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51

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Assembly Challenges of High Density Large Fine Pitch Lead-Free, Flip-Chip Package

Ser Choong Chong,, Yeow Meng Tan,, Tai Chong Chai,, Samuel Lim,, Wai Yin Hnin,, Chek Kweng Cheng,

Year:

2006

Language:

english

File:

PDF, 2.27 MB

english, 2006

52

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process

Chong, Ser Choong, Aw, Jie Li, Leong Ching, Eva Wai, Cereno, Daniel Ismael, Li, Hong Yu, Vempati, Srinivasa Rao, Teo, Keng Hwa

Year:

2013

Language:

english

File:

PDF, 1.46 MB

english, 2013

53

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Development and Characterization of Large Silicon Microchannel Heat Sink Packages for Thermal Management of High Power Microelectronics Modules

Hengyun Zhang,, Qingxin Zhang,, Ser-Choong Chong,, Pinjala, D., Xiaoping Liu,, Poh-Keong Chan,

Year:

2006

Language:

english

File:

PDF, 358 KB

english, 2006

54

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - A novel compact antenna with a low profile demonstrated on embedded wafer level packaging (EMWLP) technology

Ying, Lim Ying, David, Ho Soon Wee, Choong, Chong Ser, Pa, Myo Ei Pa, Guan, Lim Teck

Year:

2011

Language:

english

File:

PDF, 1.59 MB

english, 2011

55

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Design, Integration and Testing of Fluidic Dispensing Control Valve into a DNA/RNA Sample Preparation Micro fluidic Package for Lab on a Chip (LOC) Applications

Xie, Ling, Premachandran, C.S., Chong, Ser Choong, Chew, Michelle

Year:

2007

Language:

english

File:

PDF, 2.87 MB

english, 2007

56

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking

Xie, Ling, Wickramanayaka, Sunil, Li, Hongyu, Jung, Boo Yang, Aw, Jie Li, Chong, Ser Choong

Year:

2013

Language:

english

File:

PDF, 4.02 MB

english, 2013

57

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Fine pitch solder-less bonding using ultrasonic technique

Ser Choong Chong,, Jie Li Aw,, Cereno, D. I., Li Yan Siow,, Chee Guan Koh,, Witarsa, D., Vempati, S., Tai Chong Chai,

Year:

2012

Language:

english

File:

PDF, 803 KB

english, 2012

58

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Characterization of thermally conductive underfill materials for high performance flip-chip applications

Chew, M., Mian Zhi Ding,, Wai, E., Ser Choong Chong,, Rao, V. S., Rhee, Min Woo Daniel

Year:

2012

Language:

english

File:

PDF, 3.30 MB

english, 2012

59

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Disposable Polydimethylsioxane Package for 'Bio~Microfluidic System'

Ser Choong Chong,, Ling Xie,, Yobas, L., Hong Miao Ji,, Jing Li,, Yu Chen,, Damaruganath, P., Wing Cheong Hui,, Iyer, M.K.

Year:

2005

Language:

english

File:

PDF, 393 KB

english, 2005

60

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Via-in-Mold (ViM) process for embedded wafer level package (eWLP)

Ho, Soon Wee, Pa Pa, Myo Ei, Fong, Chee Heng, Wang, Zhonghai, Kang, He Tong, Chong, Ser Choong, Chai, Tai Chong

Year:

2013

Language:

english

File:

PDF, 1.77 MB

english, 2013

61

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Investigation on decap shift and incomplete fill issues in the wafer level compression molding process

Bu, Lin, Ho, Siowling, Dexter Velez, Sorono, Zheng, Boyu, Chong, Ser Choong, Jung, Booyang, Chai, Taichong, Zhang, Xiaowu

Year:

2013

File:

PDF, 1.14 MB

2013

62

FABRICATION OF SELF-ORGANIZED METAL NANOWIRE ARRAY USING POROUS ALUMINA TEMPLATE FOR OFF-CHIP INTERCONNECTS

BALAKRISHNAN, S., KRIPESH, V., CHONG, SER CHOONG

Journal:

International Journal of Nanoscience

Year:

2006

Language:

english

File:

PDF, 391 KB

english, 2006

63

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - A miniaturized heterogeneous wireless sensor node in 3DIC

Xin Liu,, Lei Wang,, Jayakrishnan, M., Jingjing Lan,, Hongyu Li,, Chong Ser Choong,, Raja, M. K., Yongxin Guo,, Wang Ling Goh,, Jin He,, Shan Gao,, Minkyu Je,

Year:

2012

Language:

english

File:

PDF, 523 KB

english, 2012

64

A Fast, Sensitive and Label Free Electrochemical DNA Sensor

Chen, Yu, Elling,, Lee, Yoke-ling, Chong, Ser-choong

Journal:

Journal of Physics Conference Series

Year:

2006

Language:

english

File:

PDF, 174 KB

english, 2006

65

Mechanical Analyses of Advanced Multi-Chip Embedded Wafer Level Packages

Ho, Siow Ling, Bu, Lin, Sorono, Dexter Velez, Chong, Ser Choong, Chai, Tai Chong, Zhang, Xiao Wu

Journal:

Advanced Materials Research

Year:

2013

Language:

english

File:

PDF, 838 KB

english, 2013

66

Electrochemical Biochip for Drug Screening At Cellular Level

Chen, Yu, Cui, Hui-fang, Ye, Jian-shan, Chong, Ser-choong, Lim, Tit-meng, Sheu, Fwu-shan, Hui, Wing-cheong

Journal:

Journal of Physics Conference Series

Year:

2006

Language:

english

File:

PDF, 178 KB

english, 2006

67

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Disposable Bio-Microfluidic Package with Passive Fluidic Control

Ling Xie,, Ser Choong Chong,, Premachandran, C.S., Pinjala, D., Iyer, M.K.

Year:

2005

Language:

english

File:

PDF, 3.88 MB

english, 2005

68

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Double side redistribution layer process on embedded wafer level package for package on package (PoP) applications

Ho, Soon Wee, Fernardez Moses Daniel,, Siow, Li Yan, Wai Hong SeeToh,, Wen Sheng Lee,, Ser Choong Chong,, Vempati, Srinivasa Rao

Year:

2010

Language:

english

File:

PDF, 3.07 MB

english, 2010

69

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - A novel electrically conductive wafer through hole filled vias interconnect for 3D MEMS packaging

Premachandran, C.S., Nagarajan, R., Chen Yu,, Zhang Xiolin,, Chong Ser Choong,

Year:

2003

Language:

english

File:

PDF, 567 KB

english, 2003

70

SPIE Proceedings [SPIE MOEMS-MEMS 2006 Micro and Nanofabrication - San Jose, CA (Saturday 21 January 2006)] Microfluidics, BioMEMS, and Medical Microsystems IV - Microelectrodes integrated cell-chip for drug effects study

Chen, Yu, Papautsky, Ian, Wang, Wanjun, Cui, Hui-Fang, Ye, Jian-Shan, Chong, Ser-Choong, Lim, Tit-Meng, Sheu, Fwu-Shan, Cheong, Hui-Wing

Year:

2006

Language:

english

File:

PDF, 418 KB

english, 2006

71

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - High-Throughput Thermal Compression Bonding of 20 um Pitch Cu Pillar with Gas Pressure Bonder for 3D IC Stacking

Xie, Ling, Wickramanayaka, Sunil, Chong, Ser Choong, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

Year:

2016

Language:

english

File:

PDF, 911 KB

english, 2016

72

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - 6um Pitch High Density Cu-Cu Bonding for 3D IC Stacking

Xie, Ling, Wickramanayaka, Sunil, Chong, Ser Choong, Sekhar, Vasarla Nagendra, Ismeal, Daniel, Ye, Yong Liang

Year:

2016

Language:

english

File:

PDF, 2.22 MB

english, 2016

73

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Development of Chip-to-Wafer (C2W) bonding process for high density I/Os Fan-Out Wafer Level Package (FOWLP)

Lim, Sharon Pei-Siang, Chong, Ser Choong, Ding, Mian Zhi, Rao, Vempati Srinivasa

Year:

2016

Language:

english

File:

PDF, 987 KB

english, 2016

74

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Molding process development for high density I/Os Fan-Out Wafer Level Package (FOWLP) with fine pitch RDL

Ding, Mian Zhi, Chong, Ser Choong, Ho, David Soon Wee, Lim, Sharon Pei Siang

Year:

2016

Language:

english

File:

PDF, 1.04 MB

english, 2016

75

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application

Chong, Ser Choong, Xie, Ling, Wickramanayaka, Sunil, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

Year:

2016

Language:

english

File:

PDF, 529 KB

english, 2016

76

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level Packaging

Han, Yong, Ding, Mian Zhi, Lin, Bu, Choong, Chong Ser

Year:

2016

Language:

english

File:

PDF, 597 KB

english, 2016

77

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Development of chip on wafer bonding with non conductive film using gang bonder

Chong, Ser Choong, Li, Hongyu, Xie, Ling, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

Year:

2017

Language:

english

File:

PDF, 947 KB

english, 2017

78

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Process development of moldable underfill on fine pitch RDL 1 st fan-out wafer level package

Lim, Simon Siak Boon, Ding, Mian Zhi, Chong, Ser Choong, Lim, Sharon Pei Siang

Year:

2017

Language:

english

File:

PDF, 953 KB

english, 2017

79

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Process Development of 4-Die Stack Module Using Moldable Underfill

Chong, Ser Choong, Li, Hongyu, Xie, Ling, Lim, Simon Boon, Chen, Zhaohui

Year:

2018

File:

PDF, 953 KB

2018

80

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Process Development of 4-Die Stack Module Using Moldable Underfill

Chong, Ser Choong, Li, Hongyu, Xie, Ling, Lim, Simon Boon, Chen, Zhaohui

Year:

2018

Language:

english

File:

PDF, 953 KB

english, 2018

81

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Challenges and Approaches of 2.5D high density Flip chip interconnect on through mold interposer

LIM, Sharon Pei-Siang, Chong, Ser Choong, Seit, Wen Wei, Chai, Tai Chong

Year:

2018

File:

PDF, 8 KB

2018

82

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Effect of Bond Pad Surface Finish on AuSn Solder Bumping Using Laser Solder Jetting

Jaafar, Norhanani Binte, Choong, Chong Ser

Year:

2018

File:

PDF, 367 KB

2018

83

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Comprehensive study on die shift and die protrusion issues during molding process of Mold-1st FOWLP

Lim, Simon Siak Boon, Chong, Ser Choong, Sharon, Lim Pei Siang, Seit, Wen Wei, Zhang, Xiaowu

Year:

2018

Language:

english

File:

PDF, 660 KB

english, 2018

84

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Development of Antenna on FO-WLP

Boon, Serine Soh Siew, Wee, David Ho Soon, Yao, Hsiao Hsiang, Boon, Simon Lim Siak, Shan, Sharon Lim Pei, Choong, Chong Ser, Chong, Chai Tai

Year:

2018

Language:

english

File:

PDF, 399 KB

english, 2018

85

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Fine Pitch Cu to Cu interconnects for 2.5D Packaging

Xie, Ling, Chong, Ser Choong

Year:

2018

File:

PDF, 364 KB

2018

86

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Comprehensive Study of Copper Nano-Paste for Cu-Cu Bonding

Chong, Ser Choong, Lim Sharon, Pei Siang

Year:

2019

Language:

english

File:

PDF, 338 KB

english, 2019

87

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Comprehensive Study of Tin-Silver-Copper Lead-Free Alloys on Various Bond Pad Metallisation

Jaafar, Norhanani Binte, Choong, Chong Ser

Year:

2019

File:

PDF, 2.61 MB

2019

88

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - 3D Interconnect through Conventional Pad by Via-last-from-top Approach

Li, H. Y., Xie, Ling, Chong, Ser Choong

Year:

2019

File:

PDF, 5.19 MB

2019

89

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Ultrathin Die Pick-Up for 3D Chip Stacking

Kawano, Masaya, Hirota, Naoya, Lim, Sharon Pei-Siang, Chong, Ser-Choong

Year:

2019

File:

PDF, 485 KB

2019

90

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Comprehensive Study of Multi-Die Stacking with CuSnAg bumps in two step bonding process

Chong, Ser Choong, Li, Hongyu, Xie, Ling, Lim, Sharon Seow Huang

Year:

2019

File:

PDF, 1.06 MB

2019

91

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Silicon Optical Electrical Interposer - Fiber to the Chip

Guan, Lim Teck, Yu, Li Hong, Chinq, Jong Ming, Ching, Eva Wai Leong, Choong, Chong Ser, Thor, Lim Soon, Ang, Thomas Y. L, Rong, Ong Jun

Year:

2019

File:

PDF, 1.01 MB

2019

92

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development of Mold-First Fan-Out Panel-Level Packaging (FO-PLP) on 600mm x 600mm Size Panel

Srinivasa Rao, Vempati, Ser Choong, Chong, Yamamoto, Kazunori

Year:

2020

File:

PDF, 811 KB

2020

93

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development of Multi-Die Stacking with Cu-Cu interconnects using Gang Bonding Approach

Chong, Ser Choong, Xie, Ling, Li, Hongyu, Lim, Seow Huang

Year:

2020

File:

PDF, 660 KB

2020