52

Wafer-level SLID bonding for MEMS encapsulation

Year:
2013
Language:
english
File:
PDF, 816 KB
english, 2013
84

Thermodynamic reassessment of Au–Ni–Sn ternary system

Year:
2013
Language:
english
File:
PDF, 4.30 MB
english, 2013
86

Wissensmanagement in der Kinder- und Jugendhilfe

Year:
2015
Language:
german
File:
PDF, 276 KB
german, 2015