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1

Defect detection of flip-chip solder joints using modal analysis

Junchao Liu, Tielin Shi, Ke Wang, Zirong Tang, Guanglan Liao

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.97 MB

english, 2012

2

A Novel Method to Fabricate Silicon Tubular Gratings with Broadband Antireflection and Super-Hydrophobicity

Gao, Yang, Shi, Tielin, Tan, Xianhua, Liao, Guanglan

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2014

Language:

english

File:

PDF, 7.44 MB

english, 2014

3

Patterned gradient surface for spontaneous droplet transportation and water collection: simulation and experiment

Tan, Xianhua, Zhu, Yiying, Shi, Tielin, Tang, Zirong, Liao, Guanglan

Journal:

Journal of Micromechanics and Microengineering

Year:

2016

Language:

english

File:

PDF, 4.33 MB

english, 2016

4

X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm

Shen, Junjie, Chen, Pengfei, Su, Lei, Shi, Tielin, Tang, Zirong, Liao, Guanglan

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.34 MB

english, 2016

5

Large-area flexible photodetector based on atomically thin MoS 2 /graphene film

Sun, Bo, Shi, Tielin, Liu, Zhiyong, Wu, Youni, Zhou, Jianxin, Liao, Guanglan

Journal:

Materials & Design

Year:

2018

Language:

english

File:

PDF, 1.50 MB

english, 2018

6

Novel antisolvent-washing strategy for highly efficient carbon-based planar CsPbBr3 perovskite solar cells

Liu, Xingyue, Liu, Zhiyong, Tan, Xianhua, Ye, Haibo, Sun, Bo, Xi, Shuang, Shi, Tielin, Tang, Zirong, Liao, Guanglan

Journal:

Journal of Power Sources

Year:

2019

Language:

english

File:

PDF, 2.12 MB

english, 2019

7

Effect of nanoscale surface topography on low temperature direct wafer bonding process with UV activation

Zirong Tang, Ping Peng, Tielin Shi, Guanglan Liao, Lei Nie, Shiyuan Liu

Journal:

Sensors and Actuators A: Physical

Year:

2009

Language:

english

File:

PDF, 1.26 MB

english, 2009

8

Effect of surface characteristic on room-temperature silicon direct bonding

Guanglan Liao, Tielin Shi, Xiaohui Lin, Ziwen Ma

Journal:

Sensors and Actuators A: Physical

Year:

2010

Language:

english

File:

PDF, 937 KB

english, 2010

9

Using hierarchy architecture of Morpho butterfly scales for chemical sensing: Experiment and modeling

Xuefeng Yang, Zhengchun Peng, Haibo Zuo, Tielin Shi, Guanglan Liao

Journal:

Sensors and Actuators A: Physical

Year:

2011

Language:

english

File:

PDF, 1.51 MB

english, 2011

10

Void control in adhesive bonding using thermosetting polymer

Lei Nie, Kiwon Lee, Sangyong Lee, Tielin Shi, Guanglan Liao

Journal:

Sensors and Actuators A: Physical

Year:

2011

Language:

english

File:

PDF, 1.26 MB

english, 2011

11

UV surface exposure for low temperature hydrophilic silicon direct bonding

Xiaohui Lin, Guanglan Liao, Zirong Tang, Tielin Shi

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 332 KB

english, 2009

12

Flip chip solder bump inspection using vibration analysis

Junchao Liu, Tielin Shi, Qi Xia, Guanglan Liao

Journal:

Microsystem Technologies

Year:

2012

Language:

english

File:

PDF, 689 KB

english, 2012

13

Thermal conduction analysis and characterization of solder bumps in flip chip package

Xiangning Lu, Tielin Shi, Qi Xia, Guanglan Liao

Journal:

Applied Thermal Engineering

Year:

2012

Language:

english

File:

PDF, 915 KB

english, 2012

14

The relationship of selective surrounding response and the nanophotonic structures of Morpho butterfly scales

Wenjun Wu, Guanglan Liao, Tielin Shi, Rizwan Malik, Cheng Zeng

Journal:

Microelectronic Engineering

Year:

2012

Language:

english

File:

PDF, 1.17 MB

english, 2012

15

Dynamics of Contact Wave in Silicon Wafer Direct Bonding

Guanglan Liao, Yuping Shi, Tielin Shi, Lei Nie

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 673 KB

english, 2010

16

Defects inspection of the solder bumps using self reference technology in active thermography

Lu, Xiangning, Shi, Tielin, Han, Jiguang, Liao, Guanglan, Su, Lei, Wang, Suya

Journal:

Infrared Physics & Technology

Year:

2014

Language:

english

File:

PDF, 2.15 MB

english, 2014

17

Using active thermography for defects inspection of flip chip

Xu, Zhensong, Shi, Tielin, Lu, Xiangning, Liao, Guanglan

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 3.60 MB

english, 2014

18

Surface Roughness Modeling for Silicon Direct Bonding

Liao, Guanglan, Lin, Xiaohui, Nie, Lei, Shi, Tielin

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 540 KB

english, 2011

19

Genetic algorithms for defect detection of flip chips

Su, Lei, Shi, Tielin, Du, Li, Lu, Xiangning, Liao, Guanglan

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.95 MB

english, 2015

20

Using low-temperature carbon electrode for preparing hole-conductor-free perovskite heterojunction solar cells under high relative humidity

Liao, Guanglan, Liu, zhiyong, Shi, Tielin, Tang, Zirong, Sun, Bo

Journal:

Year:

2015

Language:

english

File:

PDF, 1.12 MB

english, 2015

21

Bio-Inspired Fabrication of Complex Hierarchical Structure in Silicon

Gao, Yang, Peng, Zhengchun, Shi, Tielin, Tan, Xianhua, Zhang, Deqin, Huang, Qiang, Zou, Chuanping, Liao, Guanglan

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2015

Language:

english

File:

PDF, 478 KB

english, 2015

22

Combined AFM Nano-Machining and Reactive Ion Etching to Fabricate High Aspect Ratio Structures

Peng, Ping, Shi, Tielin, Liao, Guanglan, Tang, Zirong

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2010

Language:

english

File:

PDF, 4.71 MB

english, 2010

23

Using RBF networks for detection and prediction of flip chip with missing bumps

Liao, Guanglan, Du, Li, Su, Lei, Zeng, Miao, Nie, Lei, Shi, Tielin

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.28 MB

english, 2015

24

Controlled Fabrication of Silicon Nanowires via Nanosphere Lithograph and Metal Assisted Chemical Etching

Sun, Bo, Shi, Tielin, Sheng, Wenjun, Liao, Guanglan

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2013

Language:

english

File:

PDF, 9.04 MB

english, 2013

25

Enhanced photovoltaic performance and stability of carbon counter electrode based perovskite solar cells encapsulated by PDMS

Liao, Guanglan, Liu, zhiyong, Sun, Bo, Shi, Tielin, Tang, Zirong

Journal:

Journal of Materials Chemistry A

Year:

2016

Language:

english

File:

PDF, 1.95 MB

english, 2016

26

[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Low temperature and low pressure Cu-Cu bonding with Ag doped Cu nanosolder paste

Li, Junjie, Shi, Tielin, Yu, Xing, Cheng, Chaoliang, Fan, Jinhu, Liao, Guanglan, Tang, Zirong

Year:

2016

Language:

english

File:

PDF, 803 KB

english, 2016

27

Using GA-SVM for defect inspection of flip chips based on vibration signals

Li, Ke, Wang, Lingyu, Wu, JingJing, Zhang, Qiuju, Liao, Guanglan, Su, Lei

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.14 MB

english, 2018

28

Efficient Carbon-Based CsPbBr3 Inorganic Perovskite Solar Cells by Using Cu-Phthalocyanine as Hole Transport Material

Liu, Zhiyong, Sun, Bo, Liu, Xingyue, Han, Jinghui, Ye, Haibo, Shi, Tielin, Tang, Zirong, Liao, Guanglan

Journal:

Nano-Micro Letters

Year:

2018

Language:

english

File:

PDF, 3.10 MB

english, 2018

29

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Reliable Cu-Cu Thermocompression Bonding by Low Temperature Sintered Cu Nanowires

Du, Li, Shi, Tielin, Tang, Zirong, Liao, Guanglan

Year:

2017

Language:

english

File:

PDF, 1.80 MB

english, 2017

30

Boosting the efficiency of carbon-based planar CsPbBr3 perovskite solar cells by a modified multistep spin-coating technique and interface engineering

Liu, Xingyue, Tan, Xianhua, Liu, Zhiyong, Ye, Haibo, Sun, Bo, Shi, Tielin, Tang, Zirong, Liao, Guanglan

Journal:

Year:

2018

File:

PDF, 2.39 MB

2018

31

Temperature monitoring of the tool-chip interface for PCBN tools using built-in thin-film thermocouples in turning of titanium alloy

Li, Tianxiang, Shi, Tielin, Tang, Zirong, Liao, Guanglan, Han, Jinghui, Duan, Jian

Journal:

Journal of Materials Processing Technology

Year:

2020

Language:

english

File:

PDF, 2.29 MB

english, 2020

32

Sequentially vacuum evaporated high-quality CsPbBr3 films for efficient carbon-based planar heterojunction perovskite solar cells

Liu, Xingyue, Tan, Xianhua, Liu, Zhiyong, Sun, Bo, Li, Junjie, Xi, Shuang, Shi, Tielin, Liao, Guanglan

Journal:

Journal of Power Sources

Year:

2019

Language:

english

File:

PDF, 2.84 MB

english, 2019

33

Real-time tool wear monitoring using thin-film thermocouple

Li, Tianxiang, Shi, Tielin, Tang, Zirong, Liao, Guanglan, Duan, Jian, Han, Jinghui, He, Zhaopeng

Journal:

Journal of Materials Processing Technology

Year:

2021

File:

PDF, 8.34 MB

2021

34

Molecular dynamic simulations of nanoindentation in aluminum thin film on silicon substrate

Ping Peng, Guanglan Liao, Tielin Shi, Zirong Tang, Yang Gao

Journal:

Applied Surface Science

Year:

2010

Language:

english

File:

PDF, 1.40 MB

english, 2010

35

Modeling the formation of spontaneous wafer direct bonding under low temperature

Zirong Tang, Tielin Shi, Guanglan Liao, Shiyuan Liu

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 213 KB

english, 2008

36

A novel approach for flip chip solder joint inspection based on pulsed phase thermography

Xiangning Lu, Guanglan Liao, Zheyu Zha, Qi Xia, Tielin Shi

Journal:

NDT & E International

Year:

2011

Language:

english

File:

PDF, 1.04 MB

english, 2011

37

Optical properties of the micro/nano structures ofMorphobutterfly wing scales

GuangLan Liao, HaiBo Zuo, YanBo Cao, TieLin Shi

Journal:

Science China Technological Sciences

Year:

2010

Language:

english

File:

PDF, 2.46 MB

english, 2010

38

Ultraviolet exposure enhanced silicon direct bonding

Guanglan Liao, Xuekun Zhang, Xiaohui Lin, Canghai Ma, Lei Nie, Tielin Shi

Journal:

Frontiers of Mechanical Engineering

Year:

2010

Language:

english

File:

PDF, 231 KB

english, 2010

39

Patterned wafer bonding using ultraviolet adhesive

Rui Zhuo, Guanglan Liao, Wenliang Liu, Lei Nie, Tielin Shi

Journal:

Frontiers of Mechanical Engineering

Year:

2011

Language:

english

File:

PDF, 250 KB

english, 2011

40

Detection of solder bump defects on a flip chip using vibration analysis

Junchao Liu, Tielin Shi, Qi Xia, Guanglan Liao

Journal:

Frontiers of Mechanical Engineering

Year:

2012

Language:

english

File:

PDF, 565 KB

english, 2012

41

Finite element simulation and experimental investigation of forming micro-gear with Zr–Cu–Ni–Al bulk metallic glass

Dong Wang, Teilin Shi, Jie Pan, Guanglan Liao, Zirong Tang, Lin Liu

Journal:

Journal of Materials Processing Technology

Year:

2010

Language:

english

File:

PDF, 995 KB

english, 2010

42

Sensitivity Analysis of a Bioinspired Refractive Index Based Gas Sensor

Yang Gao, Qi Xia, Guanglan Liao, Tielin Shi

Journal:

Journal of Bionic Engineering

Year:

2011

Language:

english

File:

PDF, 893 KB

english, 2011

43

Investigation on color variation of Morpho butterfly wings hierarchical structure based on PCA

Xuan Jiang, TieLin Shi, HaiBo Zuo, XueFeng Yang, WenJun Wu, GuangLan Liao

Journal:

Science China Technological Sciences

Year:

2012

Language:

english

File:

PDF, 818 KB

english, 2012

44

Fault Diagnosis of Flip Chip Using Vibration and Modal Analysis

Zeng, Miao, Liu, Junchao, Zhang, Xuekun, Shi, Tielin, Liao, Guanglan

Journal:

Year:

2012

Language:

english

File:

PDF, 537 KB

english, 2012

45

Investigations on color variations ofMorpho rhetenorbutterfly wing scales

Liao, Guanglan, Zuo, Haibo, Jiang, Xuan, Yang, Xuefeng, Shi, Tielin

Journal:

Frontiers of Mechanical Engineering

Year:

2012

Language:

english

File:

PDF, 672 KB

english, 2012

46

Laser Welding of Zr 41 Ti 14 Cu 12 Ni 10 Be 23 Bulk Metallic Glass: Experiment and Temperature Field Simulation

Chen, Biao, Shi, Tielin, Li, Mo, Zhang, Zhaobo, Zhu, Zhijing, Liao, Guanglan

Journal:

Advanced Engineering Materials

Year:

2013

Language:

english

File:

PDF, 760 KB

english, 2013

47

Research on Spectral Reflection Characteristics of Nanostructures in Morpho Butterfly Wing Scale

Wu, Wenjun, Shi, Tielin, Liao, Guanglan, zuo, Haibo

Journal:

Journal of Physics Conference Series

Year:

2011

Language:

english

File:

PDF, 724 KB

english, 2011

48

Image registration using a point-line duality based line matching method

Wang, Ke, Shi, Tielin, Liao, Guanglan, Xia, Qi

Journal:

Journal of Visual Communication and Image Representation

Year:

2013

Language:

english

File:

PDF, 2.43 MB

english, 2013

49

Obituary.

Xu, Zhensong, Shi, Tielin, Lu, Xiangning, Liao, Guanglan

Journal:

Year:

1869

Language:

english

File:

PDF, 388 KB

english, 1869

50

Gas sensing using hierarchical micro/nanostructures of Morpho butterfly scales

Jiang, Ting, Peng, Zhengchun, Wu, Wenjun, Shi, Tielin, Liao, Guanglan

Journal:

Sensors and Actuators A: Physical

Year:

2014

Language:

english

File:

PDF, 3.25 MB

english, 2014

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