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1

High-throughput determination of the antigen specificities of T cell receptors in single cells

Zhang, Shu-Qi, Ma, Ke-Yue, Schonnesen, Alexandra A, Zhang, Mingliang, He, Chenfeng, Sun, Eric, Williams, Chad M, Jia, Weiping, Jiang, Ning

Journal:

Nature Biotechnology

Year:

2018

Language:

english

File:

PDF, 3.80 MB

english, 2018

2

Field-driven evolution of chiral spin textures in a thin helimagnet nanodisk

Du, Haifeng, Ning, Wei, Tian, Mingliang, Zhang, Yuheng

Journal:

Physical Review B

Year:

2013

Language:

english

File:

PDF, 2.50 MB

english, 2013

3

Liquid-state and solid-state interfacial reactions between Sn–Ag–Cu–Fe composite solders and Cu substrate

Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2014

Language:

english

File:

PDF, 1.83 MB

english, 2014

4

Lifespan extension by n-butanol extract from seed of Platycladus orientalis in Caenorhabditis elegans

Liu, Haibin, Liang, Fengyin, Su, Weiwei, Wang, Ning, Lv, Mingliang, Li, Peibo, Pei, Zhong, Zhang, Yan, Xie, Xiang-Qun, Wang, Lirong, Wang, Yonggang

Journal:

Journal of Ethnopharmacology

Year:

2013

Language:

english

File:

PDF, 683 KB

english, 2013

5

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Study on short time interfacial reactions between Sn-3.0Ag-0.5Cu solder balls and ENEPIG pads

Yang, Fan, Huang, Mingliang, Zhao, Ning

Year:

2012

Language:

english

File:

PDF, 1.58 MB

english, 2012

6

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Simulation of IMC layer growth and Cu consumption in Sn-Ag-xCu/Cu solder joints during reflow

Wang, Xiaohui, Huang, Mingliang, Yang, Fan, Zhao, Ning

Year:

2012

Language:

english

File:

PDF, 1.17 MB

english, 2012

7

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi solder

Liu, Xiaoying, Huang, Mingliang, Zhao, Ning

Year:

2012

Language:

english

File:

PDF, 1.03 MB

english, 2012

8

In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process

Qu, Lin, Zhao, Ning, Ma, Haitao, Zhao, Huijing, Huang, Mingliang

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 2.14 MB

english, 2015

9

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Drop failure modes of a wafer-level chip-scale packaging

Huang, Mingliang, Liu, Shuang, Zhao, Ning, Long, Haohui, Li, Jianhui, Hong, Weiqiang

Year:

2013

Language:

english

File:

PDF, 1.50 MB

english, 2013

10

Formation mechanism and kinetic analysis of the morphology of Cu6Sn5in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling stage

Guo, Bingfeng, Ma, Haitao, Jiang, Chengrong, Wang, Yunpeng, Kunwar, Anil, Zhao, Ning, Huang, Mingliang

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2017

Language:

english

File:

PDF, 1.23 MB

english, 2017

11

Real-Time Parking Occupancy Detection for Gas Stations Based on Haar-AdaBoosting and CNN

Xiang, Xuezhi, Lv, Ning, Zhai, Mingliang, El Saddik, Abdulmotaleb

Journal:

IEEE Sensors Journal

Year:

2017

Language:

english

File:

PDF, 1.88 MB

english, 2017

12

Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows

Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, Ma, Haitao

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2018

Language:

english

File:

PDF, 2.75 MB

english, 2018

13

A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn–58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications

Zhang, Shuye, Lin, Tiesong, He, Peng, Zhao, Ning, Huang, Mingliang, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 3.01 MB

english, 2017

14

Corrigendum to “On the increase of intermetallic compound’s thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215]

Kunwar, Anil, Ma, Haoran, Ma, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang

Journal:

Materials Letters

Year:

2018

Language:

english

File:

PDF, 210 KB

english, 2018

15

Design and Analysis of a Novel Converter Topology for Photovoltaic Pumps Based on Switched Reluctance Motor

Zan, Xiaoshu, Wu, Ning, Xu, Ruidong, Cui, Mingliang, Jiang, Zhikai, Ni, Kai, Alkahtani, Mohammed

Journal:

Year:

2019

File:

PDF, 6.24 MB

2019

16

Optical flow estimation using channel attention mechanism and dilated convolutional neural networks

Zhai, Mingliang, Xiang, Xuezhi, Zhang, Rongfang, Lv, Ning, Saddik, Abdulmotaleb El

Journal:

Year:

2019

Language:

english

File:

PDF, 2.86 MB

english, 2019

17

ProbIDtree: An automated software program capable of identifying multiple peptides from a single collision-induced dissociation spectrum collected by a tandem mass spectrometer

Ning Zhang, Xiao-jun Li, Mingliang Ye, Sheng Pan, Benno Schwikowski, Ruedi Aebersold

Journal:

Year:

2005

Language:

english

File:

PDF, 381 KB

english, 2005

18

Patterned growth of vertically aligned silicon nanowire arrays for label-free DNA detection using surface-enhanced Raman spectroscopy

Changqing Yi, Cheuk-Wing Li, Huayang Fu, Mingliang Zhang, Suijian Qi, Ning-Bew Wong, Shuit-Tong Lee, Mengsu Yang

Journal:

Analytical and Bioanalytical Chemistry

Year:

2010

Language:

english

File:

PDF, 1.14 MB

english, 2010

19

The promotion of neurite sprouting and outgrowth of mouse hippocampal cells in culture by graphene substrates

Ning Li, Xuemin Zhang, Qin Song, Ruigong Su, Qi Zhang, Tao Kong, Liwei Liu, Gang Jin, Mingliang Tang, Guosheng Cheng

Journal:

Year:

2011

Language:

english

File:

PDF, 1.80 MB

english, 2011

20

Evaluation of antitumour activity of tea carbohydrate polymers in hepatocellular carcinoma animals

Bendong Chen, Wenyan Zhou, Mingliang Ning, Zuozheng Wang, Lili Zou, Haihua Zhang, Qi Wang

Journal:

International Journal of Biological Macromolecules

Year:

2012

Language:

english

File:

PDF, 1009 KB

english, 2012

21

Ordered silicon nanowire arrays via nanosphere lithography and metal-induced etching

Peng, Kuiqing, Zhang, Mingliang, Lu, Aijiang, Wong, Ning-Bew, Zhang, Ruiqin, Lee, Shuit-Tong

Journal:

Applied Physics Letters

Year:

2007

Language:

english

File:

PDF, 707 KB

english, 2007

22

Magnetic vortex with skyrmionic core in a thin nanodisk of chiral magnets

Du, Haifeng, Ning, Wie, Tian, Mingliang, Zhang, Yuheng

Journal:

EPL (Europhysics Letters)

Year:

2013

Language:

english

File:

PDF, 1.67 MB

english, 2013

23

Three-dimensional graphene foam as a biocompatible and conductive scaffold for neural stem cells

Li, Ning, Zhang, Qi, Gao, Song, Song, Qin, Huang, Rong, Wang, Long, Liu, Liwei, Dai, Jianwu, Tang, Mingliang, Cheng, Guosheng

Journal:

Scientific Reports

Year:

2013

Language:

english

File:

PDF, 3.55 MB

english, 2013

24

Dual evidence of surface Dirac states in thin cylindrical topological insulator Bi2Te3 nanowires

Tian, Mingliang, Ning, Wei, Qu, Zhe, Du, Haifeng, Wang, Jian, Zhang, Yuheng

Journal:

Scientific Reports

Year:

2013

Language:

english

File:

PDF, 1.15 MB

english, 2013

25

One-dimensional weak antilocalization in single-crystal Bi2Te3 nanowires

Ning, Wei, Du, Haifeng, Kong, Fengyu, Yang, Jiyong, Han, Yuyan, Tian, Mingliang, Zhang, Yuheng

Journal:

Scientific Reports

Year:

2013

Language:

english

File:

PDF, 876 KB

english, 2013

26

A new isoindigo-based molecule with ideal energy levels for solution-processable organic solar cells

Wang, Ting, Chen, Yanhua, Bao, Xichang, Du, Zhengkun, Guo, Jing, Wang, Ning, Sun, Mingliang, Yang, Renqiang

Journal:

Dyes and Pigments

Year:

2013

Language:

english

File:

PDF, 680 KB

english, 2013

27

Tailoring the interlayer interaction between doxorubicin-loaded graphene oxide nanosheets by controlling the drug content

Zhang, Qi, Li, Weiwei, Kong, Tao, Su, Ruigong, Li, Ning, Song, Qin, Tang, Mingliang, Liu, Liwei, Cheng, Guosheng

Journal:

Year:

2013

Language:

english

File:

PDF, 1.56 MB

english, 2013

28

Enhancement of electrical signaling in neural networks on graphene films

Tang, Mingliang, Song, Qin, Li, Ning, Jiang, Ziyun, Huang, Rong, Cheng, Guosheng

Journal:

Year:

2013

Language:

english

File:

PDF, 2.83 MB

english, 2013

29

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Effects of cooling rate and solder volume on the formation of large Ag3Sn plates in Sn-Ag based solder joints

Zhou, Qiang, Huang, Mingliang, Zhao, Ning, Zhang, Zhijie

Year:

2012

Language:

english

File:

PDF, 735 KB

english, 2012

30

Highly Stable Skyrmion State in Helimagnetic MnSi Nanowires

Du, Haifeng, DeGrave, John P., Xue, Fei, Liang, Dong, Ning, Wei, Yang, Jiyong, Tian, Mingliang, Zhang, Yuheng, Jin, Song

Journal:

Year:

2014

Language:

english

File:

PDF, 2.56 MB

english, 2014

31

The acute cytotoxicity of bismuth ferrite nanoparticles on PC12 cells

Song, Qin, Liu, Yongping, Jiang, Ziyun, Tang, Mingliang, Li, Ning, Wei, Fenfen, Cheng, Guosheng

Journal:

Journal of Nanoparticle Research

Year:

2014

Language:

english

File:

PDF, 3.89 MB

english, 2014

32

Graphene meets biology

Li, Ning, Cheng, Yilin, Song, Qin, Jiang, Ziyun, Tang, Mingliang, Cheng, Guosheng

Journal:

Chinese Science Bulletin

Year:

2014

Language:

english

File:

PDF, 4.84 MB

english, 2014

33

Synthesis and photovoltaic properties of conjugated D-A copolymers based on thienyl substituted pyrene and diketopyrrolopyrrole for polymer solar cells

Wang, Ning, Bao, Xichang, Yan, Yan, Ouyang, Dan, Sun, Mingliang, Roy, V. A. L., Lee, Chun Sing, Yang, Renqiang

Journal:

Journal of Polymer Science Part A: Polymer Chemistry

Year:

2014

Language:

english

File:

PDF, 572 KB

english, 2014

34

Large Negative Magnetoresistance Induced by Anionic Solid Solutions in Two-Dimensional Spin-Frustrated Transition Metal Chalcogenides

Guo, Yuqiao, Dai, Jun, Zhao, Jiyin, Wu, Changzheng, Li, Dianqi, Zhang, Lidong, Ning, Wei, Tian, Mingliang, Zeng, Xiao Cheng, Xie, Yi

Journal:

Physical Review Letters

Year:

2014

Language:

english

File:

PDF, 1.42 MB

english, 2014

35

Thickness dependence of the charge-density-wave transition temperature in VSe2

Yang, Jiyong, Wang, Weike, Liu, Yan, Du, Haifeng, Ning, Wei, Zheng, Guolin, Jin, Chiming, Han, Yuyan, Wang, Ning, Yang, Zhaorong, Tian, Mingliang, Zhang, Yuheng

Journal:

Applied Physics Letters

Year:

2014

Language:

english

File:

PDF, 962 KB

english, 2014

36

A Polyoxometalate-Assisted Electrochemical Method for Silicon Nanostructures Preparation: From Quantum Dots to Nanowires

Kang, Zhenhui, Tsang, Chi Him A., Zhang, Zhendong, Zhang, Mingliang, Wong, Ning-bew, Zapien, J. Antonio, Shan, Yueyue, Lee, Shuit-Tong

Journal:

Journal of the American Chemical Society

Year:

2007

Language:

english

File:

PDF, 132 KB

english, 2007

37

Evidence of Topological Two-Dimensional Metallic Surface States in Thin Bismuth Nanoribbons

Ning, Wei, Kong, Fengyu, Xi, Chuanying, Graf, David, Du, Haifeng, Han, Yuyan, Yang, Jiyong, Yang, Kun, Tian, Mingliang, Zhang, Yuheng

Journal:

Year:

2014

Language:

english

File:

PDF, 1.78 MB

english, 2014

38

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based solder

Kang, Ning, Huang, Mingliang, Zhou, Qiang, Ma, Haitao

Year:

2011

Language:

english

File:

PDF, 2.75 MB

english, 2011

39

Synthesis of amphiphilic reduced graphene oxide with an enhanced charge injection capacity for electrical stimulation of neural cells

Zhang, Qi, Xu, Jun, Song, Qin, Li, Ning, Zhang, Zhaolei, Li, Kunyang, Du, Yuyang, Wu, Liqiong, Tang, Mingliang, Liu, Liwei, Cheng, Guosheng, Liu, Jian

Journal:

Journal of Materials Chemistry B

Year:

2014

Language:

english

File:

PDF, 612 KB

english, 2014

40

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Interfacial reactions between Cu single crystals and lead-free solders during solid-state aging

Liu, Ting, Huang, Mingliang, Zhao, Ning

Year:

2012

Language:

english

File:

PDF, 1.88 MB

english, 2012

41

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Mechanical property and electrochemical corrosion behavior of Al/Sn-9Zn-XNi/Cu joints

Huang, Yingzhuo, Huang, Mingliang, Ning Kang,

Year:

2010

Language:

english

File:

PDF, 5.39 MB

english, 2010

42

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Interfacial reaction in Cu/Sn/Cu fine pitch interconnect during soldering

Huang, Mingliang, Liu, Ting, Zhao, Ning, Hao, Hua

Year:

2013

Language:

english

File:

PDF, 1.17 MB

english, 2013

43

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects

Huang, Mingliang, Yang, Fan, Zhao, Ning, Liu, Xiaohua, Wang, Jingyun

Year:

2014

Language:

english

File:

PDF, 1.03 MB

english, 2014

44

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Reverse polarity effect in Cu/Sn-9Zn/Ni interconnect under high current density at high temperature

Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, Feng, Xiaofei

Year:

2014

Language:

english

File:

PDF, 811 KB

english, 2014

45

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5

Qu, Lin, Ma, Haitao, Zhao, Huijing, Zhao, Ning, Kunwar, Anil, Huang, Mingliang

Year:

2013

Language:

english

File:

PDF, 1.08 MB

english, 2013

46

Highly Flexible and Lightweight Organic Solar Cells on Biocompatible Silk Fibroin

Liu, Yuqiang, Qi, Ning, Song, Tao, Jia, Mingliang, Xia, Zhouhui, Yuan, Zhongcheng, Yuan, Wei, Zhang, Ke-Qin, Sun, Baoquan

Journal:

ACS Applied Materials & Interfaces

Year:

2014

Language:

english

File:

PDF, 3.51 MB

english, 2014

47

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Study on liquid-solid electromigration in Cu/Sn-9Zn/Cu interconnect using synchrotron radiation real-time in situ imaging technology

Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, Feng, Xiaofei

Year:

2013

Language:

english

File:

PDF, 537 KB

english, 2013

48

Robust surface state transport in thin bismuth nanoribbons

Ning, Wei, Kong, Fengyu, Han, Yuyan, Du, Haifeng, Yang, Jiyong, Tian, Mingliang, Zhang, Yuheng

Journal:

Scientific Reports

Year:

2014

Language:

english

File:

PDF, 866 KB

english, 2014

49

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects

Huang, Mingliang, Zhang, Fei, Yang, Fan, Zhao, Ning

Year:

2014

Language:

english

File:

PDF, 1.34 MB

english, 2014

50

[IEEE 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems (ICECS) - Abu Dhabi, United Arab Emirates (2013.12.8-2013.12.11)] 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems (ICECS) - A monolithic 12-bit digitally calibrated D/A converter

Liu, Hong, Tang, Ning, Wang, Mingliang, Xia, Zhao, Zhang, Ke, Tong, Tian

Year:

2013

Language:

english

File:

PDF, 539 KB

english, 2013