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51

TCAD simulation of current filamentation in adjacent IGBT cells under turn-on and turn-off short circuit condition

Suzuki, Hiroshi, Ciappa, Mauro

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.17 MB

english, 2015

52

[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

Dugal, F., Ciappa, M.

Year:

2015

Language:

english

File:

PDF, 112 KB

english, 2015

53

Virtual reliability assessment of integrated power switches based on multi-domain simulation approach

P. Solomalala, J. Saiz, M. Mermet-Guyennet, A. Castellazzi, M. Ciappa, X. Chauffleur, J.P. Fradin

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.28 MB

english, 2007

54

Novel simulation approach for transient analysis and reliable thermal management of power devices

Castellazzi, A., Ciappa, M.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 821 KB

english, 2008

55

Design and Experimental Characterization of a New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment

Malandruccolo, V, Ciappa, M, Rothleitner, H, Fichtner, W

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 1.05 MB

english, 2011

56

Editorial

Ciappa, Mauro, Cova, Paolo, Meneghesso, Gaudenzio, Iannuzzo, Francesco

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 241 KB

english, 2018

57

Measurement of the transient junction temperature in MOSFET devices under operating conditions

D. Barlini, M. Ciappa, M. Mermet-Guyennet, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 564 KB

english, 2007

58

Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

Dugal, F., Ciappa, M.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.49 MB

english, 2014

59

Multiscale simulation of aluminum thin films for the design of highly-reliable MEMS devices

Haruka Kubo, Mauro Ciappa, Takayuki Masunaga, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 808 KB

english, 2009

60

A Novel Thermomechanics -Based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors

M. Ciappa, F. Carbognani, P. Cova, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 1.27 MB

2002

61

Ensuring the reliability of electron beam crosslinked electric cables by the optimization of the dose depth distribution with Monte Carlo simulation

Mauro Ciappa, Luigi Mangiacapra, Maria Stangoni, Stephan Ott, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 590 KB

english, 2009

62

Experimental characterization of critical high-electric field spots in power semiconductors by planar and scanning collimated alpha sources

Ciappa, Mauro, Pang, Ying, Sun, Chenchen

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.54 MB

english, 2018

63

Modeling secondary electron images for linewidth measurement by critical dimension scanning electron microscopy

Mauro Ciappa, Alexander Koschik, Maurizio Dapor, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.04 MB

english, 2010

64

Robustness test and failure analysis of IGBT modules during turn-off

J. Urresti-Ibañez, A. Castellazzi, M. Piton, J. Rebollo, M. Mermet-Guyennet, M. Ciappa

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 992 KB

english, 2007

65

[IEEE IEEE International Symposium on Power Semiconductor Devices and Integrated Circuits - Cambridge, UK (14-17 April 2003)] ISPSD '03. 2003 IEEE 15th International Symposium on Power Semiconductor Devices and ICs, 2003. Proceedings. - Lifetime modeling of thermomechanics-related failure mechanisms in high power IGBT modules for traction applications

Ciappa, M., Carbognani, F., Fichtner, W.

Year:

2003

Language:

english

File:

PDF, 255 KB

english, 2003

66

Simulation and Experimental Validation of Scanning Capacitance Microscopy Measurements across Low-doped Epitaxial PN-Junction

M. Stangoni, M. Ciappa, M. Buzzo, M. Leicht, W. Fichtner

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 1.54 MB

2002

67

[IEEE 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual - San Jose, CA, USA (10-13 April 2000)] 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059) - Lifetime prediction of IGBT modules for traction applications

Ciappa, M., Fichtner, W.

Year:

2000

Language:

english

File:

PDF, 659 KB

english, 2000

68

Exploring the limits of scanning electron microscopy for the metrology of critical dimensions of photoresist structures in the nanometer range

Ciappa, Mauro, Ilgünsatiroglu, Emre, Illarionov, Alexey Yu.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.16 MB

english, 2014

69

Exact 3D simulation of Scanning Electron Microscopy images of semiconductor devices in the presence of electric and magnetic fields

Ciappa, Mauro, Illarionov, Alexey Yu., Ilgünsatiroglu, Emre

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.42 MB

english, 2014

70

Accurate extraction of the mechanical properties of thin films by nanoindentation for the design of reliable MEMS

Yuji Sasaki, Mauro Ciappa, Takayuki Masunaga, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 672 KB

english, 2010

71

Avoiding misleading artefacts in metallurgical preparation of die attach solder joints in high power modules

Dugal, Franc, Ciappa, Mauro

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.69 MB

english, 2013

72

[IEEE 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Shangri-La's Rasa Sentosa Resort, Singapore (27 June-1July, 2005)] Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Characterization of 2D dopant profiles for the design of proton implanted high-voltage superjunction

Buzzo, M., Ciappa, M., Rub, M., Fichtner, W.

Year:

2005

Language:

english

File:

PDF, 1.46 MB

english, 2005

73

10.1016/s0026-2714(04)00364-6

CIAPPA, M, FICHTNER, W

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 203 KB

english, 2004

74

Accuracy of scanning capacitance microscopy for the delineation of electrical junctions

M. Stangoni, M. Ciappa, W. Fichtner

Year:

2004

Language:

english

File:

PDF, 489 KB

english, 2004

75

[IEEE IGARSS 2015 - 2015 IEEE International Geoscience and Remote Sensing Symposium - Milan, Italy (2015.7.26-2015.7.31)] 2015 IEEE International Geoscience and Remote Sensing Symposium (IGARSS) - Use of COSMO-SkyMed data for innovative and operational applications

Oddone, Axel, Costantini, Mario, Pietranera, Luca, Ciappa, Achille, Grandoni, Domenico, Nicolosi, Paola

Year:

2015

Language:

english

File:

PDF, 771 KB

english, 2015

76

[IEEE IMTC 2001. Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference. Rediscovering Measurement in the Age of Informatics - Budapest, Hungary (21-23 May 2001)] IMTC 2001. Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference. Rediscovering Measurement in the Age of Informatics (Cat. No.01CH 37188) - Modeling the transfer characteristic and harmonic distortion effects in scanning capacitance microscopy measurements

Ciappa, M., Stangoni, M., Ciamplini, L., Malberti, P., Fichtner, W.

Year:

2001

Language:

english

File:

PDF, 583 KB

english, 2001

77

The asymmetric hydrogenation of 1,1,4,4,7-pentamethyl-2-methylen-1,2,3,4-tetrahydro-naphthalene, a viable catalytic approach to the synthesis of non-racemic Fixolide®

Alessandra Ciappa, Alberto Scrivanti, Ugo Matteoli

Journal:

Journal of Molecular Catalysis A: Chemical

Year:

2004

Language:

english

File:

PDF, 72 KB

english, 2004

78

Editorial

Mauro Ciappa, Wolfgang Fichtner

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 203 KB

english, 2004

79

[IEEE 2007 7th Internatonal Conference on Power Electronics (ICPE) - Daegu, South Korea (2007.10.22-2007.10.26)] 2007 7th Internatonal Conference on Power Electronics - Accurate mixed electrical and electromagnetic model of a 6,5kV IGBT module

Batista, E., Dienot, J. M., Mermet-Guyennet, M., Castellazzi, A., Ciappa, M., Fichtner, W.

Year:

2007

Language:

english

File:

PDF, 7.51 MB

english, 2007

80

APOE and APOC1 Promoter Polymorphisms and the Risk of Alzheimer Disease in African American and Caribbean Hispanic Individuals

Tycko, Benjamin, Lee, Joseph H., Ciappa, Alejandra, Saxena, Anjana, Li, Chi-Ming, Feng, Lin, Arriaga, Alex, Stern, Yaakov, Lantigua, Rafael, Shachter, Neil, Mayeux, Richard

Journal:

Archives of Neurology

Year:

2004

Language:

english

File:

PDF, 94 KB

english, 2004

81

Asymmetric catalysis in fragrance chemistry: a new synthetic approach to enantiopure Phenoxanol®, Citralis® and Citralis Nitrile®

Ugo Matteoli, Alessandra Ciappa, Sara Bovo, Matheo Bertoldini, Alberto Scrivanti

Journal:

Tetrahedron: Asymmetry

Year:

2007

Language:

english

File:

PDF, 181 KB

english, 2007

82

The summer upwelling of the Eastern Aegean Sea detected from MODIS SST scenes from 2003 to 2015

Ciappa, Achille Carlo

Journal:

International Journal of Remote Sensing

Year:

2018

Language:

english

File:

PDF, 2.46 MB

english, 2018

83

Reliability investigation of the copper-zinc system for solid diffusion bonding in power modules

Dugal, Franc, Ciappa, Mauro

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.42 MB

english, 2017

84

Preface

A. Birolini, M. Ciappa, E. Wolfgang

Journal:

Microelectronic Engineering

Year:

1994

Language:

english

File:

PDF, 72 KB

english, 1994

85

Observations of the Terra Nova Bay (Antarctica) polynya by MODIS ice surface temperature imagery from 2005 to 2010

Achille Ciappa, Luca Pietranera, Giorgio Budillon

Journal:

Remote Sensing of Environment

Year:

2012

Language:

english

File:

PDF, 1.94 MB

english, 2012

86

A new perspective on oil slick detection from space by NOAA satellites

BORZELLI, G., CIAPPA, A., ULIVIERI, C., ANTONELLI, G., LANEVE, G.

Journal:

International Journal of Remote Sensing

Year:

1996

Language:

english

File:

PDF, 437 KB

english, 1996

87

Variability of the East Greenland Current in Fram Strait From Subdaily COSMO-SkyMed X-SAR Imagery

Ciappa, Achille, Britti, Filippo, Cesarano, Lucio, Gentile, Vittorio, Pietranera, Luca

Journal:

IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing

Year:

2016

Language:

english

File:

PDF, 930 KB

english, 2016

88

A poly-L-lactic acid/ collagen/glycosaminoglycan matrix for tissue engineering applications

Carfì Pavia, F, Ciappa, M, Lepedda, A, Fiorentino, SM, Rigogliuso, S, Brucato, V, Formato, M, Ghersi, G, La Carrubba, V

Journal:

Journal of Cellular Plastics

Year:

2017

Language:

english

File:

PDF, 611 KB

english, 2017

89

3-phase hierarchical graphene-based epoxy nanocomposite laminates for automotive applications

Elmarakbi, Ahmed, Karagiannidis, Panagiotis, Ciappa, Alessandra, Innocente, Franco, Galise, Francesco, Martorana, Brunetto, Bertocchi, Francesco, Cristiano, Francesco, Villaro Ábalos, Elvira, Gómez, J

Journal:

Journal of Materials Science & Technology

Year:

2019

Language:

english

File:

PDF, 1.75 MB

english, 2019

90

Two-dimensional dopant imaging of silicon carbide devices by secondary electron potential contrast

M. Buzzo, M. Ciappa, J. Millan, P. Godignon, W. Fichtner

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 570 KB

english, 2007

91

Detection of singlet oxygen generated by commercial fine art organic pigments by means of a novel, robust chemical probe

Morena Silvestrini, Alessandra Ciappa, Fabrizio Fabris, Giuseppe Borsato, Ottorino De Lucchi

Journal:

Dyes and Pigments

Year:

2012

Language:

english

File:

PDF, 259 KB

english, 2012

92

[IEEE ESSDERC 2007 - 37th European Solid State Device Research Conference - Muenchen, Germany (2007.09.11-2007.09.13)] ESSDERC 2007 - 37th European Solid State Device Research Conference - Electro-thermal model of a high-voltage IGBT module for realistic simulation of power converters

Castellazzi, A., Ciappa, M., Fichtner, W., Batista, E., Dienot, J. M., Mermet-Guyennet, M.

Year:

2007

Language:

english

File:

PDF, 550 KB

english, 2007

93

Extraction of roughness parameters at nanometer scale by Monte Carlo simulation of Critical Dimension Scanning Electron Microscopy

Ciappa, M., Ilgünsatiroglu, E., Illarionov, A.Yu.

Journal:

Solid-State Electronics

Year:

2015

Language:

english

File:

PDF, 1.22 MB

english, 2015

94

[IEEE 2009 IEEE International Geoscience and Remote Sensing Symposium - Cape Town, South Africa (2009.07.12-2009.07.17)] 2009 IEEE International Geoscience and Remote Sensing Symposium - Sea surface transport derived by frequent revisit time series of COSMO SkyMed SAR data

Ciappa, A., Pietranera, L., Coletta, A.

Year:

2009

Language:

english

File:

PDF, 2.47 MB

english, 2009

95

Nanoscale imaging and metrology of devices and innovative materials

Corrado Spinella, Vito Raineri, Wilfried Vandervorst, Mauro Ciappa

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 62 KB

english, 2007

96

[IEEE 2010 IEEE International Symposium on Electrical Insulation (ISEI) - San Diego, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Symposium on Electrical Insulation - Fine tuning of electron beam crosslinking of electrical cables and wires by three-dimensional Monte Carlo modeling

Mangiacapra, Luigi, Ciappa, Mauro, Fichtner, Wolfgang, Stangoni, Maria, Ott, Stephan

Year:

2010

Language:

english

File:

PDF, 1.63 MB

english, 2010

97

[IEEE 2011 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2011.04.10-2011.04.14)] 2011 International Reliability Physics Symposium - In situ screening techniques for defective oxides in devices for automotive applications

Malandruccolo, V., Ciappa, M., Fichtner, W., Rothleitner, H.

Year:

2011

Language:

english

File:

PDF, 609 KB

english, 2011

98

Computational investigation of the accuracy of constant-dC scanning capacitance microscopy for ultra-shallow doping profile characterization

Lorenzo Ciampolini, Mauro Ciappa, Paolo Malberti, Wolfgang Fichtner

Journal:

Solid-State Electronics

Year:

2002

Language:

english

File:

PDF, 178 KB

english, 2002

99

[IEEE Proceedings of 1994 IEEE International Reliability Physics Symposium - San Jose, CA, USA (1994.04.11-1994.04.14)] Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 - Reliability of laser diode modules in temperature-uncontrolled environment

Ciappa, M., Malberti, P.

Year:

1994

Language:

english

File:

PDF, 490 KB

english, 1994

100

[IEEE IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004. - San Francisco, CA, USA (Dec. 13-15, 2004)] IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004. - Experimental extraction of the electron impact-ionization coefficient at large operating temperatures

Reggiani, S., Gnani, E., Rudan, M., Baccarani, G., Corvasce, C., Barlini, D., Ciappa, M., Fichtner, W., Denison, M., Jensen, N., Groos, G., Stecher, M.

Year:

2004

Language:

english

File:

PDF, 209 KB

english, 2004

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