Min, Xin-Ping: search on Z-Library

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51

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods

Liang, Shui-Bao, Ke, Chang-Bo, Wei, Cheng, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2018

Language:

english

File:

PDF, 1.93 MB

english, 2018

52

Influence of tube properties on quality of hydropiercing

Gang LIU, Jun-feng LIN, Gang WANG, Hai-bo SU, Xin-ping CHEN, Hao-min JIANG

Journal:

Transactions of Nonferrous Metals Society of China

Year:

2011

Language:

english

File:

PDF, 1.49 MB

english, 2011

53

MicroRNA-590 attenuates lipid accumulation and pro-inflammatory cytokine secretion by targeting lipoprotein lipase gene in human THP-1 macrophages

He, Ping-Ping, Ouyang, Xin-Ping, Tang, Yan-Yan, Liao, Li, Wang, Zong-Bao, Lv, Yun-Cheng, Tian, Guo-Ping, Zhao, Guo-Jun, Huang, Liang, Yao, Feng, Xie, Wei, Tang, Yu Lin, Chen, Wu-Jun, Zhang, Min, Li, Y

Journal:

Year:

2014

Language:

english

File:

PDF, 1.66 MB

english, 2014

54

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple reflow process

Zhou, Min-Bo, Jin, Hong, Ke, Chang-Bo, Zhang, Xin-Ping

Year:

2015

Language:

english

File:

PDF, 1.34 MB

english, 2015

55

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects

Liang, Shui-Bao, Ke, Chang-Bo, Tan, Meng-Ying, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2016

Language:

english

File:

PDF, 1.39 MB

english, 2016

56

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) joints

Zeng, Jing-Bo, Xu, Guang-Sui, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2012

Language:

english

File:

PDF, 1.85 MB

english, 2012

57

A Note on Exact Traveling Wave Solutions of the Perturbed Nonlinear Schrödinger's Equation with Kerr Law Nonlinearity

Zhang, Zai-Yun, Gan, Xiang-Yang, Yu, De-Min, Zhang, Ying-Hui, Li, Xin-Ping

Journal:

Communications in Theoretical Physics

Year:

2012

Language:

english

File:

PDF, 489 KB

english, 2012

58

Activation of VEGF/Flk-1-ERK Pathway Induced Blood–Brain Barrier Injury After Microwave Exposure

Wang, Li-Feng, Li, Xiang, Gao, Ya-Bing, Wang, Shui-Ming, Zhao, Li, Dong, Ji, Yao, Bin-Wei, Xu, Xin-Ping, Chang, Gong-Min, Zhou, Hong-Mei, Hu, Xiang-Jun, Peng, Rui-Yun

Journal:

Molecular Neurobiology

Year:

2015

Language:

english

File:

PDF, 6.24 MB

english, 2015

59

A REVIEW OF THE CHINESE PSECHRIDAE (ARANEAE)

Wang, Xin-Ping, Yin, Chang-Min

Journal:

Journal of Arachnology

Year:

2001

Language:

english

File:

PDF, 1.69 MB

english, 2001

60

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging

Huang, Jia-Qiang, Zhou, Min-Bo, Li, Wang-Yun, Zhang, Xin-Ping

Year:

2016

Language:

english

File:

PDF, 1.29 MB

english, 2016

61

Zinc uptake by roots and accumulation in maize plants as affected by phosphorus application and arbuscular mycorrhizal colonization

Zhang, Wei, Chen, Xiu-Xiu, Liu, Yu-Min, Liu, Dun-Yi, Chen, Xin-Ping, Zou, Chun-Qin

Journal:

Year:

2017

Language:

english

File:

PDF, 467 KB

english, 2017

62

Characterization of Ni/Ho and Ni/Er fully silicided metal gates on SiO2 gate dielectric

Bao-Min Wang, Guo-Ping Ru, Yu-Long Jiang, Xin-Ping Qu, Bing-Zong Li, Ran Liu

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 236 KB

english, 2008

63

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array

Yuwen, Hui-Hui, Qin, Hong-Bo, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2015

Language:

english

File:

PDF, 1.32 MB

english, 2015

64

[IEEE 2009 IEEE International Conference on Intelligent Computing and Intelligent Systems (ICIS 2009) - Shanghai, China (2009.11.20-2009.11.22)] 2009 IEEE International Conference on Intelligent Computing and Intelligent Systems - Research on airport surface modeling and path planning algorithm based on CTPN

Wang, Yu-ting, Han, Song-chen, Tang, Xin-min, Zhu, Xin-ping

Year:

2009

Language:

english

File:

PDF, 104 KB

english, 2009

65

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste joints

Jin, Hong, Zhu, Jie-Fei, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2016

Language:

english

File:

PDF, 1.90 MB

english, 2016

66

Cordycepin Decreases Compound Action Potential Conduction of Frog Sciatic Nerve In Vitro Involving Ca 2+ -Dependent Mechanisms

Yao, Li-Hua, Yu, Hui-Min, Xiong, Qiu-Ping, Sun, Wei, Xu, Yan-Liang, Meng, Wei, Li, Yu-Ping, Liu, Xin-Ping, Yuan, Chun-Hua

Journal:

Neural Plasticity

Year:

2015

Language:

english

File:

PDF, 1.95 MB

english, 2015

67

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Effect of loading rate on the shear performance and fracture behavior of micro-scale BGA structure Cu/Snâ3.0Agâ0.5Cu/Cu joints under coupled electromechanical loads

Le, Wen-Kai, Sun, Tao, Zhou, Jie-Ying, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2019

File:

PDF, 3.19 MB

2019

68

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation

Liang, Shui-Bao, Ke, Chang-Bo, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2015

Language:

english

File:

PDF, 1.36 MB

english, 2015

69

On the sustainability of a reintroduced Crested Ibis population in Qinling Mountains, Shaanxi, Central China

Wang, Min, Ye, Xin-ping, Li, Yan-fang, Huo, Zhi-ping, Li, Xia, Yu, Xiao-ping

Journal:

Restoration Ecology

Year:

2016

Language:

english

File:

PDF, 410 KB

english, 2016

70

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

Liang, Shui-Bao, Ke, Chang-Bo, Ma, Wen-Jing, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2016

Language:

english

File:

PDF, 2.38 MB

english, 2016

71

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient

Liang, Shui-Bao, Ke, Chang-Bo, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2016

Language:

english

File:

PDF, 964 KB

english, 2016

72

Physiological and developmental traits associated with the grain yield of winter wheat as affected by phosphorus fertilizer management

Chen, Xiu-Xiu, Zhang, Wei, Liang, Xiao-Yuan, Liu, Yu-Min, Xu, Shi-Jie, Zhao, Qing-Yue, Du, Yun-Fei, Zhang, Ling, Chen, Xin-Ping, Zou, Chun-Qin

Journal:

Scientific Reports

Year:

2019

Language:

english

File:

PDF, 2.21 MB

english, 2019

73

ChemInform Abstract: Highly Enantioselective Addition of Methyl Propiolate to Aldehydes Catalyzed by a Titanium(IV) Complex of a β-Hydroxy Amide.

Tao Xu, Chao Liang, Yan Cai, Jian Li, Ya-Min Li, Xin-Ping Hui

Journal:

Year:

2010

File:

PDF, 41 KB

2010

74

Fabrication of hollow VO2 microspheres by a facile template-free process

Xin-Ping Yan, Jiao Chen, Jian-Min Liu, Pan-Pan Zhou, Xiang Liu, Zhong-Xing Su

Journal:

Materials Letters

Year:

2010

Language:

english

File:

PDF, 994 KB

english, 2010

75

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Experimental and numerical study of the size effect on microstructure and mechanical behavior of Cu/Sn0.7Cu0.05Ni/Cu joints with very small solder volume

Li, Wei, Zhou, Min-Bo, Qin, Hong-Bo, Ma, Xiao, Zhang, Xin-Ping

Year:

2012

Language:

english

File:

PDF, 1.48 MB

english, 2012

76

Mitigation of metal-mediated losses by coating Au nanoparticles with dielectric layer in plasmonic solar cells

Huang, Yi-Fan, Zhang, Ze-Ling, Kang, Kai-Bin, Zhao, Min, Wen, Ting, Liu, Yun-Xia, Zhai, Xin-Ping, Lv, Shuang-Kun, Wang, Qiang, Qiu, Wen-Yuan, Qiu, Dong

Journal:

Year:

2013

Language:

english

File:

PDF, 988 KB

english, 2013

77

Corrigendum to “NF-κB suppresses the expression of ATP-binding cassette transporter A1/G1 by regulating SREBP-2 and miR-33a in mice” [Int J Cardiol 171 (2014) e93–e95]

Zhao, Guo-Jun, Tang, Shi-Lin, Lv, Yun-Cheng, Ouyang, Xin-Ping, He, Ping-Ping, Yao, Feng, Tang, Yan-Yan, Zhang, Min, Tang, Ya-Ling, Tang, Deng-Pei, Cayabyab, Francisco S., Tian, Guo-Ping, Tang, Chao-Ke

Journal:

International Journal of Cardiology

Year:

2014

Language:

english

File:

PDF, 150 KB

english, 2014

78

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements

Huang, Jia-Qiang, Zhou, Min-Bo, Li, Chang-Zheng, Ma, Xiao, Zhang, Xin-Ping

Year:

2012

Language:

english

File:

PDF, 893 KB

english, 2012

79

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering process

Ma, Wen-Jing, Ke, Chang-Bo, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2013

Language:

english

File:

PDF, 858 KB

english, 2013

80

Preoperative Risk Factors for Residual Tricuspid Regurgitation after Isolated Left-Sided Valve Surgery: A Systematic Review and Meta-Analysis

Zhu, Tie-Yuan, Min, Xin-Ping, Zhang, Hai-Bo, Meng, Xu

Journal:

Year:

2014

Language:

english

File:

PDF, 604 KB

english, 2014

81

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Influence of metal-oxide/salt content in the aluminum soldering flux on solderability and corrosion resistance of Sn-0.7Cu/6061Al joints

Zhou, Min-Bo, Zhou, Li-Bing, Zhang, Lang, Qiu, Fu-Shun, Ma, Xiao, Zhang, Xin-Ping

Year:

2015

Language:

english

File:

PDF, 1.66 MB

english, 2015

82

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder interconnects

Ma, Wen-Jing, Ke, Chang-Bo, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2016

Language:

english

File:

PDF, 1.65 MB

english, 2016

83

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly of LED lighting components

Zhang, Lang, Zhou, Min-Bo, Qiu, Fu-Shun, Ma, Xiao, Zhang, Xin-Ping

Year:

2016

Language:

english

File:

PDF, 2.28 MB

english, 2016

84

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging

Huang, Jia-Qiang, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2016

Language:

english

File:

PDF, 1.84 MB

english, 2016

85

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound of Sn0.3Ag0.7Cu/Cu micro-bump joints

Zhou, Min-Bo, Zhao, Xing-Fei, Yue, Wu, Ke, Chang-Bo, Zhang, Xin-Ping

Year:

2017

Language:

english

File:

PDF, 1.66 MB

english, 2017

86

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

Liang, Shui-Bao, Ke, Chang-Bo, Wei, Cheng, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2018

Language:

english

File:

PDF, 12.92 MB

english, 2018

87

Synthesis of new β-hydroxy amide ligands and their Ti(IV) complex-catalyzed enantioselective alkynylation of aliphatic and vinyl aldehydes

Ya-Min Li, Yi-Quan Tang, Xin-Ping Hui, Lu-Ning Huang, Peng-Fei Xu

Journal:

Year:

2009

Language:

english

File:

PDF, 210 KB

english, 2009

88

Interleukin-27 inhibits foam cell formation by promoting macrophage ABCA1 expression through JAK2/STAT3 pathway

Fu, Hui, Tang, Yan-yan, Ouyang, Xin-ping, Tang, Shi-lin, Su, Hua, Li, Xiaotao, Huang, Li-ping, He, Miao, Lv, Yun-cheng, He, Ping-ping, Yao, Feng, Tan, Yu-lin, Xie, Wei, Zhang, Min, Wu, Jianfeng, Li, Y

Journal:

Biochemical and Biophysical Research Communications

Year:

2014

Language:

english

File:

PDF, 1.53 MB

english, 2014

89

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects

Liang, Shui-Bao, Ke, Chang-Bo, Ma, Wen-Jing, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2014

Language:

english

File:

PDF, 733 KB

english, 2014

90

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrate

Sun, Tao, Zhou, Min-Bo, Zhang, Ze-Jun, Zhang, Xin-Ping

Year:

2019

File:

PDF, 3.13 MB

2019

91

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Shear strength and fracture behavior of locally-melted hybrid Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu joints under different loading rates

Zhou, Min-Bo, Zhang, Han-Qian, Zhang, Xin-Ping, Yue, Wu

Year:

2019

File:

PDF, 3.21 MB

2019

92

Simulation of stable water isotopic composition in the atmosphere using an isotopic Atmospheric Water Balance Model

Zhang, Xin-Ping, Guan, Hua-De, Zhang, Xin-Zhu, Wu, Hua-Wu, Li, Guang, Huang, Yi-Min

Journal:

International Journal of Climatology

Year:

2015

Language:

english

File:

PDF, 797 KB

english, 2015

93

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Influence of mixed rare earth addition on the microstructure of the Sn-Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu joints

Wei, Li, Min-Bo, Zhou, Xiao, Ma, Xin-Ping, Zhang

Year:

2011

Language:

english

File:

PDF, 2.90 MB

english, 2011

94

Renoprotective effect of berberine on type 2 diabetic nephropathy in rats

Sun, Si-Fan, Zhao, Ting-Ting, Zhang, Hao-Jun, Huang, Xiao-Ru, Zhang, Wei-Ku, Zhang, Lei, Yan, Mei-Hua, Dong, Xi, Wang, Hua, Wen, Yu-Min, Pan, Xin-Ping, Lan, Hui Yao, Li, Ping

Journal:

Clinical and Experimental Pharmacology and Physiology

Year:

2015

Language:

english

File:

PDF, 441 KB

english, 2015

95

miR-758-5p regulates cholesterol uptake via targeting the CD36 3′UTR

Li, Bi-Rong, Xia, Lin-Qin, Liu, Jing, liao, Lin-Ling, Zhang, Yang, Deng, Min, Zhong, Hui-Juan, Feng, Ting-Ting, He, Ping-Ping, Ouyang, Xin-Ping

Journal:

Biochemical and Biophysical Research Communications

Year:

2017

Language:

english

File:

PDF, 799 KB

english, 2017

96

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods

Liang, Shui-Bao, Ke, Chang-Bo, Wei, Cheng, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2018

File:

PDF, 1.93 MB

2018

97

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Influence of solder ball volume on mechanical shock reliability of right-angle solder interconnects

Yue, Wu, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2018

Language:

english

File:

PDF, 5.92 MB

english, 2018

98

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Identification of essential factors causing solder bridging of right-angle solder interconnects in laser jet solder ball bonding process

Yue, Wu, Zhang, Jun-Xi, Gong, Cheng-Gong, Zhou, Min-Bo, Zhang, Xin-Ping

Year:

2019

File:

PDF, 2.71 MB

2019

99

Effect of Wuzhi Tablet (Schisandra sphenanthera extract) on the Pharmacokinetics of Cyclosporin A in Rats

Xin-ping Xue, Xiao-ling Qin, Chenshu Xu, Guo-ping Zhong, Ying Wang, Min Huang, Hui-chang Bi

Journal:

Phytotherapy Research

Year:

2012

Language:

english

File:

PDF, 145 KB

english, 2012

100

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints

Yue, Wu, Qin, Hong-Bo, Zhou, Min-Bo, Xu, Guang-Sui, Cao, Shan-Shan, Ma, Xiao, Zhang, Xin-Ping

Year:

2012

Language:

english

File:

PDF, 1.49 MB

english, 2012

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