Chuan Seng Tan: search on Z-Library

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101

Suppression of interfacial voids formation during silane (SiH 4 )-based silicon oxide bonding with a thin silicon nitride capping layer

Lee, Kwang Hong, Bao, Shuyu, Wang, Yue, Fitzgerald, Eugene A., Seng Tan, Chuan

Journal:

Journal of Applied Physics

Year:

2018

Language:

english

File:

PDF, 2.11 MB

english, 2018

102

[IEEE 2011 37th IEEE Photovoltaic Specialists Conference (PVSC) - Seattle, WA, USA (2011.06.19-2011.06.24)] 2011 37th IEEE Photovoltaic Specialists Conference - Enhanced optical absorbance of epitaxial emitter silicon solar cells with a back germanium epilayer

Lai, Donny, Tan, Yew Heng, Tan, Chuan Seng

Year:

2011

Language:

english

File:

PDF, 263 KB

english, 2011

103

Advances in 3D Integrated Circuits and Systems || Non-volatile Memory

Yu, Hao, Tan, Chuan-Seng

Year:

2015

Language:

english

File:

PDF, 1.07 MB

english, 2015

104

Do primary care physicians use the 5As in counselling obese patients? A qualitative study

Lee, Jean-Jasmin Mi-Li, Tung, Yew Cheong, Tai, Kit Ping, Tay, Samantha Alexis, Cheng, Shu Juan, Ang, Seng Bin, Tan, Ngiap Chuan

Journal:

Proceedings of Singapore Healthcare

Year:

2017

Language:

english

File:

PDF, 67 KB

english, 2017

105

High dose Losartan and ACE gene polymorphism in IgA nephritis

Keng-Thye Woo, Choong-Meng Chan, Hui-Lin Choong, Han-Kim Tan, Marjorie Foo, Evan J. C. Lee, Chorh-Chuan Tan, Grace S. L. Lee, Seng-Hoe Tan, A. Vathsala, Cheng-Hong Lim, Gilbert S. C. Chiang, Stephanie

Journal:

The HUGO Journal

Year:

2008

Language:

english

File:

PDF, 236 KB

english, 2008

106

Cu–Cu Bond Quality Enhancement Through the Inclusion of a Hermetic Seal for 3-D IC

Peng, Lan, Zhang, Lin, Li, Hong Yu, Tan, Chuan Seng

Journal:

IEEE Transactions on Electron Devices

Year:

2013

Language:

english

File:

PDF, 1.04 MB

english, 2013

107

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Low temperature bump-less Cu-Cu bonding enhancement with self assembled monolayer (SAM) passivation for 3-D integration

Lim, Dau Fatt, Wei, Jun, Ng, Chee Mang, Tan, Chuan Seng

Year:

2010

Language:

english

File:

PDF, 785 KB

english, 2010

108

Comparative immunogenicity and safety of human papillomavirus (HPV)-16/18 AS04-adjuvanted vaccine and HPV-6/11/16/18 vaccine administered according to 2- and 3-dose schedules in girls aged 9–14 years: Results to month 12 from a randomized trial

Leung, Ting Fan, Liu, Anthony Pak-Yin, Lim, Fong Seng, Thollot, Franck, Oh, Helen May Lin, Lee, Bee Wah, Rombo, Lars, Tan, Ngiap Chuan, Rouzier, Roman, Friel, Damien, De Muynck, Benoit, De Simoni, Sté

Journal:

Human Vaccines & Immunotherapeutics

Year:

2015

Language:

english

File:

PDF, 890 KB

english, 2015

109

Comparison of postoperative immune function in patients with thoracic esophageal cancer after video-assisted thoracoscopic surgery or conventional open esophagectomy

Tan, Jun-Tao, Zhong, Jian-Hong, Yang, Yang, Mao, Nai-Qun, Liu, De-Seng, Huang, Ding-Ming, Zhao, Yong-Xiang, Zuo, Chuan-Tian

Journal:

International Journal of Surgery

Year:

2016

Language:

english

File:

PDF, 1.12 MB

english, 2016

110

Dielectric relaxation in AC powder electroluminescent devices

Zhang, Shuai, Su, Haibin, Tan, Chuan Seng, Wong, Terence Kin Shun, Teo, Ronnie Jin Wah

Journal:

Solid State Communications

Year:

2017

Language:

english

File:

PDF, 894 KB

english, 2017

111

[IEEE 2017 IEEE Photonics Conference (IPC) - Orlando, FL, USA (2017.10.1-2017.10.5)] 2017 IEEE Photonics Conference (IPC) - Germanium-on-silicon nitride: A promising platform for mid-IR sensing applications

Li, Wei, Anantha, P., Lee, Kwang Hong, Qiu, Hao Dong, Guo, Xin, Zhang, Lin, Wang, Hong, Tan, Chuan Seng

Year:

2017

Language:

english

File:

PDF, 1.01 MB

english, 2017

112

[IEEE 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Singapore, Singapore (2019.8.28-2019.8.30)] 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Germanium Photodetectors with 60-nm Absorption Coverage Extension and ∼2× Quantum Efficiency Enhancement across L-Band

Guo, Xin, Lee, Kwang Hong, Lin, Yiding, Ma, Danhao, Michel, Jurgen, Tan, Chuan Seng, Wang, Hong, Wen, Rui-Tao, Zhou, Jin

Year:

2019

Language:

english

File:

PDF, 248 KB

english, 2019

113

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Wafer level hermetic packaging with IMC-less Cu-Cu bonding for 3D microsystems (invited)

Tan, Chuan Seng, Fan, Ji

Year:

2011

Language:

english

File:

PDF, 1.56 MB

english, 2011

114

[IEEE 2010 35th IEEE Photovoltaic Specialists Conference (PVSC) - Honolulu, HI, USA (2010.06.20-2010.06.25)] 2010 35th IEEE Photovoltaic Specialists Conference - Low temperature silicon epitaxy using rapid thermal chemical vapor deposition (RTCVD) for solar cell application

Lai, Donny, Tan, Yew Heng, Ong, Duen Yang, Tan, Chuan Seng

Year:

2010

Language:

english

File:

PDF, 1.82 MB

english, 2010

115

The role of AsH3 partial pressure on anti-phase boundary in GaAs-on-Ge grown by MOCVD – Application to a 200mm GaAs virtual substrate

Kohen, David, Bao, Shuyu, Lee, Kwang Hong, Lee, Kenneth Eng Kian, Tan, Chuan Seng, Yoon, Soon Fatt, Fitzgerald, Eugene A.

Journal:

Journal of Crystal Growth

Year:

2015

Language:

english

File:

PDF, 2.04 MB

english, 2015

116

Advances in 3D Integrated Circuits and Systems || FRONT MATTER

Yu, Hao, Tan, Chuan-Seng

Year:

2015

Language:

english

File:

PDF, 333 KB

english, 2015

117

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Growth and fabrication of carbon-based three-dimensional heterostructure in through-silicon vias (TSVs) for 3D interconnects

Zhu, Ye, Tan, Chong Wei, Chua, Shen Lin, Lim, Yu Dian, Tay, Beng Kang, Tan, Chuan Seng

Year:

2017

Language:

english

File:

PDF, 3.86 MB

english, 2017

118

Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias

Lin, Ye, Tan, Chuan Seng

Journal:

Japanese Journal of Applied Physics

Year:

2018

Language:

english

File:

PDF, 2.72 MB

english, 2018

119

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Dielectric Quality of 3D Capacitor Embedded in Through-Silicon Via (TSV)

Lin, Ye, Tan, Chuan Seng

Year:

2018

Language:

english

File:

PDF, 693 KB

english, 2018

120

Performance of AlGaInP LEDs on silicon substrates through low threading dislocation density (TDD) germanium buffer layer

Wang, Yue, Wang, Bing, Eow, Desmond Fu Shen, Michel, Jurgen, Lee, Kenneth Eng Kian, Yoon, Soon Fatt, Fitzgerald, Eugene A, Tan, Chuan Seng, Lee, Kwang Hong

Journal:

Semiconductor Science and Technology

Year:

2018

Language:

english

File:

PDF, 997 KB

english, 2018

121

Cu-Cu Bonding in Ambient Environment by Ar/N 2 Plasma Surface Activation and Its Characterization

Chua, Shen Lin, Chan, Jiawei Marvin, Goh, Simon Chun Kiat, Tan, Chuan Seng

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 1.51 MB

english, 2018

122

[IEEE 2018 IEEE Symposium on VLSI Technology - Honolulu, HI (2018.6.18-2018.6.22)] 2018 IEEE Symposium on VLSI Technology - GeSn p-FinFETs with Sub-10 nm Fin Width Realized on a 200 mm GeSnOI Substrate: Lowest SS of 63 mV/decade, Highest Gm,int of 900 µS/µm, and High-Field µeff of 275 cm 2 /V•s

Lei, Dian, Han, Kaizhen, Lee, Kwang Hong, Huang, Yi-Chiau, Wang, Wei, Yadav, Sachin, Kumar, Annie, Wu, Ying, Heliu, Huiquan, Xu, Shengqiang, Kang, Yuye, Li, Yang, Kong, Eugene Y.-J., Tan, Chuan Seng,

Year:

2018

Language:

english

File:

PDF, 746 KB

english, 2018

123

Band structure of Ge 1− x Sn x alloy: a full-zone 30-band k · p model

Song, Zhigang, Fan, Weijun, Tan, Chuan Seng, Wang, Qijie, Nam, Donguk, Zhang, Dao Hua, Sun, Greg

Journal:

New Journal of Physics

Year:

2019

Language:

english

File:

PDF, 1.11 MB

english, 2019

124

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Fabrication and Characterization of Surface Electrode Ion Trap for Quantum Computing

Tao, Jing, Chew, Nam Piau, Guidoni, Luca, Lim, Yu Dian, Zhao, Peng, Tan, Chuan Seng

Year:

2018

File:

PDF, 324 KB

2018

125

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Application of self assembly monolayer (SAM) in lowering the process temperature during Cu-Cu diffusion bonding of 3D IC

Dau Fatt Lim,, Shiv Govind Singh,, Xiao Fang Ang,, Jun Wei,, Chee,, Chuan Seng Tan,

Year:

2009

Language:

english

File:

PDF, 1.54 MB

english, 2009

126

Reduction of threading dislocation density in Ge/Si using a heavily As-doped Ge seed layer

Lee, Kwang Hong, Bao, Shuyu, Wang, Bing, Wang, Cong, Yoon, Soon Fatt, Michel, Jurgen, Fitzgerald, Eugene A., Tan, Chuan Seng

Journal:

Year:

2016

Language:

english

File:

PDF, 5.80 MB

english, 2016

127

GeSn lateral p-i-n photodetector on insulating substrate

Xu, Shengqiang, Huang, Yi-Chiau, Lee, Kwang Hong, Wang, Wei, Dong, Yuan, Lei, Dian, Masudy-Panah, Saeid, Tan, Chuan Seng, Gong, Xiao, Yeo, Yee-Chia

Journal:

Year:

2018

Language:

english

File:

PDF, 4.27 MB

english, 2018

128

[IEEE 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Singapore, Singapore (2019.8.28-2019.8.30)] 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Dark Current Analysis of Vertical p-i-n Photodetectors on a Germanium-on-Insulator Platform

Lee, Kwang Hong, Lin, Yiding, Son, Bongkwon, Tan, Chuan Seng

Year:

2019

Language:

english

File:

PDF, 148 KB

english, 2019

129

Once-Daily Intraperitoneal Gentamicin is Effective Therapy for Gram-Negative Capd Peritonitis

Lye, Wai-Choong, Van Der Straaten, Jane C., Leong, See-Odd, Sivaraman, Pary, Tan, Seng-Ho, Tan, Chorh-Chuan, Lee, Evan J.C.

Journal:

Peritoneal Dialysis International

Year:

1999

Language:

english

File:

PDF, 25 KB

english, 1999

130

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Design, Fabrication and Characterization of Surface Electrode Ion Trap Integrated with TSV

Zhao, Peng, Tao, Jing, Li, Hong Yu, Lim, Yu Dian, Guidoni, Luca, Tan, Chuan Seng

Year:

2019

Language:

english

File:

PDF, 2.48 MB

english, 2019

131

[IEEE 2014 IEEE Ninth International Conference on Intelligent Sensors, Sensor Networks and Information Processing (ISSNIP) - Singapore (2014.4.21-2014.4.24)] 2014 IEEE Ninth International Conference on Intelligent Sensors, Sensor Networks and Information Processing (ISSNIP) - Simulation and design of AIN piezoelectric resonator for infrared sensing application utilizing lamb wave mode

Ang, Wan Chia, Kropelmcki, Piotr, Benson Randies, Andrew, Gu, Yuandong Alex, Leong, Kam Chew, Tan, Chuan Seng

Year:

2014

File:

PDF, 2.43 MB

2014

132

Reliable 3-D Clock-Tree Synthesis Considering Nonlinear Capacitive TSV Model With Electrical–Thermal–Mechanical Coupling

Sai, Manoj P. D., Hao Yu,, Yang Shang,, Chuan Seng Tan,, Sung Kyu Lim,

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 1.01 MB

english, 2013

133

[IEEE 2012 Photonics Global Conference (PGC) - Singapore, Singapore (2012.12.13-2012.12.16)] 2012 Photonics Global Conference (PGC) - Single-mode narrow beam divergence surface-emitting concentric-circular-grating terahertz quantum cascade lasers

Liang, Guozhen, Liang, Houkun, Zhang, Ying, Khanna, Suraj P., Li, Lianhe, Davies, A. Giles, Linfield, Edmund, Lim, Dau Fatt, Tan, Chuan Seng, Yu, Siu Fung, Liu, Hui Chun, Wang, Qi Jie

Year:

2012

Language:

english

File:

PDF, 924 KB

english, 2012

134

Synthesis of colloidal stable Linde Type J (LTJ) zeolite nanocrystals from rice husk silica and their catalytic performance in Knoevenagel reaction

Ng, Eng-Poh, Lim, Gin Keat, Khoo, Guo-Lun, Tan, Kok-Hou, Ooi, Boon Seng, Adam, Farook, Ling, Tau Chuan, Wong, Ka-Lun

Journal:

Materials Chemistry and Physics

Year:

2015

Language:

english

File:

PDF, 1.38 MB

english, 2015

135

On the origins of near-surface stresses in silicon around Cu-filled and CNT-filled through silicon vias

Zhu, Ye, Ghosh, Kaushik, Li, Hong Yu, Lin, Yiheng, Tan, Chuan Seng, Xia, Guangrui (Maggie)

Journal:

Semiconductor Science and Technology

Year:

2016

Language:

english

File:

PDF, 1.44 MB

english, 2016

136

Effects of precursorsâ purity on graphene quality: Synthesis and thermoelectric effect

Shiau, Li Lynn, Goh, Simon Chun Kiat, Wang, Xingli, Zhu, MinMin, Sahoo, Mamina, Tan, Chuan Seng, Lai, Chao-Sung, Liu, Zheng, Tay, Beng Kang

Journal:

Year:

2020

File:

PDF, 4.88 MB

2020

137

ABCA1gene polymorphisms and their associations with coronary artery disease and plasma lipids in males from three ethnic populations in Singapore

Jenny Hui-Hui Tan, Poh-Sim Low, Yong-Seng Tan, Ming-Chuan Tong, Nilmani Saha, Hongyuan Yang, Chew-Kiat Heng

Journal:

Year:

2003

Language:

english

File:

PDF, 283 KB

english, 2003

138

Wafer-on-Wafer Stacking by Bumpless Cu–Cu Bonding and Its Electrical Characteristics

Tan, Chuan Seng, Peng, Lan, Li, Hong Yu, Lim, Dau Fatt, Gao, Shan

Journal:

IEEE Electron Device Letters

Year:

2011

Language:

english

File:

PDF, 264 KB

english, 2011

139

ECS Transactions [ECS 217th ECS Meeting - Vancouver, Canada (April 25 - April 30, 2010)] - (Invited) PE-TEOS Wafer Bonding Enhancement at Low Temperature with a High-k Dielectric Capping Layer

Tan, Chuan Seng, Chong, Gang Yih

Year:

2010

Language:

english

File:

PDF, 1005 KB

english, 2010

140

[IEEE 2016 IEEE Silicon Nanoelectronics Workshop (SNW) - Honolulu, HI, USA (2016.6.12-2016.6.13)] 2016 IEEE Silicon Nanoelectronics Workshop (SNW) - High quality Ge-OI, III–V-OI on 200 mm Si substrate

Lee, Kwang Hong, Lin, Yiding, Bao, Shuyu, Zhang, Li, Lee, Kenneth, Michel, Jurgen, Fitzgerald, Eugene, Tan, Chuan Seng

Year:

2016

Language:

english

File:

PDF, 1.43 MB

english, 2016

141

In 0.49 Ga 0.51 P/GaAs heterojunction bipolar transistors (HBTs) on 200 mm Si substrates: Effects of base thickness, base and sub-collector doping concentrations

Wang, Yue, Lee, Kwang Hong, Loke, Wan Khai, Ben Chiah, Siau, Zhou, Xing, Yoon, Soon Fatt, Tan, Chuan Seng, Fitzgerald, Eugene

Journal:

Year:

2018

Language:

english

File:

PDF, 1.81 MB

english, 2018

142

[IEEE 2019 IEEE SENSORS - Montreal, QC, Canada (2019.10.27-2019.10.30)] 2019 IEEE SENSORS - Mid Infrared Volatile Compounds Detection Using Thermally Reflowed Flip-Stack Die Linear Variable Filter

Kiat Goh, Simon Chun, Chuan, KaiLiang, Lee, Chengkuo, Tan, Chuan Seng

Year:

2019

Language:

english

File:

PDF, 697 KB

english, 2019

143

Thermal characteristic of Cu–Cu bonding layer in 3-D integrated circuits stack

Journal:

Microelectronic Engineering

Year:

2010

Language:

english

File:

PDF, 277 KB

english, 2010

144

Design and Modeling of Platinum Thin Film Microheater for High Temperature Microtensile Test Application

Ang, Wan Chia, Lei, Man I, Tsai, Julius Ming Lin, Leong, Kam Chew, Tan, Chuan Seng

Journal:

Advanced Materials Research

Year:

2011

Language:

english

File:

PDF, 915 KB

english, 2011

145

Enhanced Si–Ge interdiffusion in high phosphorus-doped germanium on silicon

Cai, Feiyang, Dong, Yuanwei, Heng Tan, Yew, Seng Tan, Chuan, (Maggie) Xia, Guangrui

Journal:

Semiconductor Science and Technology

Year:

2015

Language:

english

File:

PDF, 1.40 MB

english, 2015

146

Longitudinal Trends in HbA1c and Associations with Comorbidity and All-Cause Mortality in Asian Patients with Type 2 Diabetes: A Cohort Study

Luo, Miyang, Yen Lim, Wei, Seng Tan, Chuen, Ning, Yilin, Seng Chia, Kee, van Dam, Rob M., Ee Tang, Wern, Chuan Tan, Ngiap, Chen, Richard, Shyong Tai, E, Venkataraman, Kavita

Journal:

Diabetes Research and Clinical Practice

Year:

2017

Language:

english

File:

PDF, 837 KB

english, 2017

147

The Theoretical Optical Gain of Ge 1â x Sn x Nanowires

Xiong, Wen, Fan, Wei-Jun, Song, Zhi-Gang, Tan, Chuan-Seng

Journal:

physica status solidi (RRL) - Rapid Research Letters

Year:

2020

File:

PDF, 1.17 MB

2020

148

Comparison of 4 modalities for distant metastasis staging in endemic nasopharyngeal carcinoma

Melvin Lee Kiang Chua, Seng Chuan Ong, Joseph Tien Seng Wee, David Chee Eng Ng, Fei Gao, Terence Wee Kiat Tan, Kam Weng Fong, Eu Tiong Chua, James Boon Kheng Khoo, John Seng Hooi Low

Journal:

Year:

2009

Language:

english

File:

PDF, 206 KB

english, 2009

149

[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Recent progress in copper-based wafer bonding for 3-D ICs application

Tan, Chuan Seng

Year:

2008

Language:

english

File:

PDF, 1.50 MB

english, 2008

150

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits

Made, Riko I, Peng Lan,, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng

Year:

2011

Language:

english

File:

PDF, 3.01 MB

english, 2011

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