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51

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Wafer-level chip-to-Wafer (C2W) integration of high-sensitivity MEMS and ICs

Xu, Gaowei, Yan, Peili, Chen, Xiao, Ning, Wenguo, Luo, Le, Jiao, Jiwei

Year:

2011

Language:

english

File:

PDF, 3.30 MB

english, 2011

52

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Indium bump fabricated with electroplating method

Huang, Qiuping, Xu, Gaowei, Luo, Le

Year:

2009

Language:

english

File:

PDF, 2.08 MB

english, 2009

53

[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Vacuum Packaging Process Simulation for MEMS Devices

Cheng, Yingjun, Xu, Gaowei, Zhu, Dapeng, Xu, Wei, Luo, Le

Year:

2006

Language:

english

File:

PDF, 251 KB

english, 2006

54

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - System-level thermal management modeling of a supercomputer chassis

Gaowei Xu,, Yingjun Cheng,, Dapeng Zhu,, Xiaoqin Lin,, Le Luo,

Year:

2005

Language:

english

File:

PDF, 457 KB

english, 2005

55

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Development of flip-chip interconnections of photodetector readout circuit (ROIC)

Xu, Gaowei, Huang, Qiuping, Yuan Yuan,, Xiao Chen,, Luo, Le

Year:

2010

Language:

english

File:

PDF, 969 KB

english, 2010

56

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Development of three-dimensional multichip module based on embedded substrate with multiple interconnections

Gaowei Xu,, Yanhong Wu,, Fei Geng,, Qiuping Huang,, Jian Zhou,, Le Luo,

Year:

2008

Language:

english

File:

PDF, 1.32 MB

english, 2008

57

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Reliability evalution of low-cost bumping by laser jetting Sn-Ag-Cu solder on electroless Ni/Au UBM

Gai, Wei, Luo, Le, Xu, Gaowei

Year:

2013

Language:

english

File:

PDF, 1.46 MB

english, 2013

58

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Analysis of the phenomenon of falling off of indium bumps from substrate during reflow process

Qiuping Huang,, Dongliang wang,, Gaowei Xu,, Yuan Yuan,, Quan wang,, Le Luo,

Year:

2010

Language:

english

File:

PDF, 1.05 MB

english, 2010

59

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Thermo-mechanical Reliability Study of High I/Os Flip Chip On Laminated Substrate Based on FEA, RSM and Interfacial Fracture Mechanics

Yingjun Cheng,, Gaowei Xu,, Dapeng Zhu,, Xiaoqin Lin,, Le Luo,

Year:

2005

Language:

english

File:

PDF, 478 KB

english, 2005

60

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Lead Free SnAg Solder Bumping with Size sub 100 Microns

Lin, Xiaoqin, Zhu, Dapeng, Xu, Gaowei, Le Luo,

Year:

2006

Language:

english

File:

PDF, 5.48 MB

english, 2006

61

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Studies on fabrication of high density MCM-D substrate by aluminum anodization techniques

Dapeng Zhu,, Lichun Wang,, Yingjun Cheng,, Gaowei Xu,, Le Luo,

Year:

2005

Language:

english

File:

PDF, 309 KB

english, 2005

62

[IEEE 2013 IEEE 10th International Conference on ASIC (ASICON 2013) - Shenzhen, China (2013.10.28-2013.10.31)] 2013 IEEE 10th International Conference on ASIC - Low power design for FIR filter

Gaowei Xu,, Yao Zou,, Jun Han,, Xiaoyang Zeng,

Year:

2013

Language:

english

File:

PDF, 231 KB

english, 2013

63

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Analysis of thermal stresses in redistribution layer of WLP with different arrangement of interconnections

Zhu, Chunsheng, Ning, Wenguo, Ye, Jiaotuo, Xu, Gaowei, Luo, Le

Year:

2013

Language:

english

File:

PDF, 585 KB

english, 2013

64

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - A novel wafer-level metal/BCB interconnection between both sides of wafer using TSV and its microwave performance

Tang, Jiajie, Chen, Xiao, Xu, Gaowei, Luo, Le

Year:

2012

Language:

english

File:

PDF, 2.56 MB

english, 2012

65

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Warpage and Reliability of Three-dimensional Multi-chip Module with High Density Embedded Substrate

Xu, Gaowei, Zhou, Jian, Le Luo,

Year:

2007

Language:

english

File:

PDF, 2.80 MB

english, 2007

66

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A novel redistribution layer tailored by nanotwinned copper decreases warpage in wafer level packaging

Li, Heng, Ning, Wenguo, Zhu, Chunsheng, Xu, Gaowei, Luo, Le

Year:

2014

Language:

english

File:

PDF, 3.19 MB

english, 2014

67

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Wet etching of vias for wafer level packaging of GaAs based image sensor

Wang, Shuangfu, Han, Mei, Xu, Gaowei, Luo, le

Year:

2012

Language:

english

File:

PDF, 756 KB

english, 2012

68

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Warpage and stress optimization of wafer-level package of MEMS with glass frit bonding

Xu, Gaowei, Zhu, Chunsheng, Ye, Jiaotuo, Li, Heng, Gai, Wei, Luo, Le

Year:

2014

Language:

english

File:

PDF, 441 KB

english, 2014

69

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Thermal analysis for multichip module using computational fluid dynamic simulation

Cheng Yingjun,, Zhu Wenjie,, Zhu Rui,, Xu Gaowei,, Luo Le,

Year:

2004

Language:

english

File:

PDF, 510 KB

english, 2004

70

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Superior thermal stability of redistribution layer tailored by nanotwinned copper and the influence on wafer warpage

Li, Heng, Zhu, Chunsheng, Xu, Gaowei, Luo, Le, Tian, Shenwu

Year:

2014

Language:

english

File:

PDF, 846 KB

english, 2014

71

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - TSV interposer with Au-Au diffusion bonding technology for wafer level fabrication

Chen, Xiao, Ye, Jiaotuo, Xu, Gaowei, Luo, Le

Year:

2012

Language:

english

File:

PDF, 1.14 MB

english, 2012

72

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - A combined fabrication methodology of the through wafer via for wl-package of GaAs image sensors

Ye, Jiaotuo, Wang, Shuangfu, Xu, Gaowei, Zhu, Chunsheng, Luo, Le

Year:

2012

Language:

english

File:

PDF, 1.06 MB

english, 2012

73

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - A new designed trench structure to reduce the wafer warpage in wafer level packaging process

Zhu, Chunsheng, Lee, Heng, Ye, Jiaotuo, Xu, Gaowei, Luo, Le, Zhu, Chunsheng, Lee, Heng, Ye, Jiaotuo

Year:

2014

Language:

english

File:

PDF, 850 KB

english, 2014

74

A 1.5-D Multi-Channel EEG Compression Algorithm Based on NLSPIHT

Gaowei Xu,, Jun Han,, Yao Zou,, Xiaoyang Zeng,

Journal:

IEEE Signal Processing Letters

Year:

2015

Language:

english

File:

PDF, 953 KB

english, 2015

75

[IEEE 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT) - Guilin, China (2014.10.28-2014.10.31)] 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - A 12.9-µW 2-D ECG compression core based on NLSPIHT

Xu, Gaowei, Zeng, Lingyun, Zou, Yao, Han, Jun, Zeng, Xiaoyang

Year:

2014

Language:

english

File:

PDF, 1.22 MB

english, 2014

76

A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabrication

Fei, Geng, Xiaoyun, Ding, Gaowei, Xu, Le, Luo

Journal:

Journal of Semiconductors

Year:

2009

Language:

english

File:

PDF, 608 KB

english, 2009

77

Electroplated indium bump arrays and the bonding reliability

Huang, Qiuping, Xu, Gaowei, Quan, Gang, Yuan, Yuan, Luo, Le

Journal:

Journal of Semiconductors

Year:

2010

Language:

english

File:

PDF, 2.62 MB

english, 2010

78

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Warpage characteristics of wafer-level package of MEMS with glass frit bonding

Xu, Gaowei, Wang, Shuangfu, Zhu, Chunsheng, Ye, Jiaotuo, Gai, Wei, Luo, Le

Year:

2013

Language:

english

File:

PDF, 1.04 MB

english, 2013

79

Adsorption Affinity of Different Types of Coal: Mean Isosteric Heat of Adsorption

Tang, Xu, Wang, Zhaofeng, Ripepi, Nino, Kang, Bo, Yue, Gaowei

Journal:

Year:

2015

Language:

english

File:

PDF, 2.17 MB

english, 2015

80

[ACM Press Proceeding of the 17th ACM conference - Napa Valley, California, USA (2008.10.26-2008.10.30)] Proceeding of the 17th ACM conference on Information and knowledge mining - CIKM '08 - AdaSum

Zhang, Jin, Cheng, Xueqi, Wu, Gaowei, Xu, Hongbo

Year:

2008

Language:

english

File:

PDF, 443 KB

english, 2008

81

Physical simulation of temperature influence on methane sorption and kinetics in coal: Benefits of temperature under 273.15K

Wang, Zhaofeng, Tang, Xu, Yue, Gaowei, Kang, Bo, Xie, Ce, Li, Xiaojun

Journal:

Year:

2015

Language:

english

File:

PDF, 1.54 MB

english, 2015

82

Development of seed layer deposition and fast copper electroplating into deep microvias for three-dimensional integration

Luo, Le, Xu, Gaowei, Chen, Xiao

Journal:

Micro & Nano Letters

Year:

2013

Language:

english

File:

PDF, 165 KB

english, 2013

83

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Thermomechanical behavior of nanotwinned copper interconnection line in wafer level packaging and the influence on wafer warpage

Li, Heng, Zhu, Chunsheng, Tian, Shenwu, Xu, Gaowei, Luo, Le

Year:

2015

Language:

english

File:

PDF, 1.33 MB

english, 2015

84

[IEEE 2015 IEEE 14th International Conference on Cognitive Informatics & Cognitive Computing (ICCICC) - Beijing, China (2015.7.6-2015.7.8)] 2015 IEEE 14th International Conference on Cognitive Informatics & Cognitive Computing (ICCICC) - Search of web service based on association rule

Wang, Lei, Xu, Lingyu, Yu, Jie, Xue, Yunlan, Zhang, Gaowei, Luo, Xiangfeng

Year:

2015

Language:

english

File:

PDF, 923 KB

english, 2015

85

Physical Simulation of Temperature Influence on Methane Sorption and Kinetics in Coal (II): Temperature Evolvement during Methane Adsorption in Coal Measurement and Modeling

Yue, Gaowei, Wang, Zhaofeng, Tang, Xu, Li, Haojun, Xie, Ce

Journal:

Year:

2015

Language:

english

File:

PDF, 1.64 MB

english, 2015

86

[IEEE 2015 27th Chinese Control and Decision Conference (CCDC) - Qingdao, China (2015.5.23-2015.5.25)] The 27th Chinese Control and Decision Conference (2015 CCDC) - Soft sensor modeling of mill level based on convolutional neural network

Wei, Jie, Guo, Lei, Xu, Xinying, Yan, Gaowei

Year:

2015

Language:

english

File:

PDF, 270 KB

english, 2015

87

[IEEE 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT) - Guilin, China (2014.10.28-2014.10.31)] 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - A configurable SVM hardware accelerator for embedded systems

Yuan, Tengyue, Xu, Gaowei, Zou, Yao, Han, Jun, Zeng, Xiaoyang

Year:

2014

Language:

english

File:

PDF, 525 KB

english, 2014

88

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Low cost fabrication of TSV-based silicon interposer using wet chemical etching and its application in 3D packaging

Ye, Jiaotuo, Chen, Xiao, Zhu, Chunsheng, Luo, Le, Xu, Gaowei

Year:

2014

File:

PDF, 523 KB

2014

89

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Design and fabrication of suspended high Q MIM capacitors by wafer level packaging technology

Zheng, Tao, Han, Mei, Xu, Gaowei, Luo, Le, Zheng, Tao

Year:

2015

Language:

english

File:

PDF, 1018 KB

english, 2015

90

[IEEE 2013 IEEE International Conference on Industrial Technology (ICIT 2013) - Cape Town (2013.2.25-2013.2.28)] 2013 IEEE International Conference on Industrial Technology (ICIT) - A novel wafer-level double side packaging and its high frequency performance

Xiao Chen,, Jiajie Tang,, Gaowei Xu,, Tie Li,, Le Luo,

Year:

2013

Language:

english

File:

PDF, 1.04 MB

english, 2013

91

[IEEE 2015 International Conference on Identification, Information, and Knowledge in the Internet of Things (IIKI) - Beijing, China (2015.10.22-2015.10.23)] 2015 International Conference on Identification, Information, and Knowledge in the Internet of Things (IIKI) - An Estimate Method of Event Influence Scope Based on Special Field

Xue, Yunlan, Xu, Lingyu, Wang, Lei, Zhang, Gaowei, Luo, Xiangfeng

Year:

2015

Language:

english

File:

PDF, 223 KB

english, 2015

92

Experimental identification of thermal induced warpage in polymer–metal composite films

Li, Heng, Zhu, Chunsheng, Xu, Gaowei, Luo, Le

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 2.09 MB

english, 2016

93

Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite

Li, Heng, Cheng, Gong, Xu, Gaowei, Luo, Le

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2016

Language:

english

File:

PDF, 1004 KB

english, 2016

94

Discovery and implications of catenary-bead subaqueous dunes

Zheng, ShuWei, Cheng, HeQin, Wu, ShuaiHu, Liu, GaoWei, Lu, XueJun, Xu, WenXiao

Journal:

SCIENCE CHINA Earth Sciences

Year:

2016

Language:

english

File:

PDF, 2.32 MB

english, 2016

95

Correction to Adsorption Affinity of Different Types of Coal: Mean Isosteric Heat of Adsorption

Tang, Xu, Wang, Zhaofeng, Ripepi, Nino, Kang, Bo, Yue, Gaowei

Journal:

Year:

2015

File:

PDF, 104 KB

2015

96

[IEEE 2007 IEEE International Conference on Granular Computing (GRC 2007) - Fremont, CA, USA (2007.11.2-2007.11.4)] 2007 IEEE International Conference on Granular Computing (GRC 2007) - Immune Evolution Algorithm Based Dynamic Path Planning Approach for the Soccer Robot

Xu, Xinying, Yan, Gaowei, Xie, Keming, Lin, T.Y.

Year:

2007

Language:

english

File:

PDF, 232 KB

english, 2007

97

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - A new designed trench structure to reduce the wafer warpage in wafer level packaging process

Zhu, Chunsheng, Lee, Heng, Ye, Jiaotuo, Xu, Gaowei, Luo, Le, Zhu, Chunsheng, Lee, Heng, Ye, Jiaotuo

Year:

2014

Language:

english

File:

PDF, 850 KB

english, 2014

98

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Warpage and stress optimization of wafer-level package of MEMS with glass frit bonding

Xu, Gaowei, Zhu, Chunsheng, Ye, Jiaotuo, Li, Heng, Gai, Wei, Luo, Le

Year:

2014

Language:

english

File:

PDF, 441 KB

english, 2014

99

[IEEE 2015 11th International Conference on Semantics, Knowledge and Grids (SKG) - Beijing, China (2015.8.19-2015.8.21)] 2015 11th International Conference on Semantics, Knowledge and Grids (SKG) - A Detection Method of Stock Event Source

Xue, Yunlan, Xu, Lingyu, Yu, Jie, Wang, Lei, Zhang, Gaowei

Year:

2015

Language:

english

File:

PDF, 243 KB

english, 2015

100

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Superior thermal stability of redistribution layer tailored by nanotwinned copper and the influence on wafer warpage

Li, Heng, Zhu, Chunsheng, Xu, Gaowei, Luo, Le, Tian, Shenwu

Year:

2014

Language:

english

File:

PDF, 846 KB

english, 2014