journal:

Applied Surface Science

Year:

2004

Language:

english

File:

PDF, 307 KB

english, 2004

41

Detection of protein immobilization on biosensor surfaces by TOF-SIMS

Satoka Aoyagi, Yuko Oiw, Masahiro Kudo

Journal:

Applied Surface Science

Year:

2004

Language:

english

File:

PDF, 94 KB

english, 2004

42

Mutual information theory for biomedical applications: Estimation of three protein-adsorbed dialysis membranes

Satoka Aoyagi, Azusa Takesawa, Akihiro C. Yamashita, Masahiro Kudo

Journal:

Applied Surface Science

Year:

2006

Language:

english

File:

PDF, 304 KB

english, 2006

43

TOF-SIMS imaging technique with information entropy

Satoka Aoyagi, Y. Kawashima, Masahiro Kudo

Journal:

Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms

Year:

2005

Language:

english

File:

PDF, 653 KB

english, 2005

44

Hydrogen redistribution in CVD SiO2 during post-oxidation annealing investigated by SIMS

Yoshiya Kawashima, Hideo Kawano, Koichi Terashima, Koji Hamada, Satoka Aoyagi, Masahiro Kudo

Journal:

Applied Surface Science

Year:

2004

Language:

english

File:

PDF, 166 KB

english, 2004

45

Deconvolution analysis of dopant depth profile of Si at AlGaAs/GaAs interface using Al composition profile as reference

Yoshiya Kawashima, Takashi Ide, Satoka Aoyagi, Masahiro Kudo

Journal:

Applied Surface Science

Year:

2004

Language:

english

File:

PDF, 106 KB

english, 2004

46

TOF-SIMS investigation of metallic material surface after culturing cells

Satoka Aoyagi, Sachiko Hiromoto, Takao Hanawa, Masahiro Kudo

Journal:

Applied Surface Science

Year:

2004

Language:

english

File:

PDF, 109 KB

english, 2004

47

Thermal redistribution of hydrogen and boron in SiO2 in SiN-capped p-type MOSFET structures

Yoshiya Kawashima, Satoka Aoyagi, Masahiro Kudo

Journal:

Applied Surface Science

Year:

2005

Language:

english

File:

PDF, 158 KB

english, 2005

48

Evaluation of immobilized-lysozyme by means of TOF-SIMS

Keigo Okada, Satoka Aoyagi, Makoto Dohi, Nobuhiko Kato, Masahiro Kudo, Miyako Tozu, Takuya Miyayama, Noriaki Sanada

Journal:

Applied Surface Science

Year:

2008

Language:

english

File:

PDF, 188 KB

english, 2008

49

Development of fluorescence change-based, reagent-less optic immunosensor

Satoka Aoyagi, Masahiro Kudo

Journal:

Biosensors and Bioelectronics

Year:

2005

Language:

english

File:

PDF, 275 KB

english, 2005

50

Synthesis, enhanced stability and structural imaging of C60 and C70 double-wall carbon nanotube peapods

Guoqing Ning, Naoki Kishi, Haruya Okimoto, Masahiro Shiraishi, Yuko Kato, Ryo Kitaura, Toshiki Sugai, Shinobu Aoyagi, Eiji Nishibori, Makoto Sakata, Hisanori Shinohara

Journal:

Chemical Physics Letters

Year:

2007

Language:

english

File:

PDF, 1.03 MB

english, 2007

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