Volume 84; Issue 11

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Microelectronic Engineering
Volume 84; Issue 11

Microelectronic Engineering

Volume 84; Issue 11

1

3D-analysis of semiconductor structures by electron tomography

H. Bender, O. Richard, A. Kalio, E. Sourty

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 894 KB

english, 2007

2

Self-catalyzed chemical vapor deposition method for the growth of device-quality metal thin films

N. Bahlawane, P. Antony Premkumar, K. Onwuka, G. Reiss, K. Kohse-Höinghaus

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 174 KB

english, 2007

3

Impact of process parameters on circuit performance for the 32 nm technology node

A. Farcy, M. Gallitre, V. Arnal, M. Sellier, L. Guibe, B. Blampey, C. Bermond, B. Fléchet, J. Torres

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 645 KB

english, 2007

4

Evolution of Cu microstructure and resistivity during thermal treatment of damascene line: Influence of line width and temperature

V. Carreau, S. Maîtrejean, M. Verdier, Y. Bréchet, A. Roule, A. Toffoli, V. Delaye, G. Passemard

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 719 KB

english, 2007

5

Improved thermal stability of Ni-silicides on Si:C epitaxial layers

V. Machkaoutsan, S. Mertens, M. Bauer, A. Lauwers, K. Verheyden, K. Vanormelingen, P. Verheyen, R. Loo, M. Caymax, S. Jakschik, D. Theodore, P. Absil, S.G. Thomas, E.H.A. Granneman

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 628 KB

english, 2007

6

Comparative study of novel barrier layers in ULSI copper interconnects

Kai Wang, Alton Horsfall, Alan Cuthbertson, Steve Bull, Anthony O’Neill

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 515 KB

english, 2007

7

Hybrid punch through approach to address electroless related integration issues of hybrid CoWP/SiCN barriers

J. Guillan, L.G. Gosset, R. Delsol, E. Ollier, Ph. Brun, E. Petitprez, R. Gras, V. Girault, M. Gall, M. Hauschildt, J. Torres

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 499 KB

english, 2007

8

Characterization of CMOS sub-65 nm metallic contact by laser scattering: Thermal stability of Ni(Si1−xGex)

B. Arrazat, A. Danel, E. Nolot, S. Favier, V. Carron, F. Nemouchi, J.M. Hartmann, G. Rolland, P. Vandelle, O. Kermarrec, Y. Campidelli, S. Descombes

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 522 KB

english, 2007

9

Evaluation of a PECVD advanced barrier (k = 3.7) for 32 nm CMOS technology and below

L.L. Chapelon, E. Petitprez, P. Brun, A. Farcy, J. Torres

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 702 KB

english, 2007

10

Reliability of nickel flip chip bumps with a tin–silver encapsulation on a copper/tin–silver substrate during the bonding process

Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Sang-Su Ha, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 964 KB

english, 2007

11

Platinum chemical mechanical polishing (CMP) characteristics for high density ferroelectric memory applications

Nam-Hoon Kim, Pil-Ju Ko, Seock Koo Kang, Woo-Sun Lee

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 904 KB

english, 2007

12

Silicide pre-clean effects on NiPtSi thermal stability for 65 nm technologies and beyond

Susana Bonnetier, Bruno Imbert, Marco Hopstaken, David Galpin, Romain Gwoziecki, David Barge, Stéphane Zoll, Onder Anilturk, Emmanuel Sicurani, Christian Caillat, Alex Barr, Roberto Gonella, Yannick E

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 279 KB

english, 2007

13

Sidewall restoration of porous ultra low-k dielectrics for sub-45 nm technology nodes

H. Chaabouni, L.L. Chapelon, M. Aimadeddine, J. Vitiello, A. Farcy, R. Delsol, P. Brun, D. Fossati, V. Arnal, T. Chevolleau, O. Joubert, J. Torres

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 676 KB

english, 2007

14

Impact of surface preparation on nickel–platinum alloy silicide phase formation

B. Imbert, C. Guichet, S. Bonnetier, S. Zoll, M. Juhel, M. Hopstaken, P. Clifton, O. Thomas

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 466 KB

english, 2007

15

CoWBP capping barrier layer for sub 90 nm Cu interconnects

R. Ofek Almog, Y. Sverdlov, I. Goldfarb, Y. Shacham-Diamand

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 726 KB

english, 2007

16

Electroless deposition and electrical resistivity of sub-100 nm Cu films on SAMs: State of the art

E. Glickman, A. Inberg, N. Fishelson, Y. Shaham-Diamand

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 450 KB

english, 2007

17

Low temperature RTP for BCB curing

Michel Ouaknine, Igor J. Malik, Masato Odera, Toshikazu Ishigaki, Takeshi Ueda, Takashi Fukada, Woo Sik Yoo, Philippe Soussan, Philippe Muller

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 395 KB

english, 2007

18

Microfabrication-based nanomechanical laboratory for testing the ductility of submicron aluminium films

N. André, M. Coulombier, V. De Longueville, D. Fabrègue, T. Gets, S. Gravier, T. Pardoen, J.-P. Raskin

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 484 KB

english, 2007

19

Creation mechanism of metal depression in sputtering process for aluminum interconnects

Sang-Yong Kim, Kang-Yeon Lee, Dong-You Choi, Nam-Hoon Kim, Woo-Sun Lee, Eui-Goo Chang

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.08 MB

english, 2007

20

Fatigue of damascene copper lines under cyclic electrical loading

S. Moreau, S. Maitrejean, G. Passemard

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 753 KB

english, 2007

21

Dopant segregation in SOI Schottky-barrier MOSFETs

J. Knoch, M. Zhang, S. Feste, S. Mantl

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 412 KB

english, 2007

22

Electromigration characteristics in dual-damascene copper interconnects by difference of via structures

Nam-Hoon Kim, Sang-Yong Kim, Woo-Sun Lee, Eui-Goo Chang

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.76 MB

english, 2007

23

Deposition of CoPtP films from citric electrolyte

O. Berkh, Yu. Rosenberg, Y. Shacham-Diamand, E. Gileadi

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 885 KB

english, 2007

24

Formation of Ni silicide at room temperature studied by laser atom probe tomography: Nucleation and lateral growth

K. Hoummada, D. Mangelinck, E. Cadel, C. Perrin-Pellegrino, D. Blavette, B. Deconihout

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.30 MB

english, 2007

25

Analysis of low temperature RTP needs for IC metallization

Igor J. Malik, Michel Ouaknine, Takashi Fukada, Woo Sik Yoo

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 860 KB

english, 2007

26

Characteristic evaluation of electroless nickel–phosphorus deposits with different phosphorus contents

Jeong-Won Yoon, Jong-Hyun Park, Chang-Chae Shur, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.08 MB

english, 2007

27

Investigation of interfacial reaction between Au–Sn solder and Kovar for hermetic sealing application

Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.44 MB

english, 2007

28

Study of the plasma and cleaning impact on a CoWPB material

D. Rébiscoul, H. Desre, L. Dumas, T. Jagueneau, M.-C. Roure, G. Passemard

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 804 KB

english, 2007

29

Effects of nodule treatment of rolled copper on the mechanical properties of the flexible copper-clad laminate

Chang-Yong Lee, Jae-Hong Lee, Don-Hyun Choi, Hoo-Jeong Lee, Hyoung-Sub Kim, Seung-Boo Jung, Won-Chul Moon

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 985 KB

english, 2007

30

Reliability of adhesive interconnections for application in display module

Jong-Woong Kim, Young-Chul Lee, Dae-Gon Kim, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 489 KB

english, 2007

31

Bonding quality monitoring applying statistical modeling of Scanning White Light Interferometry data

Robert Schäfer, Henri Seppänen, Ivan Kassamakov, Edward Hæggström, Peter Hautpmann

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 513 KB

english, 2007

32

Thermally induced stresses in 3D-IC inter-wafer interconnects: A combined grain-continuum and continuum approach

M.O. Bloomfield, D.N. Bentz, J.-Q. Lu, R.J. Gutmann, T.S. Cale

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 468 KB

english, 2007

33

Manufacturability aspects in low-temperature nickel silicidation: Temperature control and repeatability

P.G. Vermont, X. Pages, E.H.A. Granneman, K. Vanormelingen, K. Verheyden, S. Mertens

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 229 KB

english, 2007

34

Integrated monitoring of ULK dielectrics out-gassing and measurement of pore sealing efficiency by residual gas analysis technique

R. Delsol, L. Chapelon, H. Chaabouni, L. Broussous, M. Schellenberger, A. Ostrovski, P. Normandon

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 205 KB

english, 2007

35

Materials characterization of WNxCy, WNx and WCx films for advanced barriers

H. Volders, Z. Tökei, H. Bender, B. Brijs, R. Caluwaerts, L. Carbonell, T. Conard, C. Drijbooms, A. Franquet, S. Garaud, I. Hoflijk, A. Moussa, F. Sinapi, Y. Travaly, D. Vanhaeren, G. Vereecke, C. Zha

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 621 KB

english, 2007

36

Impact of the Cu-based substrates and catalyst deposition techniques on carbon nanotube growth at low temperature by PECVD

M. Dubosc, S. Casimirius, M.-P. Besland, C. Cardinaud, A. Granier, J.-L. Duvail, A. Gohier, T. Minéa, V. Arnal, J. Torres

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 728 KB

english, 2007

37

A robust k ∼ 2.3 SiCOH low-k film formed by porogen removal with UV-cure

Nathan Kemeling, Kiyohiro Matsushita, Naoto Tsuji, Ken-ichi Kagami, Manabu Kato, Shinya Kaneko, Hessel Sprey, David de Roest, Nobuyoshi Kobayashi

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 310 KB

english, 2007

38

Impact of porous SiOCH on propagation performance measured for narrow interconnects of the 45 nm node

M. Gallitre, B. Blampey, B. Fléchet, A. Farcy, V. Arnal, C. Bermond, T. Lacrevaz, J. Torres

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1005 KB

english, 2007

39

Copper stress migration at narrow metal finger with wide lead

Robin C.J. Wang, K.S. Chang-Liao, A.S. Oates, C.C. Lee, L.D. Chen, C.C. Chiu, Kenneth Wu

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.04 MB

english, 2007

40

Damageless Cu chemical mechanical polishing for porous SiOC/Cu interconnects

Seiichi Kondo, Kouichi Fukaya, Kouji Yamada, Tadakazu Miyazaki, Masahisa Fujita, Daisuke Abe, Shuuji Kunisaki, Taro Enomoto, Shigeru Tominaga

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 632 KB

english, 2007

41

Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation

K. Schulze, S.E. Schulz, T. Gessner

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.79 MB

english, 2007

42

Impact of line-edge roughness on resistance and capacitance of scaled interconnects

M. Stucchi, M. Bamal, K. Maex

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1003 KB

english, 2007

43

An investigation of ultra low-k dielectrics with high thermal stability for integration in memory devices

E. Hong, S. Demuynck, Q.T. Le, M. Baklanov, L. Carbonell, M. Van Hove, H. Meynen

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 501 KB

english, 2007

44

Comparison of the agglomeration behavior of Ag(Al) films and Ag(Au) films

K. Sugawara, M. Kawamura, Y. Abe, K. Sasaki

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 569 KB

english, 2007

45

Surface properties restoration and passivation of high porosity ultra low-k dielectric (k ∼ 2.3) after direct-CMP

F. Sinapi, N. Heylen, Y. Travaly, G. Vereecke, M. Baklanov, E. Kesters, J. Van Hoeymissen, J.L. Hernandèz, G. Beyer, P. Fischer

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 233 KB

english, 2007

46

Stress evolution during Ni–Si compound formation for fully silicided (FUSI) gates

C. Torregiani, C. Van Bockstael, C. Detavernier, C. Lavoie, A. Lauwers, K. Maex, J.A. Kittl

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 367 KB

english, 2007

47

SiGe: An attractive material for post-CMOS processing of MEMS

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.72 MB

english, 2007

48

Roughness improvement of the CoSi2/Si-interface for an application as buried silicide

S. Zimmermann, Q.T. Zhao, H. Höhnemann, M. Wiemer, C. Kaufmann, S. Mantl, V. Dudek, T. Gessner

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 707 KB

english, 2007

49

Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications

C. Zhao, Zs. Tőkei, A. Haider, S. Demuynck

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 479 KB

english, 2007

50

Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method

Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Jin-Ho Joo, Young-Eui Shin, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 961 KB

english, 2007

51

Integration and characterization of gas cluster processing for copper interconnects electromigration improvement

R. Gras, L.G. Gosset, E. Petitprez, V. Girault, M. Hopstaken, S. Jullian, G. Imbert, Y. Le Friec, J. Bienacel, J. Guillan, T. Chevolleau, S. Sherman, M. Tabat, J. Hautala, J. Torres

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.02 MB

english, 2007

52

Thermal stability of NiPt- and Pt-silicide contacts on SiGe source/drain

C. Demeurisse, P. Verheyen, K. Opsomer, C. Vrancken, P. Absil, A. Lauwers

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 445 KB

english, 2007

53

NiSi contact metallization using electroless Ni deposition on Pd-activated self-assembled monolayer (SAM) on p-type Si(1 0 0)

A. Duhin, Y. Sverdlov, I. Torchinsky, Yishay Feldman, Y. Shacham-Diamand

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 603 KB

english, 2007

54

Ni–Pt silicide formation through Ti mediating layers

Paul Besser, Christian Lavoie, Ahmet Ozcan, Conal Murray, Jay Strane, Keith Wong, Michael Gribelyuk, Yun-Yu Wang, Christopher Parks, Jean Jordan-Sweet

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.17 MB

english, 2007

55

Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics

N. Ahner, S.E. Schulz, F. Blaschta, M. Rennau

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 241 KB

english, 2007

56

Conference organization

Youssef H. Travaly

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 73 KB

english, 2007

57

Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill

K. Leaming-Sphabmixay, J. Van Olmen, K.J. Moon, Kris Vanstreels, J. D’Haen, Z. Tokei, S. List, G. Beyer

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 655 KB

english, 2007

58

Preface

Y. Travaly, G.P. Beyer

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 73 KB

english, 2007

59

MAM 2007 Sponsors

Journal:

Microelectronic Engineering

Year:

2007

File:

PDF, 123 KB

2007

60

Seed layer enhancement by electrochemical deposition: The copper seed solution for beyond 45 nm

A. Roule, M. Amuntencei, E. Deronzier, P.H. Haumesser, S. Da Silva, X. Avale, O. Pollet, R. Baskaran, G. Passemard

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 527 KB

english, 2007

61

Porosity and structure evolution of a SiOCH low k material during post-etch cleaning process

L. Broussous, W. Puyrenier, D. Rebiscoul, V. Rouessac, A. Ayral

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 195 KB

english, 2007

62

Inside Front Cover - Editorial Board

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 32 KB

english, 2007

63

Table of Contents

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 102 KB

english, 2007

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