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Volume 85; Issue 1
Main
Microelectronic Engineering
Volume 85; Issue 1
Microelectronic Engineering
Volume 85; Issue 1
1
Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
Sang-Joon Park
,
Woo-Hee Kim
,
Han-Bo-Ram Lee
,
W.J. Maeng
,
H. Kim
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 739 KB
Your tags:
english, 2008
2
X-ray metrology for high-k atomic layer deposited HfxZr1−xO2 films
Jesus J. Gallegos III
,
Dina H. Triyoso
,
Mark Raymond
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 642 KB
Your tags:
english, 2008
3
A nanoanalytical investigation of elemental distributions in high-k dielectric gate stacks on silicon
F.T. Docherty
,
M. MacKenzie
,
A.J. Craven
,
D.W. McComb
,
S. De Gendt
,
S. McFadzean
,
C.M. McGilvery
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 364 KB
Your tags:
english, 2008
4
Adhesion properties of polymethylsilsesquioxane based low dielectric constant materials by the modified edge lift-off test
B.R. Kim
,
Y.D. Kim
,
M.S. Moon
,
B.K. Choi
,
M.J. Ko
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 374 KB
Your tags:
english, 2008
5
High breakdown voltage 4H-SiC MESFETs with floating metal strips
Jinping Zhang
,
Yi Ye
,
Chunhua Zhou
,
Xiaorong Luo
,
Bo Zhang
,
Zhaoji Li
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 478 KB
Your tags:
english, 2008
6
Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification
S.S. Yoon
,
D.O. Kim
,
S.C. Park
,
Y.K. Lee
,
H.Y. Chae
,
S.B. Jung
,
J.-D. Nam
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 915 KB
Your tags:
english, 2008
7
Effect of plasma operation pressure on burn-in efficiency of an SIP–PVD chamber
Yi-Chi Lin
,
Ming-Yen Li
,
Hsiao-Che Wu
,
Poyo Chuang
,
Cheng-Sung Huang
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 694 KB
Your tags:
english, 2008
8
High-k TixSi1−xO2 thin films prepared by co-sputtering method
Sungyeon Kim
,
Moon-Ho Ham
,
Byeong-Yun Oh
,
Hyun Jae Kim
,
Jae-Min Myoung
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 439 KB
Your tags:
english, 2008
9
Conduction mechanisms in Ta2O5 stack in response to rapid thermal annealing
D. Spassov
,
E. Atanassova
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 223 KB
Your tags:
english, 2008
10
Analysis on the mutual inductance of planar transformer in CMOS technology
Heng-Ming Hsu
,
Chien-Wen Tseng
,
Hsien-Feng Liao
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 464 KB
Your tags:
english, 2008
11
Analysis of interface states and series resistance of MIS Schottky diodes using the current–voltage (I–V) characteristics
A. Tataroğlu
,
Ş. Altındal
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 172 KB
Your tags:
english, 2008
12
Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology
M.J. Rizvi
,
H. Lu
,
C. Bailey
,
Y.C. Chan
,
M.Y. Lee
,
C.H. Pang
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 823 KB
Your tags:
english, 2008
13
Work function control at metal high-dielectric-constant gate oxide interfaces
K. Tse
,
J. Robertson
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 1.17 MB
Your tags:
english, 2008
14
Investigation of voltage-swing effect and trap generation in high-k gate dielectric of MOS devices by charge-pumping measurement
Chun-Yuan Lu
,
Kuei-Shu Chang-Liao
,
Chun-Chang Lu
,
Ping-Hung Tsai
,
Yin Yin Kyi
,
Tien-Ko Wang
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 1.20 MB
Your tags:
english, 2008
15
Characterization of strained silicon on relaxed SiGe layer made by H ion implantation and annealing in ultra-high vacuum ambient
Changchun Chen
,
Benhai Yu
,
Jiangfeng Liu
,
Qirun Dai
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 399 KB
Your tags:
english, 2008
16
Process damage-free damascene metal gate technology for gentle integration of epitaxially grown high-k
Ralf Endres
,
Yordan Stefanov
,
Frank Wessely
,
Florian Zaunert
,
Udo Schwalke
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 962 KB
Your tags:
english, 2008
17
Erratum to: “FIB-milling of photonic structures and sputtering simulation” [Microelectron. Eng. 83 (2006) 1805–1808]
Philipp M. Nellen
,
Victor Callegari
,
Rolf Brönnimann
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 166 KB
Your tags:
english, 2008
18
On the profile of frequency dependent series resistance and surface states in Au/Bi4Ti3O12/SiO2/n-Si(MFIS) structures
F. Parlaktürk
,
Ş. Altındal
,
A. Tataroğlu
,
M. Parlak
,
A. Agasiev
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 399 KB
Your tags:
english, 2008
19
Molecular weight and processing effects on the dissolution properties of thin poly(methyl methacrylate) films
A. Kokkinis
,
E.S. Valamontes
,
D. Goustouridis
,
Th. Ganetsos
,
K. Beltsios
,
I. Raptis
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 264 KB
Your tags:
english, 2008
20
Yttrium silicide formation and its contact properties on Si(1 0 0)
Wei Huang
,
Guo-Ping Ru
,
C. Detavernier
,
R.L. Van Meirhaeghe
,
Yu-Long Jiang
,
Xin-Ping Qu
,
Bing-Zong Li
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 1.78 MB
Your tags:
english, 2008
21
Numerical and experimental studies for the anisotropic etching of silicon with the AFM oxide lines as masks
Jen Fin Lin
,
Pal Jen Wei
,
Chih Kuang Tai
,
Jung Ching Chung
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 978 KB
Your tags:
english, 2008
22
Comparative study of the influence of the solvent on the catalytic growth of carbon nanotubes
R. Engel-Herbert
,
H. Pforte
,
T. Hesjedal
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 727 KB
Your tags:
english, 2008
23
Simulations and experiments of three-dimensional paddle shift for IC packaging
Shiang-Yu Teng
,
Sheng-Jye Hwang
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 4.03 MB
Your tags:
english, 2008
24
XPS analysis with an ultra clean vacuum substrate carrier for oxidation and airborne molecular contamination prevention
B. Pelissier
,
H. Kambara
,
E. Godot
,
E. Veran
,
V. Loup
,
O. Joubert
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 165 KB
Your tags:
english, 2008
25
Dielectric anisotropy in the integration of Cu–SiLK™ system
Hai-Sin Tseng
,
Bi-Shiou Chiou
,
Wen-Fa Wu
,
Chia-Cheng Ho
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 214 KB
Your tags:
english, 2008
26
Effect of size and plasma treatment and the application of Weibull distribution on the breakdown of PECVD SiNx MIM capacitors
Chia-Cheng Ho
,
Bi-Shiou Chiou
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 151 KB
Your tags:
english, 2008
27
Dopant effects on the thermal stability of FUSI NiSi
P. Zhao
,
M.J. Kim
,
B.E. Gnade
,
R.M. Wallace
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 698 KB
Your tags:
english, 2008
28
Pattern replication in polypropylene films by hot embossing
Patrick W. Leech
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 1.13 MB
Your tags:
english, 2008
29
Fabrication of soft reflective microoptical elements using a replication process
Teng-Kai Shih
,
Jeng-Rong Ho
,
Jui-Hao Wang
,
Chia-Fu Chen
,
Chueh-Yang Liu
,
Chien-Chung Chen
,
Wha-Tzong Whang
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 751 KB
Your tags:
english, 2008
30
A novel overlay process for imprint lithography using load release and alignment error pre-compensation method
Jinyou Shao
,
Yucheng Ding
,
Yiping Tang
,
Hongzhong Liu
,
Bingheng Lu
,
Dongyin Cui
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 516 KB
Your tags:
english, 2008
31
A replication process of metallic micro-mold by using parylene embossing and electroplating
Sung-Won Youn
,
Hiroshi Goto
,
Masaharu Takahashi
,
Shoji Oyama
,
Yasuhiko Oshinomi
,
Kinya Matsutani
,
Ryutaro Maeda
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 1.45 MB
Your tags:
english, 2008
32
Decoupling the Fermi-level pinning effect and intrinsic limitations on p-type effective work function metal electrodes
Huang-Chun Wen
,
Prashant Majhi
,
Kisik Choi
,
C.S. Park
,
Husam N. Alshareef
,
H. Rusty Harris
,
Hongfa Luan
,
Hiro Niimi
,
Hong-Bae Park
,
Gennadi Bersuker
,
Patrick S. Lysaght
,
Dim-Lee Kwong
,
S.C. Song
,
Byou
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 568 KB
Your tags:
english, 2008
33
Direct soft UV-NIL with resist incorporating carbon nanotubes
Jun-hyuk Choi
,
Sung-un Jung
,
Dae-geun Choi
,
Jun-ho Jeong
,
Eung-sug Lee
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 1.19 MB
Your tags:
english, 2008
34
Fabrication of stamps for microcontact printing by injection molding
Amol Chandekar
,
Michael Alabran
,
Sandip K. Sengupta
,
Jun S. Lee
,
Joey L. Mead
,
Carol M.F. Barry
,
James E. Whitten
,
Sivasubramanian Somu
,
Ahmed A. Busnaina
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 2.98 MB
Your tags:
english, 2008
35
Nanoimprint in PDMS on glass with two-level hybrid stamp
Patrick Carlberg
,
Lars Montelius
,
Jonas Tegenfeldt
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 359 KB
Your tags:
english, 2008
36
Effects of temperature and size on contact behavior of self-assembled alkanethiol cluster for dip-pen nanolithography
Te-Hua Fang
,
Win-Jin Chang
,
Cheng-Da Wu
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 1.11 MB
Your tags:
english, 2008
37
Thermal annealing effect on electrical properties of metal nitride gate electrodes with hafnium oxide gate dielectrics in nano-metric MOS devices
S. Chatterjee
,
Y. Kuo
,
J. Lu
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 631 KB
Your tags:
english, 2008
38
Growth and structural properties of crystalline LaAlO3 on Si (0 0 1)
J.W. Reiner
,
A. Posadas
,
M. Wang
,
T.P. Ma
,
C.H. Ahn
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 243 KB
Your tags:
english, 2008
39
Preface
Hsing-Huang Tseng
,
Byoung Hun Lee
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 50 KB
Your tags:
english, 2008
40
Inside Front Cover - Editorial Board
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 32 KB
Your tags:
english, 2008
41
High-quality high-k HfON formed with plasma jet assisted PVD process and application as tunnel dielectric for flash memories
Yanxiang Liu
,
Sun Il Shim
,
X.W. Wang
,
Lurng-Shehng Lee
,
Ming-Jinn Tsai
,
T.P. Ma
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 649 KB
Your tags:
english, 2008
42
Breakdown characteristics of nFETs in inversion with metal/HfO2 gate stacks
N.A. Chowdhury
,
G. Bersuker
,
C. Young
,
R. Choi
,
S. Krishnan
,
D. Misra
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 338 KB
Your tags:
english, 2008
43
Electronic defects in LaAlO3
K. Xiong
,
J. Robertson
,
S.J. Clark
Journal:
Microelectronic Engineering
Year:
2008
Language:
english
File:
PDF, 386 KB
Your tags:
english, 2008
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