8

Defect detection of flip-chip solder joints using modal analysis

Year:
2012
Language:
english
File:
PDF, 1.97 MB
english, 2012
12

Suspended integration of pyrolytic carbon membrane on C-MEMS

Year:
2015
Language:
english
File:
PDF, 976 KB
english, 2015
25

A study of the analogue compensating monopole system for active attenuation of noise in a duct

Year:
1989
Language:
english
File:
PDF, 680 KB
english, 1989
26

On the study of the active attenuation of noise in an L-formed duct

Year:
1991
Language:
english
File:
PDF, 527 KB
english, 1991
30

Void control in adhesive bonding using thermosetting polymer

Year:
2011
Language:
english
File:
PDF, 1.26 MB
english, 2011
34

Flip chip solder bump inspection using vibration analysis

Year:
2012
Language:
english
File:
PDF, 689 KB
english, 2012
44

Dynamics of Contact Wave in Silicon Wafer Direct Bonding

Year:
2010
Language:
english
File:
PDF, 673 KB
english, 2010
46

Using active thermography for defects inspection of flip chip

Year:
2014
Language:
english
File:
PDF, 3.60 MB
english, 2014