books search
books
articles search
articles
Donate
Log In
Log In
to access more features
personal recommendations
Telegram Bot
download history
send to Email or Kindle
manage booklists
save to favorites
Explore
Journals
Contribution
Donate
Litera Library
Donate paper books
Add paper books
Open LITERA Point
Volume 39; Issue 11
Main
Microelectronics Reliability
Volume 39; Issue 11
Microelectronics Reliability
Volume 39; Issue 11
1
Preface
Steven H Voldman
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 80 KB
Your tags:
english, 1999
2
Investigations on the thermal behavior of interconnects under ESD transients using a simplified thermal RC network
Pascal Salome
,
Charles Leroux
,
Philippe Crevel
,
Jean Pierre Chante
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 269 KB
Your tags:
english, 1999
3
Bipolar model extension for MOS transistors considering gate coupling effects in the HBM ESD domain
Heinrich Wolf
,
Horst Gieser
,
Wolfgang Stadler
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 200 KB
Your tags:
english, 1999
4
Characterization and optimization of a bipolar ESD-device by measurements and simulations
Andreas D. Stricker
,
Stephan Mettler
,
Heinrich Wolf
,
Markus Mergens
,
Wolfgang Wilkening
,
Horst Gieser
,
Wolfgang Fichtner
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 423 KB
Your tags:
english, 1999
5
Investigation into socketed CDM (SDM) tester parasitics
M Chaine
,
K Verhaege
,
L Avery
,
M Kelly
,
H Gieser
,
K Bock
,
L.G Henry
,
T Meuse
,
T Brodbeck
,
J Barth
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 278 KB
Your tags:
english, 1999
6
Electromigration induced aluminum atom migration retarding by grain boundary structure stabilization and copper doping
M Hasunuma
,
H Toyoda
,
H Kaneko
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 364 KB
Your tags:
english, 1999
7
The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique
J. Van Olmen
,
J.V. Manca
,
W. De Ceuninck
,
L. De Schepper
,
V. D’Haeger
,
A. Witvrouw
,
K. Maex
,
B. Vandevelde
,
E. Beyne
,
L. Tielemans
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 167 KB
Your tags:
english, 1999
8
Dynamics of electromigration induced void/hillock growth and precipitation/dissolution of addition elements studied by in-situ scanning electron microscopy resistance measurements
J. D’Haen
,
P. Cosemans
,
J.V. Manca
,
G. Lekens
,
T. Martens
,
W. De Ceuninck
,
M. D’Olieslaeger
,
L. De Schepper
,
K. Maex
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 370 KB
Your tags:
english, 1999
9
Modeling electromigration as a fluid–gas system
Wim Schoenmaker
,
Violeta Petrescu
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 235 KB
Your tags:
english, 1999
10
Electromigration performance of Al–Si–Cu filled vias with titanium glue layer
M Kageyama
,
K Hashimoto
,
H Onoda
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 296 KB
Your tags:
english, 1999
11
Modeling and microstructural characterization of incubation, time-dependent drift and saturation during electromigration in Al–Si–Cu stripes
A. Witvrouw
,
H. Bender
,
Ph. Roussel
,
K. Maex
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 377 KB
Your tags:
english, 1999
12
Guest Editorial
Ton J Mouthaan
,
Hiroshi Onoda
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 48 KB
Your tags:
english, 1999
13
Non-uniform triggering of gg-nMOSt investigated by combined emission microscopy and transmission line pulsing
Christian Russ
,
Karlheinz Bock
,
Mahmoud Rasras
,
Ingrid De Wolf
,
Guido Groeseneken
,
Herman E Maes
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 546 KB
Your tags:
english, 1999
14
ESD protection for mixed-voltage I/O using NMOS transistors stacked in a cascode configuration
Warren R. Anderson
,
David B. Krakauer
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 281 KB
Your tags:
english, 1999
15
Early electromigration effects and early resistance changes
A. Scorzoni
,
I. De Munari
,
M. Impronta
,
N. Kelaidis
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 226 KB
Your tags:
english, 1999
16
An evaluation of fast wafer level test methods for interconnect reliability control
S Foley
,
J Molyneaux
,
A Mathewson
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 271 KB
Your tags:
english, 1999
17
The excess noise in integrated circuit interconnects before and after electromigration damage
Jianping Guo
,
B.K Jones
,
G Trefan
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 238 KB
Your tags:
english, 1999
18
Long term noise measurements and median time to failure test for the characterization of electromigration in metal lines
C. Ciofi
,
V. Dattilo
,
B. Neri
,
S. Foley
,
A. Mathewson
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 153 KB
Your tags:
english, 1999
19
Copper metallization reliability
J.R Lloyd
,
J Clemens
,
R Snede
Journal:
Microelectronics Reliability
Year:
1999
Language:
english
File:
PDF, 147 KB
Your tags:
english, 1999
1
Follow
this link
or find "@BotFather" bot on Telegram
2
Send /newbot command
3
Specify a name for your chatbot
4
Choose a username for the bot
5
Copy an entire last message from BotFather and paste it here
×
×