Kuo-Chuan Liu: search on Z-Library

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51

An algorithm of calculating transport parameters of thermoelectric materials using single band model with optimized integration methods

Chang, Kuo-Chuan, Liu, Chia-Jyi

Journal:

Computer Physics Communications

Year:

2019

Language:

english

File:

PDF, 934 KB

english, 2019

52

Optimization of the Extraction ofAlpinia oxyphyllaEssence Oil in Supercritical Carbon Dioxide

Hen-Yi Ju, Kuo-Chuan Huang, Jiann-Hwa Chen, Yung-Chuan Liu, Chieh-Ming J. Chang, Chih-Chen Lee, Cheng Chang, Chwen-Jen Shieh

Journal:

Journal of the American Oil Chemists' Society

Year:

2010

Language:

english

File:

PDF, 331 KB

english, 2010

53

A Larger Dose of Vancomycin Is Required in Adult Neurosurgical Intensive Care Unit Patients Due to Augmented Clearance

Lin Wu, Fe-Lin, Liu, Sheau-Shan, Yang, Ting-Ya, Win, Ming-Feng, Lin, Shu-Wen, Huang, Chih-Fen, Wang, Kuo-Chuan, Shen, Li-Jiuan

Journal:

Therapeutic Drug Monitoring

Year:

2015

Language:

english

File:

PDF, 315 KB

english, 2015

54

Typhoon Disturbance and Forest Dynamics: Lessons from a Northwest Pacific Subtropical Forest

Teng-Chiu Lin, Steven P. Hamburg, Kuo-Chuan Lin, Lih-Jih Wang, Chung-Te Chang, Yue-Joe Hsia, Matthew A. Vadeboncoeur, Cathy M. Mabry McMullen and Chiung-Pin Liu

Journal:

Year:

2011

Language:

english

File:

PDF, 2.83 MB

english, 2011

55

Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

Tae-Kyu Lee, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 2.34 MB

english, 2012

56

Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures

Chi-Yang Yu, Tae-Kyu Lee, Michael Tsai, Kuo-Chuan Liu, Jenq-Gong Duh

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 1.44 MB

english, 2010

57

The Proliferation Capacity of Cultured Neural Stem Cells Promoted by CSF Collected from SAH Patients Correlates to Clinical Outcome

Chen, Yun-An, Wang, Kuo-Chuan, Liu, Der-Zen, Young, Tai-Horng, Tsai, Li-Kai

Journal:

Scientific Reports

Year:

2018

Language:

english

File:

PDF, 4.49 MB

english, 2018

58

Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu, Thomas R. Bieler

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 1.49 MB

english, 2010

59

Methodology for Analyzing Strain States DuringIn

Thomas R. Bieler, Tae-kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 838 KB

english, 2009

60

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

Tae-Kyu Lee, Weidong Xie, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 1.62 MB

english, 2011

61

Gelation of ionic liquid with exfoliated montmorillonite nanoplatelets and its application for quasi-solid-state dye-sensitized solar cells

Chia-Hsin Lee, Ken-Yen Liu, Shun-Hsiang Chang, Keng-Jen Lin, Jiang-Jen Lin, Kuo-Chuan Ho, King-Fu Lin

Journal:

Journal of Colloid and Interface Science

Year:

2011

Language:

english

File:

PDF, 531 KB

english, 2011

62

Improved exchange reaction in an ionic liquid electrolyte of a quasi-solid-state dye-sensitized solar cell by using 15-crown-5-functionalized MWCNT

Huang, Kuan-Chieh, Chang, Yu-Hsun, Chen, Chia-Yuan, Liu, Chen-Yu, Lin, Lu-Yin, Vittal, R., Wu, Chun-Guey, Lin, King-Fu, Ho, Kuo-Chuan

Journal:

Journal of Materials Chemistry

Year:

2011

Language:

english

File:

PDF, 561 KB

english, 2011

63

Clinical Significance of Posterior Circulation Changes after Revascularization in Patients with Moyamoya Disease

Huang, Abel Po-Hao, Liu, Hon-Man, Lai, Dar-Ming, Yang, Chi-Cheng, Tsai, Yi-Hsin, Wang, Kuo-Chuan, Yang, Shih-Hung, Kuo, Meng-Fai, Tu, Yong-Kwang

Journal:

Cerebrovascular Diseases

Year:

2009

Language:

english

File:

PDF, 638 KB

english, 2009

64

AN OPTIMIZATION MODEL FOR PRECAST PROJECT PLANNING USING GROUP CONCEPTS

Shih, Kuo-Chuan, Liu, Shu-Shun

Journal:

Journal of the Operations Research Society of Japan

Year:

2010

Language:

english

File:

PDF, 1.37 MB

english, 2010

65

Immunomodulatory activities and antioxidant properties of polysaccharides from Monascus-fermented products in vitro

Kuo-Chuan Tseng, Tony J Fang, Shen-Shih Chiang, Chin-Feng Liu, Cheng-Lun Wu, Tzu-Ming Pan

Journal:

Journal of the Science of Food and Agriculture

Year:

2012

Language:

english

File:

PDF, 299 KB

english, 2012

66

Occurrence of power overshoot for two-chambered MFC at nearly steady-state operation

Lihong Liu, Chin-Yu Lee, Kuo-Chuan Ho, Po-Chin Nien, Ay Su, Aijie Wang, Nanqi Ren, Duu-Jong Lee

Journal:

International Journal of Hydrogen Energy

Year:

2011

Language:

english

File:

PDF, 306 KB

english, 2011

67

Enhanced photovoltaic performance of cross-linked ruthenium dye with functional cross-linkers for dye-sensitized solar cell

Liu, Ken-Yen, Ho, Kuo-Chuan, Lin, King-Fu

Journal:

Progress in Photovoltaics: Research and Applications

Year:

2014

Language:

english

File:

PDF, 950 KB

english, 2014

68

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The investigation of defect screening methodology using mechanical stress test for Pb-free module product

Chang, Graver Chuan-Chun, Yu, Chi-Ko, Shao, Tina, Chen, Cherie, Lee, Jeffrey, Bansal, Anurag, Liu, Kuo-Chuan

Year:

2010

Language:

english

File:

PDF, 194 KB

english, 2010

69

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Acceleration factor study of lead-free solder joints under wide range thermal cycling conditions

Ma, Hongtao, Ahmad, Mudasir, Liu, Kuo-Chuan

Year:

2010

Language:

english

File:

PDF, 1.07 MB

english, 2010

70

Enhancement of photocurrent of polymer-gelled dye-sensitized solar cell by incorporation of exfoliated montmorillonite nanoplatelets

Chi-Wei Tu, Ken-Yen Liu, An-Ting Chien, Ming-Huei Yen, Ting Hsiang Weng, Kuo-Chuan Ho, King-Fu Lin

Journal:

Journal of Polymer Science Part A: Polymer Chemistry

Year:

2008

Language:

english

File:

PDF, 212 KB

english, 2008

71

The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder

Christopher Kinney, J.W. Morris, Tae-Kyu Lee, Kuo-Chuan Liu, Jie Xue, Dave Towne

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 299 KB

english, 2009

72

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, Payam Darbandi, Farhang Pourboghrat, Tae-Kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 2.73 MB

english, 2012

73

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Tae-Kyu Lee, Bo Liu, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 1002 KB

english, 2011

74

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Pb-free solder joint reliability of fine pitch chip-scale packages

Xie, Weidong, Lee, Tae-Kyu, Liu, Kuo-Chuan, Xue, Jie

Year:

2010

Language:

english

File:

PDF, 1.97 MB

english, 2010

75

[IEEE 2011 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2011.04.10-2011.04.14)] 2011 International Reliability Physics Symposium - The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints

Bieler, Thomas R., Zhou, Bite, Blair, Lauren, Zamiri, Amir, Darbandi, Payam, Pourboghrat, Farhang, Lee, Tae-Kyu, Liu, Kuo-Chuan

Year:

2011

Language:

english

File:

PDF, 3.13 MB

english, 2011

76

Synthesis and characterization of cross-linkable ruthenium complex dye and its application on dye-sensitized solar cells

Ken-Yen Liu, Chiao-Ling Hsu, Shun-Hsing Chang, Jian-Ging Chen, Kuo-Chuan Ho, King-Fu Lin

Journal:

Journal of Polymer Science Part A: Polymer Chemistry

Year:

2010

Language:

english

File:

PDF, 351 KB

english, 2010

77

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu, Jie Xue

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 1.05 MB

english, 2010

78

Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects

Bo Liu, Tae-Kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 769 KB

english, 2011

79

A counter electrode based on hollow spherical particles of polyaniline for a dye-sensitized solar cell

Huang, Kuan-Chieh, Hu, Chih-Wei, Tseng, Chen-Ya, Liu, Chen-Yu, Yeh, Min-Hsin, Wei, Hung-Yu, Wang, Chun-Chieh, Vittal, R., Chu, Chih-Wei, Ho, Kuo-Chuan

Journal:

Journal of Materials Chemistry

Year:

2012

Language:

english

File:

PDF, 779 KB

english, 2012

80

Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints

Tae-Kyu Lee, Kuo-Chuan Liu, Thomas R. Bieler

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 1.20 MB

english, 2009

81

Porous Nickel Oxide/Nickel Films for Electrochemical Capacitors

Journal:

Journal of The Electrochemical Society

Year:

1996

Language:

english

File:

PDF, 1.46 MB

english, 1996

82

Polymer-dispersed MWCNT gel electrolytes for high performance of dye-sensitized solar cells

Wang, Ying-Chiao, Huang, Kuan-Chieh, Dong, Rui-Xuan, Liu, Chung-Te, Wang, Chun-Chieh, Ho, Kuo-Chuan, Lin, Jiang-Jen

Journal:

Journal of Materials Chemistry

Year:

2012

Language:

english

File:

PDF, 950 KB

english, 2012

83

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Fracture mechanics of lead-free solder joints under cyclic shear load

Xu, Huili, Bang, Woong Ho, Ma, Hong-Tao, Lee, Tae-Kyu, Liu, Kuo-Chuan, Kim, Choong-Un

Year:

2010

Language:

english

File:

PDF, 705 KB

english, 2010

84

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Parametric acceleration transforms for lead-free solder joint reliability under thermal cycling conditions

Ahmad, Mudasir, Weidong Xie,, Liu, Kuo-Chuan, Jie Xue,, Towne, Dave

Year:

2009

Language:

english

File:

PDF, 843 KB

english, 2009

85

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Impact of isothermal aging on Sn-Ag-Cu solder interconnect board level high G mechanical shock performance

Lee, Tae-Kyu, Xie, Weidong, Liu, Kuo-Chuan

Year:

2011

Language:

english

File:

PDF, 3.02 MB

english, 2011

86

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Rate dependence of bending fatigue failure characteristics of lead-free solder joint

Bang, Woong Ho, Chen, Liang-Shan, Kim, Choong-Un, Lee, Tae-Kyu, Liu, Kuo-Chuan

Year:

2009

Language:

english

File:

PDF, 1.03 MB

english, 2009

87

Typhoon Disturbance and Forest Dynamics: Lessons from a Northwest Pacific Subtropical Forest

Teng-Chiu Lin, Steven P. Hamburg, Kuo-Chuan Lin, Lih-Jih Wang, Chung-Te Chang, Yue-Joe Hsia, Matthew A. Vadeboncoeur, Cathy M. Mabry McMullen, Chiung-Pin Liu

Journal:

Year:

2011

Language:

english

File:

PDF, 686 KB

english, 2011

88

Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Bite Zhou, Thomas R. Bieler, Tae-kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 1.50 MB

english, 2010

89

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - The interaction between grain orientation evolution and thermal cycling as a function of position in ball grid arrays using orientation image microscopy

Lee, Tae-Kyu, Zhou, Bite, Blair, Lauren, Liu, Kuo-Chuan, Xue, Jie, Bieler, Thomas R.

Year:

2010

Language:

english

File:

PDF, 1.19 MB

english, 2010

90

In

Bite Zhou, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-Kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 968 KB

english, 2012

91

Suppression of bipolar transport and enhanced zT values of porous ZnSb by addition of hydrothermally synthesized Sb

Chu, Yu-Hsien, Huang, Zhi-Quan, Yang, Zong-Ren, Lin, Fei-Hung, Chang, Kuo-Chuan, Suriakarthick, R., Liu, Chia-Jyi

Journal:

Journal of the European Ceramic Society

Year:

2019

Language:

english

File:

PDF, 1.91 MB

english, 2019

92

Performance of gelled-type dye-sensitized solar cells associated with glass transition temperature of the gelatinizing polymers

Chi-Wei Tu, Ken-Yen Liu, An-Ting Chien, Chia-Hsin Lee, Kuo-Chuan Ho, King-Fu Lin

Journal:

European Polymer Journal

Year:

2008

Language:

english

File:

PDF, 168 KB

english, 2008

93

The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects

Christopher Kinney, Tae-Kyu Lee, Kuo-Chuan Liu, J. W. Morris

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 319 KB

english, 2009

94

Nanographite/polyaniline composite films as the counter electrodes for dye-sensitized solar cells

Huang, Kuan-Chieh, Huang, Jen-Hsien, Wu, Chia-Hui, Liu, Chen-Yu, Chen, Hsin-Wei, Chu, Chih-Wei, Lin, Jiann-T'suen, Lin, Cheng-Lan, Ho, Kuo-Chuan

Journal:

Journal of Materials Chemistry

Year:

2011

Language:

english

File:

PDF, 393 KB

english, 2011

95

Influence of ferrocyanide on the long-term stability of poly(butyl viologen) thin film based electrochromic devices

Liu, Shu-Ming, Lin, Cheng-Lan, Chang, Ting-Hsiang, Lu, Hsin-Che, Hsu, Shan-Hui, Ho, Kuo-Chuan

Journal:

Solar Energy Materials and Solar Cells

Year:

2019

Language:

english

File:

PDF, 2.99 MB

english, 2019

96

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 784 KB

english, 2009

97

Use of the Rusch Flexi-Slip Stylet for Patients With Difficult Insertion of the ProSeal™ Laryngeal Mask Airway

Hung-Shu Chen, Ping-Hsin Liu, Kao-Chi Chung, Kuo-Chuan Hung

Journal:

Acta Anaesthesiologica Taiwanica

Year:

2010

Language:

english

File:

PDF, 221 KB

english, 2010

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