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51

Distributions of load stresses and residual stresses at notches

Journal:

Journal of Mechanical Science and Technology

Year:

1992

Language:

english

File:

PDF, 657 KB

english, 1992

52

Evaluation of stress intensity factor for a partially patched crack using an approximate weight function

Jong-Ho Kim, Seong-Gu Hong, Soon-Bok Lee

Journal:

Journal of Mechanical Science and Technology

Year:

2003

Language:

english

File:

PDF, 360 KB

english, 2003

53

Fatigue and fracture assessment for reliability in electronics packaging

Soon-Bok Lee, Ilho Kim, Tae-Sang Park

Journal:

International Journal of Fracture

Year:

2008

Language:

english

File:

PDF, 1.27 MB

english, 2008

54

Alcohol-induced bone degradation and its early detection in the alcohol-fed castrated rats

Sun Hee Do, Won Il Jeong, Da Hee Jeong, Mi-Ran Ki, In-Seon Lee, Dong-Mi Kwak, Tae Hwan Kim, Yoo Kyeong Kim, Soon-Bok Kim, Kyu-Shik Jeong

Journal:

Molecular and Cellular Biochemistry

Year:

2006

Language:

english

File:

PDF, 847 KB

english, 2006

55

A study on the thermomechanical behavior of semiconductor chips on thin silicon substrate

Jae Hyuk Lim, ManHee Han, Jun-Youn Lee, Youn Young Earmme, Soon-bok Lee, Seyoung Im

Journal:

Journal of Mechanical Science and Technology

Year:

2008

Language:

english

File:

PDF, 777 KB

english, 2008

56

Fatigue strength and fracture mechanism of ceramic-metal joints under cyclic bending

Soon-Bok Lee, H. Kobayashi, J.-W. Huh

Journal:

International Journal of Fatigue

Year:

1995

Language:

english

File:

PDF, 796 KB

english, 1995

57

A critical review on multiaxial fatigue assessments of metals

Bong-Ryul You, Soon-Bok Lee

Journal:

International Journal of Fatigue

Year:

1996

Language:

english

File:

PDF, 1.14 MB

english, 1996

58

A new energy-based fatigue damage parameter in life prediction of high-temperature structural materials

Keum-Oh Lee, Seong-Gu Hong, Soon-Bok Lee

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 859 KB

english, 2008

59

Structural damage identification of a cantilever beam using excitation force level control

Do-Gyoon Kim, Soon-Bok Lee

Journal:

Mechanical Systems and Signal Processing

Year:

2010

Language:

english

File:

PDF, 1.35 MB

english, 2010

60

The effect of temperature on low-cycle fatigue behavior of prior cold worked 316L stainless steel

Seong-Gu Hong, Samson Yoon, Soon-Bok Lee

Journal:

International Journal of Fatigue

Year:

2003

Language:

english

File:

PDF, 447 KB

english, 2003

61

A tensile crack in creeping solids with large damage near the crack tip

Jin-Young Kim, Soon-Bok Lee

Journal:

International Journal of Fracture

Year:

2001

Language:

english

File:

PDF, 147 KB

english, 2001

62

Competing damage mechanisms in the thermo-mechanical fatigue of AISI 304L stainless steel

Keun-Ho Bae, Hyun-Ho Kim, Soon-Bok Lee

Journal:

Materials Science and Engineering: A

Year:

2011

Language:

english

File:

PDF, 1.60 MB

english, 2011

63

Modeling of materials behavior at various temperatures of hot isostatically pressed superalloys

Keum-Oh Lee, Soon-Bok Lee

Journal:

Materials Science and Engineering: A

Year:

2012

Language:

english

File:

PDF, 770 KB

english, 2012

64

Fatigue of polymer-supported Ag thin films

Gi-Dong Sim, Yun Hwangbo, Hyun-Ho Kim, Soon-Bok Lee, Joost J. Vlassak

Journal:

Scripta Materialia

Year:

2012

Language:

english

File:

PDF, 548 KB

english, 2012

65

[IEEE 5th ACIS International Conference on Software Engineering Research, Management & Applications (SERA 2007) - Busan, Korea (2007.08.20-2007.08.22)] 5th ACIS International Conference on Software Engineering Research, Management & Applications (SERA 2007) - An Approach to Analyzing Commonality and Variability of Features using Ontology in a Software Product Line Engineering

Lee, Soon-Bok, Kim, Jin-Woo, Song, Chee-Yang, Baik, Doo-Kwon

Year:

2007

Language:

english

File:

PDF, 457 KB

english, 2007

66

Tensile and fatigue behaviors of printed Ag thin films on flexible substrates

Sim, Gi-Dong, Won, Sejeong, Lee, Soon-Bok

Journal:

Applied Physics Letters

Year:

2012

Language:

english

File:

PDF, 1.12 MB

english, 2012

67

Effects of stretching and cycling on the fatigue behavior of polymer-supported Ag thin films

Sim, Gi-Dong, Lee, Yong-Seok, Lee, Soon-Bok, Vlassak, Joost J.

Journal:

Materials Science and Engineering: A

Year:

2013

Language:

english

File:

PDF, 1.55 MB

english, 2013

68

Double-layer CVD graphene as stretchable transparent electrodes

Won, Sejeong, Hwangbo, Yun, Lee, Seoung-Ki, Kim, Kyung-Shik, Kim, Kwang-Seop, Lee, Seung-Mo, Lee, Hak-Joo, Ahn, Jong-Hyun, Kim, Jae-Hyun, Lee, Soon-Bok

Journal:

Year:

2014

Language:

english

File:

PDF, 1.91 MB

english, 2014

69

An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope

Sim, Gi-Dong, Park, Jun-Hyub, Uchic, Michael D., Shade, Paul A., Lee, Soon-Bok, Vlassak, Joost J.

Journal:

Acta Materialia

Year:

2013

Language:

english

File:

PDF, 3.09 MB

english, 2013

70

National Directory for Dermatologic Meetings

Sim, Gi-Dong, Park, Jun-Hyub, Uchic, Michael D., Shade, Paul A., Lee, Soon-Bok, Vlassak, Joost J.

Journal:

Journal of the American Academy of Dermatology

Year:

1981

Language:

english

File:

PDF, 67 KB

english, 1981

71

Interlayer non-coupled optical properties for determining the number of layers in arbitrarily stacked multilayer graphenes

Hwangbo, Yun, Lee, Choong-Kwang, Mag-Isa, Alexander E., Jang, Jae-Won, Lee, Hak-Joo, Lee, Soon-Bok, Kim, Seong-Su, Kim, Jae-Hyun

Journal:

Year:

2014

Language:

english

File:

PDF, 1.06 MB

english, 2014

72

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Isothermal low cycle fatigue tests of Sn/3.5Ag/0.75Cu and 63Sn/37Pb solder joints under mixed-mode loading cases

Tae-Sang Park,, Soon-Bok Lee,

Year:

2002

Language:

english

File:

PDF, 548 KB

english, 2002

73

[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - The effect of T/sub g/ on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling

Woon-Seong Kwon,, Se-Young Yang,, Soon-Bok Lee,, Kyung-Wook Paik,

Year:

2004

Language:

english

File:

PDF, 567 KB

english, 2004

74

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - A Comparative Study on Thermal and Mechanical Fatigue Behavior for Lead-Free Solder Joints

Kim, Ilho, Lee, Soon-Bok

Year:

2006

Language:

english

File:

PDF, 10.05 MB

english, 2006

75

[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - In-situ moire measurement of adhesive flip-chip bonded assembly under thermal cycling condition

Suk-Jin Ham,, Woon-Seong Kwon,, Kyung-Wook Paik,, Soon-Bok Lee,

Year:

2002

Language:

english

File:

PDF, 567 KB

english, 2002

76

[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Mechanical fatigue tests of solder joint under mixed-mode loading cases

Tae-Sang Park,, Soon-Bok Lee,

Year:

2001

Language:

english

File:

PDF, 471 KB

english, 2001

77

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - High resolution AFM Moiré technique for the detection of defects in nano structure

Jin-Hyoung Park,, Soon-Bok Lee,

Year:

2007

Language:

english

File:

PDF, 5.74 MB

english, 2007

78

[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Measurement of thermo-mechanical deformations of wafer-level CSP assembly under thermal cycling condition

Suk-Jin Ham,, Soon-Bok Lee,

Year:

2001

Language:

english

File:

PDF, 545 KB

english, 2001

79

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Hygrothermal analysis for the electrochemical migration failure in multi-chip packages during a highly accelerated stress test

Jongguk Choe,, Jae-Won Jang,, Nam-Seog Kim,, Soon-Bok Lee,

Year:

2012

Language:

english

File:

PDF, 420 KB

english, 2012

80

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Reliability Evaluation for Flip-Chip Electronic Packages under High Temperature and Moisture Condition using Moiré

Park, Jin-Hyoung, Jang, Kyung-Woon, Paik, Kyung-Wook, Lee, Soon-Bok

Year:

2008

Language:

english

File:

PDF, 3.36 MB

english, 2008

81

[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Numerical analysis of the formation of coined solder bumps

Tae-Kyung Hwang,, Soon-Bok Lee,, Jae-Woong Nah,, Kyung-Wook Paik,

Year:

2001

Language:

english

File:

PDF, 655 KB

english, 2001

82

[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Reliability Assessment of BGA Solder Joints under Cyclic Bending Loads

Kim Ilho,, Lee Soon-Bok,

Year:

2005

Language:

english

File:

PDF, 3.16 MB

english, 2005

83

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Studies on the Thermal Cycling Reliability of Fine Pitch Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates: Experimental Results and Numerical Analysis

Son, Ho-Young, Paik, Kyung-Wook, Kim, Ilho, Park, Jin-Hyoung, Lee, Soon-Bok, Jung, Gi-Jo, Park, Byung-Jin, Byun, Kwang-Yoo

Year:

2008

Language:

english

File:

PDF, 9.46 MB

english, 2008

84

Statistical description of history-dependent creep constitutive equations for viscoelastic media

Meng, Lu, Lee, Soon-Bok

Journal:

Physical Review B

Year:

1995

Language:

english

File:

PDF, 523 KB

english, 1995

85

[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Effects of the Functional Groups of Non-Conductive Films (NCFs) on Materials Properties and Reliability of NCF Flip-Chip-On-Organic Boards

Chang-Kyu Chung,, Woon-Seong Kwon,, Jin-Hyoung Park,, Soon-Bok Lee,, Kyung-Wook Paik,

Year:

2005

Language:

english

File:

PDF, 2.80 MB

english, 2005

86

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - Thermally induced deformation measurement of through-silicon via (TSV) structures using an atomic force microscope (AFM) moiré method

Jang, Jae-Won, Lee, Soon-Bok

Year:

2012

Language:

english

File:

PDF, 1.28 MB

english, 2012

87

Improving the stretchability of as-deposited Ag coatings on poly-ethylene-terephthalate substrates through use of an acrylic primer

Sim, Gi-Dong, Won, Sejeong, Jin, Chun-yan, Park, Inkyu, Lee, Soon-Bok, Vlassak, Joost J.

Journal:

Journal of Applied Physics

Year:

2011

Language:

english

File:

PDF, 2.88 MB

english, 2011

88

Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications

Son, Ho-Young, Kim, Ilho, Lee, Soon-Bok, Jung, Gi-Jo, Park, Byung-Jin, Paik, Kyung-Wook

Journal:

Journal of Applied Physics

Year:

2009

Language:

english

File:

PDF, 1.33 MB

english, 2009

89

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

Ho-Young Son,, Ilho Kim,, Park, Jin-Hyoung, Soon-Bok Lee,, Gi-Jo Jung,, Park, Byung-Jin, Kyung-Wook Paik,

Year:

2008

Language:

english

File:

PDF, 2.58 MB

english, 2008

90

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection

Woon-Seong Kwon,, Se-Young Yang,, Soon-Bok Lee,, Kyung-Wook Paik,

Year:

2005

Language:

english

File:

PDF, 655 KB

english, 2005

91

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications

Ho-Young Son,, Il-Ho Kim,, Soon-Bok Lee,, Gi-Jo Jung,, Byung-Jin Park,, Kyung-Wook Paik,

Year:

2007

Language:

english

File:

PDF, 2.49 MB

english, 2007

92

[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Cyclic stress-strain measurement tests of Sn3.5Ag0.75Cu solder joint

Tae-Sang Park,, Soon-Bok Lee,

Year:

2002

Language:

english

File:

PDF, 449 KB

english, 2002

93

[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Evaluation of Thermal Deformation Behavior in Electronic Package using UV moire interferometry

Jin-Hyoung Park,, Soon-Bok Lee,

Year:

2005

Language:

english

File:

PDF, 3.73 MB

english, 2005

94

SPIE Proceedings [SPIE Fourth International Conference on Experimental Mechanics - Singapore, Singapore (Wednesday 18 November 2009)] Fourth International Conference on Experimental Mechanics - Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

Jang, Jae-Won, Suk, Kyoung-Lim, Paik, Kyung-Wook, Lee, Soon-Bok, Quan, Chenggen, Qian, Kemao, Asundi, Anand K., Chau, Fook S.

Year:

2010

Language:

english

File:

PDF, 1.69 MB

english, 2010

95

The effect of specimen geometry on the low cycle fatigue life of metallic materials

Bae, Keun-Ho, Lee, Soon-Bok

Journal:

Materials at High Temperatures

Year:

2011

Language:

english

File:

PDF, 2.65 MB

english, 2011

96

Statistical Characteristics of Fatigue Failure of Copper Thin Films

Jang, Jae-Won, Hwangbo, Yun, Kim, Jae-Hyun, Lee, Hak-Joo, Mag-isa, Alexander E., Lee, Soon-Bok

Journal:

Journal of Engineering Materials and Technology

Year:

2013

Language:

english

File:

PDF, 8.57 MB

english, 2013

97

Graphene meta-interface for enhancing the stretchability of brittle oxide layers

Won, Sejeong, Jang, Jae-Won, Choi, Hyung Jin, Kim, Chang-Hyun, Lee, Sang Bong, Hwangbo, Yun, Kim, Kwang-Seop, Yoon, Soon-Gil, Lee, Hak-Joo, Lee, Soon-Bok, Kim, Jae-Hyun

Journal:

Year:

2015

Language:

english

File:

PDF, 1.33 MB

english, 2015

98

Numerical and experimental investigation of a complete contact problem by comparing with an asymptotic analysis

Jang, Jae-Won, Kim, Hyung-Kyu, Lee, Soon-Bok

Journal:

International Journal of Solids and Structures

Year:

2016

Language:

english

File:

PDF, 2.31 MB

english, 2016

99

SPIE Proceedings [SPIE International Conference on Experimental Mechanics 2014 - Singapore, Singapore (Saturday 15 November 2014)] International Conference on Experimental Mechanics 2014 - Temperature aspect of degradation of electrochemical double-layer capacitors (EDLC)

Quan, Chenggen, Qian, Kemao, Asundi, Anand, Chau, Fook Siong, Baek, Dong-Cheon, Kim, Hyun-Ho, Lee, Soon-Bok

Year:

2015

Language:

english

File:

PDF, 868 KB

english, 2015

100

[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF

Se Young Yang,, Soon-Bok Lee,, Woon-Seong Kwon,, Kyung-Wook Paik,

Year:

2002

Language:

english

File:

PDF, 316 KB

english, 2002