Schneider-Ramelow,: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application

Hu, Xiaodong, Mackowiak, Piotr, Bäuscher, Manuel, Ehrmann, Oswin, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Linke, Stefan, Ngo, Ha-Duong

Journal:

Year:

2018

Language:

english

File:

PDF, 2.33 MB

english, 2018

2

Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation

Kolbinger, E., Kuttler, S., Wagner, S., Schneider-Ramelow, M.

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 3.18 MB

2020

3

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Warpage Investigation of PCB Embedding Technology – Determination of Relevant Modelling Parameters by Means of FEM and Experiments

Rost, Florian, Huber, Saskia, Walter, Hans, van Dijk, Marius, Cramer, Thomas, Jaeschke, Johannes, Wittler, Olaf, Schneider-Ramelow, Martin

Year:

2019

Language:

english

File:

PDF, 267 KB

english, 2019

4

Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads

Gross, David, Haag, Sabine, Reinold, Manfred, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 1.21 MB

english, 2015

5

The influence of liners with Ti, Ta or Ru finish on thin Cu films

Gross, David, Haag, Sabine, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.37 MB

english, 2014

6

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Investigating wire bonding pull testing and its calculation basics

Schmitz, S., Kripfgans, J., Schneider-Ramelow, M., Muller, Wolfgang H., Lang, K.-D.

Year:

2014

Language:

english

File:

PDF, 1.40 MB

english, 2014

7

Ultrasonic friction power during Al wire wedge-wedge bonding

A. Shah, H. Gaul, M. Schneider-ramelow, H. Reichl, M. Mayer, Y. Zhou

Year:

2009

Language:

english

File:

PDF, 1.07 MB

english, 2009

8

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Braun, Tanja, Becker, Karl-Friedrich, Hoelck, Ole, Voges, Steve, Kahle, Ruben, Dreissigacker, Marc, Schneider-Ramelow, Martin

Journal:

Year:

2019

Language:

english

File:

PDF, 4.97 MB

english, 2019

9

Analysis of the friction processes in ultrasonic wedge/wedge-bonding

Holger Gaul, M. Schneider-Ramelow, H. Reichl

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 258 KB

english, 2009

10

Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding

Broll, M.S., Geissler, U., Höfer, J., Schmitz, S., Wittler, O., Schneider-Ramelow, M., Lang, K.D.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.22 MB

english, 2015

11

[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices

Gross, David, Haag, Sabine, Reinold, Manfred, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Year:

2015

Language:

english

File:

PDF, 149 KB

english, 2015

12

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modeling

Schmidt, M., Maniar, Y., Ratchev, R., Kabakchiev, A., Guyenot, M., Walter, H., Schneider-Ramelow, M.

Year:

2019

Language:

english

File:

PDF, 627 KB

english, 2019

13

[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - Panel Level Packaging for Component Integration of an Energy Harvesting System

Braun, T., Lang, K.-D., Kahle, R., Voges, S., Holck, O., Bauer, J., Becker, K.-F., Aschenbrenner, R., Dreissigacker, M., Schneider-Ramelow, Martin

Year:

2019

Language:

english

File:

PDF, 642 KB

english, 2019

14

Influence of temperature and humidity on power cycling capability of power modules

Wuest, Felix, Wittler, Olaf, Schneider-Ramelow, Martin

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 1.20 MB

2020

15

Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts

Ute Geissler, Jürgen Funck, Martin Schneider-Ramelow, Hans-Jürgen Engelmann, Ingrid Rooch, Wolfgang H. Müller, Herbert Reichl

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 485 KB

english, 2011

16

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling

Schwietering, Julian, Herbst, Christian, Kirsch, Oliver, Arndt-Staufenbiel, Norbert, Wachholz, Philipp, Schroder, Henning, Schneider-Ramelow, Martin

Year:

2020

File:

PDF, 719 KB

2020

17

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Roshanghias, Ali, Dreissigacker, Marc, Scherf, Christina, Bretthauer, Christian, Rauter, Lukas, Zikulnig, Johanna, Braun, Tanja, Becker, Karl-F., Rzepka, Sven, Schneider-Ramelow, Martin

Journal:

Year:

2020

File:

PDF, 4.31 MB

2020

18

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Where is the Sweet Spot for Panel Level Packaging?

Braun, T, Becker, K. -F., Hoelck, O., Voges, S., Woehrmann, M., Boettcher, L., Toepper, M., Stobbe, L., Aschenbrenner, R., Schneider-Ramelow, M., Lang, K. -D.

Year:

2019

Language:

english

File:

PDF, 167 KB

english, 2019

19

Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C

S. Schmitz, M. Schneider-Ramelow, S. Schröder

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.47 MB

english, 2011

20

[Institution of Engineering and Technology 12th European Conference on Antennas and Propagation (EuCAP 2018) - London, UK (9-13 April 2018)] 12th European Conference on Antennas and Propagation (EuCAP 2018) - Impact of Multilayer Stack-ups on Bond Wire Antennas at Millimetre-wave Frequencies

Ndip, I., Schneider-Ramelow, M., Huhn, M., Brandenburger, F., Hempel, M., Lang, K.-D.

Year:

2018

Language:

english

File:

PDF, 493 KB

english, 2018

21

Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS

Wang, Bei, Baeuscher, Manuel, Hu, Xiaodong, Woehrmann, Markus, Becker, Katharina, Juergensen, Nils, Hubl, Moritz, Mackowiak, Piotr, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Ngo, Ha-Duong

Journal:

Year:

2020

File:

PDF, 5.54 MB

2020

22

Analytic Model Verification of the Interfacial Friction Power in Al us w/w Bonding on Au Pads

Gaul, H., Schneider-Ramelow, M., Reichl, H.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.28 MB

english, 2010

23

The reliability of wire bonding using Ag and Al

Schneider-Ramelow, Martin, Ehrhardt, Christian

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 919 KB

english, 2016

24

Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires

Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang, Herbert Reichl

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 299 KB

english, 2006

25

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Braun, Tanja, Becker, Karl-Friedrich, Hoelck, Ole, Voges, Steve, Kahle, Ruben, Dreissigacker, Marc, Schneider-Ramelow, Martin

Journal:

Year:

2019

File:

PDF, 4.97 MB

2019

26

Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

Bernhard Wunderle, K.-F. Becker, R. Sinning, O. Wittler, R. Schacht, H. Walter, M. Schneider-Ramelow, K. Halser, N. Simper, B. Michel, H. Reichl

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 968 KB

english, 2009

27

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Panel Level Packaging - A View Along the Process Chain

Braun, Tanja, Becker, K.-F., Hoelck, O., Kahle, R., Wohrmann, M., Boettcher, L., Topper, M., Stobbe, L., Zedel, H., Aschenbrenner, R., Voges, S., Schneider-Ramelow, M., Lang, K.-D.

Year:

2018

Language:

english

File:

PDF, 371 KB

english, 2018

28

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Thermomechanical description of interface formation in aluminum ultrasound (US)-wedge/wedge-wirebond contacts

Muller, Wolfgang H., Sbeiti, Mohamad, Schneider-Ramelow, Martin, Geissler, Ute

Year:

2010

Language:

english

File:

PDF, 1.38 MB

english, 2010

29

Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics

Wuest, F., Trampert, S., Janzen, S., Straube, S., Schneider-Ramelow, M.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.29 MB

english, 2018

30

Hardening and Softening in AlSi1 Bond Contacts During Ultrasonic Wire Bonding

Geissler, U., Schneider-Ramelow, M., Reichl, H.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 1.95 MB

english, 2009

31

FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics

Grams, Arian, Jaeschke, Johannes, Wittler, Olaf, Fabian, Benjamin, Thomas, Sven, Schneider-Ramelow, Martin

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 2.64 MB

2020

32

Aluminum-Scandium: A Material for Semiconductor Packaging

Geissler, Ute, Thomas, Sven, Schneider-Ramelow, Martin, Mukhopadhyay, Biswajit, Lang, Klaus-Dieter

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 3.47 MB

english, 2016

33

The Realization of Redistribution Layers for FOWLP by Inkjet Printing

Roshanghias, Ali, Ma, Ying, Dreissigacker, Marc, Braun, Tanja, Bretthauer, Christian, Becker, Karl-F., Schneider-Ramelow, Martin

Journal:

Proceedings (American Bar Association. Section of International and Comparative Law)

Year:

2018

File:

PDF, 589 KB

2018

34

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Warpage Investigation of PCB Embedding Technology – Determination of Relevant Modelling Parameters by Means of FEM and Experiments

Rost, Florian, Huber, Saskia, Walter, Hans, van Dijk, Marius, Cramer, Thomas, Jaeschke, Johannes, Wittler, Olaf, Schneider-Ramelow, Martin

Year:

2019

File:

PDF, 267 KB

2019

35

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Modeling and analysis of coplanar bonding wires for high-speed applications

Tschoban, Christian, Ndip, Ivan, Schmidt, Stefan, Guttowski, Stephan, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Reichl, Herbert

Year:

2010

Language:

english

File:

PDF, 950 KB

english, 2010

36

[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact

Manessis, D., Pawlikowski, J., Ostmann, A., Schischke, K., Aschenbrenner, R., Schneider-Ramelow, M., Krivec, T., Podhradsky, G., Lang, K-D.

Year:

2017

Language:

english

File:

PDF, 2.37 MB

english, 2017

37

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems

Bottger, Gunnar, Schroder, Henning, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Year:

2018

Language:

english

File:

PDF, 1.35 MB

english, 2018

38

A Novel Low Cost Wireless Incontinence Sensor System (Screen-Printed Flexible Sensor System) for Wireless Urine Detection in Incontinence Materials

Ngo, Ha-Duong, Hoang, Thanh Hai, Baeuscher, Manuel, Wang, Bei, Mackowiak, Piotr, Grabbert, Nils, Weiland, Thomas, Ehrmann, Oswin, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Grudno, Jens

Journal:

Proceedings (American Bar Association. Section of International and Comparative Law)

Year:

2018

Language:

english

File:

PDF, 1.50 MB

english, 2018

39

Development and Status of Cu Ball/Wedge Bonding in 2012

Martin Schneider-Ramelow, Ute Geißler, Stefan Schmitz…

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 2.72 MB

english, 2013

40

Experimental verification and analysis of analytical model of the shape of bond wire antennas

Ndip, I., Huhn, M., Brandenburger, F., Ehrhardt, C., Schneider-Ramelow, M., Reichl, H., Lang, K.D., Henke, H.

Journal:

Electronics Letters

Year:

2017

Language:

english

File:

PDF, 473 KB

english, 2017

41

SPIE Proceedings [SPIE SPIE OPTO - San Francisco, California, United States (Saturday 7 February 2015)] Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XIX - Large area LED package

Streubel, Klaus P., Jeon, Heonsu, Tu, Li-Wei, Strassburg, Martin, Goullon, L., Jordan, R., Braun, T., Bauer, J., Becker, F., Hutter, M., Schneider-Ramelow, M., Lang, K.-D.

Year:

2015

Language:

english

File:

PDF, 515 KB

english, 2015

42

Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads

Dils,, Werft,, Walter,, Zwanzig,, von Krshiwoblozki,, Schneider-Ramelow,

Journal:

Year:

2019

Language:

english

File:

PDF, 9.84 MB

english, 2019

43

Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads

Dils,, Werft,, Walter,, Zwanzig,, von Krshiwoblozki,, Schneider-Ramelow,

Journal:

Year:

2019

File:

PDF, 9.84 MB

2019

44

[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment

Schischke, Karsten, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Manessis, Dionysios, Pawlikowski, Jakub, Kupka, Tobias, Krivec, Thomas, Pamminger, Rainer, Glaser, Sebastian, Podhradsky, Gerhard, Ni

Year:

2019

Language:

english

File:

PDF, 537 KB

english, 2019

45

Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces

Sbeiti, Mohamad, Müller, Wolfgang H., Schneider-Ramelow, Martin, Geissler, Ute, Schmitz, Stefan

Journal:

Year:

2012

Language:

english

File:

PDF, 604 KB

english, 2012

46

SPIE Proceedings [SPIE SPIE LASE - San Francisco, California, United States (Saturday 13 February 2016)] Components and Packaging for Laser Systems II - Fully automated hybrid diode laser assembly using high precision active alignment

Glebov, Alexei L., Leisher, Paul O., Böttger, Gunnar, Weber, Daniel, Scholz, Friedemann, Schröder, Henning, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Year:

2016

Language:

english

File:

PDF, 1.24 MB

english, 2016

47

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components

Bottger, Gunnar, Weber, Daniel, Schroder, Henning, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Year:

2016

Language:

english

File:

PDF, 988 KB

english, 2016

48

[IEEE 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Budapest, Hungary (2007.09.17-2007.09.19)] 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading

Wunderle, B., Braun, T., May, D., Mazloum, A., Bouazza, M., Walter, H., Wittler, O., Schacht, R., Becker, K-F., Schneider-Ramelow, M., Michel, B., Reichl, H.

Year:

2007

Language:

english

File:

PDF, 1.82 MB

english, 2007

49

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Can Bond Wires really be used as Antennas?

Ndip, Ivan, Becker, Karl Friedrich, Brandenburger, Flynn, Le, Thi Huyen, Huhn, Max, Bauer, Jorg, Koch, Mathias, Hempel, Martin, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Year:

2018

File:

PDF, 309 KB

2018

50

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Simulation And Electrical Characterization Of A Novel 2D-Printed Incontinence Sensor With Conductive Polymer PEDOT:PSS For Medical Applications

Baeuscher, Manuel, Wang, Bei, Hu, Xiaodong, Mackowiak, Piotr, Merchau, Norman, Ehrmann, Oswin, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Ngo, Ha-Duong

Year:

2018

File:

PDF, 34 KB

2018

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски